Author Contributions
Conceptualization, B.J.B., D.L.D., J.I.C., C.W., M.A.R., M.C., I.O., C.S., R.A.E., D.A.H., C.M.Y. and E.L.D.M.; methodology, B.J.B., R.P., J.I.C., B.R.; J.-M.L., K.L.R., M.J.C., D.E.J., W.J.T., R.G.S., J.C.M., A.H.L. and B.Y.; software, J.I.C., T.C.H., R.P., K.C.O., M.T.H., E.P. and E.L.; validation, T.C.H., R.P. and J.I.C.; formal analysis, T.C.H., R.P. and J.I.C.; investigation, T.C.H., C.W., G.T.G., K.A.W., P.C., E.P., L.Q.V., K.C.O., B.D., L.H., C.T., M.H. and B.B.; resources, B.J.B., D.E.B., R.R.B. and E.M.G.; data curation, B.J.B., D.L.D., J.I.C., C.W., T.C.H., D.E.B., Y.Z., R.P., B.R., G.T.G., M.J.S. and S.I.; writing—original draft preparation, B.J.B., D.L.D., J.I.C., C.W., T.C.H., D.E.B., Y.Z., R.P., B.R., R.A.E., D.A.H., C.S., G.T.G., M.C. and E.L.; writing—review and editing, B.J.B., D.L.D., J.I.C., C.W., T.C.H., D.E.B., Y.Z., R.P., B.R., R.A.E., D.A.H., C.S., G.T.G., M.C. and E.L.; visualization, B.J.B., D.L.D., J.I.C., C.W., T.C.H., D.E.B., Y.Z., R.P., B.R., R.A.E., D.A.H., C.S., G.T.G., E.L.D.M., M.C. and E.L.; supervision, B.J.B., E.M.G., C.W., Y.Z. and D.E.B.; project administration, B.J.B. and D.E.B.; funding acquisition, B.J.B. All authors have read and agreed to the published version of the manuscript.
Figure 1.
Artist’s rendition of the Mars Sample Return (MSR) campaign’s major components. In the lower left is the Perseverance Mars rover that successfully landed on Mars on 18 February 2021 and is currently acquiring up to 38 samples from the Mars surface and atmosphere. In the lower right is shown the Sample Retrieval Lander (SRL) which delivers to the Martian surface the Sample Transfer Arm and the Mars Ascent Vehicle (MAV) which is shown launching the Orbiting Sample (OS) container into Mars orbit. In the far left one of two SRL helicopters is shown which will be used as backup to retrieve cached sample tubes in case Perseverance experiences a failure prior to the arrival of the SRL. At the top is shown the Earth Return Orbiter (ERO) which will rendezvous with the OS container and capture it using the Capture, Containment and Return System (CCRS) that is included as part of its payload. After successfully capturing and processing the OS for Earth return, the ERO will leave Mars orbit and deliver the samples back to Earth.
Figure 1.
Artist’s rendition of the Mars Sample Return (MSR) campaign’s major components. In the lower left is the Perseverance Mars rover that successfully landed on Mars on 18 February 2021 and is currently acquiring up to 38 samples from the Mars surface and atmosphere. In the lower right is shown the Sample Retrieval Lander (SRL) which delivers to the Martian surface the Sample Transfer Arm and the Mars Ascent Vehicle (MAV) which is shown launching the Orbiting Sample (OS) container into Mars orbit. In the far left one of two SRL helicopters is shown which will be used as backup to retrieve cached sample tubes in case Perseverance experiences a failure prior to the arrival of the SRL. At the top is shown the Earth Return Orbiter (ERO) which will rendezvous with the OS container and capture it using the Capture, Containment and Return System (CCRS) that is included as part of its payload. After successfully capturing and processing the OS for Earth return, the ERO will leave Mars orbit and deliver the samples back to Earth.
Figure 2.
Conceptual computer aided design (CAD) views of the Orbiting Sample (OS) container as it appears in Mars orbit after release from the MAV (Mars Ascent Vehicle) showing an oblique view of the base endcap (left) and the lid endcap (right).
Figure 2.
Conceptual computer aided design (CAD) views of the Orbiting Sample (OS) container as it appears in Mars orbit after release from the MAV (Mars Ascent Vehicle) showing an oblique view of the base endcap (left) and the lid endcap (right).
Figure 3.
Conceptual computer aided design (CAD) views of the ERO (Earth Return Orbiter) Capture, Containment and Return System (CCRS) payload. The coordinate system axes shown in the lower right have their origins offset from the actual (0, 0, 0) vertex for clarity.
Figure 3.
Conceptual computer aided design (CAD) views of the ERO (Earth Return Orbiter) Capture, Containment and Return System (CCRS) payload. The coordinate system axes shown in the lower right have their origins offset from the actual (0, 0, 0) vertex for clarity.
Figure 4.
Simplified internal view of a portion of the CCRS (capture enclosure) showing the location of the vision system with respect to the capture cone (pale green) and the post-capture OS (off white). Brackets mount the two vision system cameras and illumination modules to two different CCRS bulkheads. Views of the OS and apertures for illumination are provided by three portholes in the capture cone cylinder. Each camera has a dedicated porthole while the two illumination modules share one large porthole. The colors (black) shown for the vision system components are true-to-life whereas the colors applied to all the other components are for figure clarity. The orientation mechanism is not shown to make the post-capture OS position clearly visible.
Figure 4.
Simplified internal view of a portion of the CCRS (capture enclosure) showing the location of the vision system with respect to the capture cone (pale green) and the post-capture OS (off white). Brackets mount the two vision system cameras and illumination modules to two different CCRS bulkheads. Views of the OS and apertures for illumination are provided by three portholes in the capture cone cylinder. Each camera has a dedicated porthole while the two illumination modules share one large porthole. The colors (black) shown for the vision system components are true-to-life whereas the colors applied to all the other components are for figure clarity. The orientation mechanism is not shown to make the post-capture OS position clearly visible.
Figure 5.
Electrical block diagram of the vision system camera head.
Figure 5.
Electrical block diagram of the vision system camera head.
Figure 9.
Ray trace model calculations of the detector sampling (top row) and the MTF values corresponding to two cycles across 3 mm (bottom row) at the two extreme depth-of-field planes for the selected vison system cameras. The calculations include optical as well as detector MTF effects. The results indicate that the cameras will have sufficient resolution and contrast to discriminate between features on the OS endcaps.
Figure 9.
Ray trace model calculations of the detector sampling (top row) and the MTF values corresponding to two cycles across 3 mm (bottom row) at the two extreme depth-of-field planes for the selected vison system cameras. The calculations include optical as well as detector MTF effects. The results indicate that the cameras will have sufficient resolution and contrast to discriminate between features on the OS endcaps.
Figure 10.
Image of a previously constructed Malin Space Science Systems (MSSS) ECAM camera that is identical to the CCRS vision system camera design.
Figure 10.
Image of a previously constructed Malin Space Science Systems (MSSS) ECAM camera that is identical to the CCRS vision system camera design.
Figure 11.
Simplified block diagram of the interface between the CCRS avionics assembly and the capture enclosure camera head. The key ground path is shown, including isolation of the camera electronics from chassis ground, which is connected to both the CCRS structure and the internal SpaceWire shields. The SpaceWire strobe signals are not explicitly shown (Acronyms: 1. TSP Twisted, shielded pair; 2. LVPC Low-Voltage Power Converter; 3. RTN Return; 4. JA Jettison Avionics; 5. CCRS Capture, Containment Return System; 6. SpW Spacewire; 7. AD590 Analog Devices 590 Temperature Sensor).
Figure 11.
Simplified block diagram of the interface between the CCRS avionics assembly and the capture enclosure camera head. The key ground path is shown, including isolation of the camera electronics from chassis ground, which is connected to both the CCRS structure and the internal SpaceWire shields. The SpaceWire strobe signals are not explicitly shown (Acronyms: 1. TSP Twisted, shielded pair; 2. LVPC Low-Voltage Power Converter; 3. RTN Return; 4. JA Jettison Avionics; 5. CCRS Capture, Containment Return System; 6. SpW Spacewire; 7. AD590 Analog Devices 590 Temperature Sensor).
Figure 12.
The camera head ground plane connected to a +5 V return through a Ferrite bead and isolated from the chassis ground by 11 MΩ resistance (dual 22 MΩ resistors in parallel). Chassis grounded to the CCRS structure. Chassis connected to SpaceWire outer shield and power inner shield.
Figure 12.
The camera head ground plane connected to a +5 V return through a Ferrite bead and isolated from the chassis ground by 11 MΩ resistance (dual 22 MΩ resistors in parallel). Chassis grounded to the CCRS structure. Chassis connected to SpaceWire outer shield and power inner shield.
Figure 13.
The camera 15-pin Micro-D Socket (M83513/01-BN) pinout shows the chassis ground connected to the power twisted pair harness internal shields; the chassis ground connected to the SpaceWire bundle shield and to strobe input and output twisted pair shields and data output twisted pair shield; data input twisted pair shield left isolated; Pin 3 not connected through harness following Spacewire Type A standard and temperature sensor also not connected through harness.
Figure 13.
The camera 15-pin Micro-D Socket (M83513/01-BN) pinout shows the chassis ground connected to the power twisted pair harness internal shields; the chassis ground connected to the SpaceWire bundle shield and to strobe input and output twisted pair shields and data output twisted pair shield; data input twisted pair shield left isolated; Pin 3 not connected through harness following Spacewire Type A standard and temperature sensor also not connected through harness.
Figure 14.
LED variation of voltage with temperature from −70 °C to 65 °C at a constant current of 300 mA for LXZ1-4070 LED manufactured by Lumileds (San Jose, CA, USA).
Figure 14.
LED variation of voltage with temperature from −70 °C to 65 °C at a constant current of 300 mA for LXZ1-4070 LED manufactured by Lumileds (San Jose, CA, USA).
Figure 15.
Changes in LED illuminance with current sweeps ranging from 10 mA to either 500 mA or 1000 mA across a temperature range from −70 °C to +65 °C.
Figure 15.
Changes in LED illuminance with current sweeps ranging from 10 mA to either 500 mA or 1000 mA across a temperature range from −70 °C to +65 °C.
Figure 16.
Variation of LED light efficiency versus current at 55 °C for the least efficient LED among the six LEDs tested. This represents a worst-case scenario estimation of light power, thereby providing insight into the maximum potential thermal dissipation for our illumination system.
Figure 16.
Variation of LED light efficiency versus current at 55 °C for the least efficient LED among the six LEDs tested. This represents a worst-case scenario estimation of light power, thereby providing insight into the maximum potential thermal dissipation for our illumination system.
Figure 17.
Pre- and post-radiation test optical characterization for LEDs exposed to various radiation dosages. No discernible changes were observed in the measured LED illumination patterns (a). The illuminance percent change data (b) indicate that optical degradation due to radiation exposure was within the measurement noise—not exceeding 3% even under the most pessimistic assumptions.
Figure 17.
Pre- and post-radiation test optical characterization for LEDs exposed to various radiation dosages. No discernible changes were observed in the measured LED illumination patterns (a). The illuminance percent change data (b) indicate that optical degradation due to radiation exposure was within the measurement noise—not exceeding 3% even under the most pessimistic assumptions.
Figure 18.
Electrical diagram for a single illumination module, constructed from two independent circuits. Each circuit contains seven LEDs (LXZ1-4070) and three resistors (2010 size, 800 mW Power Rating, sourced from Vishay Intertechnology).
Figure 18.
Electrical diagram for a single illumination module, constructed from two independent circuits. Each circuit contains seven LEDs (LXZ1-4070) and three resistors (2010 size, 800 mW Power Rating, sourced from Vishay Intertechnology).
Figure 19.
Front and back surfaces of the illumination system PCB design.
Figure 19.
Front and back surfaces of the illumination system PCB design.
Figure 20.
Illustration of the illumination module illumination areas over which the illuminance and uniformity requirements are to be met to ensure visibility of the OS endcaps (bottom). The illumination module baffle was designed using the near requirement area (located 677 mm away from the LED emission area) due to its being the most constraining. An oversized rectangle surrounding the 14 LEDs was used to represent the LED emission area in the design. Additional clearance to the LED emission area was added to one side of the rectangle to eliminate mechanical interference between one of the illumination modules’ baffle petals and the CCRS capture cone.
Figure 20.
Illustration of the illumination module illumination areas over which the illuminance and uniformity requirements are to be met to ensure visibility of the OS endcaps (bottom). The illumination module baffle was designed using the near requirement area (located 677 mm away from the LED emission area) due to its being the most constraining. An oversized rectangle surrounding the 14 LEDs was used to represent the LED emission area in the design. Additional clearance to the LED emission area was added to one side of the rectangle to eliminate mechanical interference between one of the illumination modules’ baffle petals and the CCRS capture cone.
Figure 21.
Illumination module baffle designs for the −Z (left) and +Z (right) illumination modules that maximize the light uniformity in the required illumination areas but minimize the light that strikes other areas. Dimensions indicate the distances between the LED emission plane and the baffle aperture minima and maxima dimensions.
Figure 21.
Illumination module baffle designs for the −Z (left) and +Z (right) illumination modules that maximize the light uniformity in the required illumination areas but minimize the light that strikes other areas. Dimensions indicate the distances between the LED emission plane and the baffle aperture minima and maxima dimensions.
Figure 22.
Mechanical design with coating specifications, showing two unique baffle designs and one common base design for each module.
Figure 22.
Mechanical design with coating specifications, showing two unique baffle designs and one common base design for each module.
Figure 23.
Overall dimensions of the illumination modules.
Figure 23.
Overall dimensions of the illumination modules.
Figure 24.
Thermal model simulation results showing the LED junction and resistor temperatures meet the component specifications with margin.
Figure 24.
Thermal model simulation results showing the LED junction and resistor temperatures meet the component specifications with margin.
Figure 25.
Graphical representation of the EDU illumination module thermal vacuum test temperature profile. Section A is the initial ambient condition. Section B is the ramp up to the hot survival temperature. Section C is the hot survival test. Sections D and E are the hot operational and ramp-down operational tests. Section F is the cold survivability test. Sections G and H are the cold operational and ramp-up tests and Section I is the final ambient test condition.
Figure 25.
Graphical representation of the EDU illumination module thermal vacuum test temperature profile. Section A is the initial ambient condition. Section B is the ramp up to the hot survival temperature. Section C is the hot survival test. Sections D and E are the hot operational and ramp-down operational tests. Section F is the cold survivability test. Sections G and H are the cold operational and ramp-up tests and Section I is the final ambient test condition.
Figure 26.
EDU illumination module thermal vacuum test set-up prior to chamber door closure. Six test articles are visible with views of the PCBs looking along the baffle interiors.
Figure 26.
EDU illumination module thermal vacuum test set-up prior to chamber door closure. Six test articles are visible with views of the PCBs looking along the baffle interiors.
Figure 27.
EDU illumination module vibration test arrangement. This set up allowed two illumination modules to be tested at the same time.
Figure 27.
EDU illumination module vibration test arrangement. This set up allowed two illumination modules to be tested at the same time.
Figure 28.
Illustration of the changes made to the initial illumination module design based on the lessons learned from the EDU fabrication and test activities.
Figure 28.
Illustration of the changes made to the initial illumination module design based on the lessons learned from the EDU fabrication and test activities.
Figure 29.
Image of two of the EDU illumination modules constructed from the flight model design. Although the −Z module (left) and the +Z module (right) baffles appear to be mirror copies, they are not exact mirror matches due to the use of a common module base. The small hole visible near the PCB in each module is for EDU test instrumentation and will not be present in the flight models (Photo Credit: Katherine M. Mellos).
Figure 29.
Image of two of the EDU illumination modules constructed from the flight model design. Although the −Z module (left) and the +Z module (right) baffles appear to be mirror copies, they are not exact mirror matches due to the use of a common module base. The small hole visible near the PCB in each module is for EDU test instrumentation and will not be present in the flight models (Photo Credit: Katherine M. Mellos).
Figure 30.
Illustration of the EDU illumination module optical test set-up. The diagram on the left shows the alignment approach used to minimize the tip/tilt between the illumination module LED emission plane surface normal and the optical measurement plane. The diagram on the right shows the optical test dimensions. Note the test distance is 1 mm different from the distance originally used to design the baffle due to late changes in the illumination module design and CCRS accommodations.
Figure 30.
Illustration of the EDU illumination module optical test set-up. The diagram on the left shows the alignment approach used to minimize the tip/tilt between the illumination module LED emission plane surface normal and the optical measurement plane. The diagram on the right shows the optical test dimensions. Note the test distance is 1 mm different from the distance originally used to design the baffle due to late changes in the illumination module design and CCRS accommodations.
Figure 31.
EDU illumination module optical test results at both the near (left) and far (right) evaluation planes for the two +Z illumination modules and two −Z illumination modules. In all eight cases, the maximum and minimum illuminance requirements are met over the required area (red circle). The illuminance variation requirement is also met over most of the required area (red circle) for all eight EDU modules except for areas ~5 mm × 12 mm in size near the edge of the requirement zone where the variation is 5% or more. A subsequent investigation has found that this non-compliance was mistakenly designed into the baffles due to a misunderstanding of the SolidWorks “Lofted Cut” feature. Note that the low-level periodic variation running left to right in the illuminance uniformity results are not present in the optical patterns but are caused by periodic noise in the photometer.
Figure 31.
EDU illumination module optical test results at both the near (left) and far (right) evaluation planes for the two +Z illumination modules and two −Z illumination modules. In all eight cases, the maximum and minimum illuminance requirements are met over the required area (red circle). The illuminance variation requirement is also met over most of the required area (red circle) for all eight EDU modules except for areas ~5 mm × 12 mm in size near the edge of the requirement zone where the variation is 5% or more. A subsequent investigation has found that this non-compliance was mistakenly designed into the baffles due to a misunderstanding of the SolidWorks “Lofted Cut” feature. Note that the low-level periodic variation running left to right in the illuminance uniformity results are not present in the optical patterns but are caused by periodic noise in the photometer.
Figure 32.
EDU illuminance results over the required area (red circle) when the primary 7 LEDs in each illumination module are powered on (
left) and all 14 LEDs in each illumination module are powered on (
right). With 7 LEDs in each illumination module powered on, the illuminance doubles when compared to only one module being powered on (see
Figure 31). With 14 LEDs in each illumination module powered on, the illuminance doubles when compared to 7 LEDs being powered in each illumination module. For the case with all LEDs powered on, the small areas at the near plane where the illuminance uniformity is >5% appear on both sides of the required area while the individual areas of non-uniformity shrink. Although the nominal vision system operations concept assumes only 7 LEDs in each illumination module are powered on, for operational efficiency the CCRS operations concept currently assumes all LEDs (28) will be powered on during imaging.
Figure 32.
EDU illuminance results over the required area (red circle) when the primary 7 LEDs in each illumination module are powered on (
left) and all 14 LEDs in each illumination module are powered on (
right). With 7 LEDs in each illumination module powered on, the illuminance doubles when compared to only one module being powered on (see
Figure 31). With 14 LEDs in each illumination module powered on, the illuminance doubles when compared to 7 LEDs being powered in each illumination module. For the case with all LEDs powered on, the small areas at the near plane where the illuminance uniformity is >5% appear on both sides of the required area while the individual areas of non-uniformity shrink. Although the nominal vision system operations concept assumes only 7 LEDs in each illumination module are powered on, for operational efficiency the CCRS operations concept currently assumes all LEDs (28) will be powered on during imaging.
Figure 33.
BRDF measurements of CCRS surface treatments relevant to the vision system at 440 nm (left column), 550 nm (middle column) and 700 nm (right column) for (a) Ceranovis pre-friction test, (b) Ceranovis post-friction test, (c) aluminum 6061 with Teflon coating and (d) aluminum 7075 with Teflon coating.
Figure 33.
BRDF measurements of CCRS surface treatments relevant to the vision system at 440 nm (left column), 550 nm (middle column) and 700 nm (right column) for (a) Ceranovis pre-friction test, (b) Ceranovis post-friction test, (c) aluminum 6061 with Teflon coating and (d) aluminum 7075 with Teflon coating.
Figure 34.
Vison system surface treatment BRDF measurements of (a) 3D-printed material at 440 nm (left), 550 nm (center) and 700 nm (right) for the OS endcap surrogates, (b) 550 nm measurements of bead-blasted aluminum with clear anodize at 20 psi (left), 30 psi (center) and 40 psi (right), (c) 30 psi bead-blasted aluminum with clear anodize at 440 nm (left), 550 nm (center) and 700 nm (right) and (d) black anodized aluminum at 440 nm (left), 550 nm (center) and 700 nm (right).
Figure 34.
Vison system surface treatment BRDF measurements of (a) 3D-printed material at 440 nm (left), 550 nm (center) and 700 nm (right) for the OS endcap surrogates, (b) 550 nm measurements of bead-blasted aluminum with clear anodize at 20 psi (left), 30 psi (center) and 40 psi (right), (c) 30 psi bead-blasted aluminum with clear anodize at 440 nm (left), 550 nm (center) and 700 nm (right) and (d) black anodized aluminum at 440 nm (left), 550 nm (center) and 700 nm (right).
Figure 35.
Vision system laboratory testbed utilizing commercially available off-the-shelf (COTS) cameras, engineering development unit (EDU) illumination modules and 3D-printed representations of the CCRS capture cone, orientation mechanism and both OS container endcaps (Photo Credit: Katherine M. Mellos).
Figure 35.
Vision system laboratory testbed utilizing commercially available off-the-shelf (COTS) cameras, engineering development unit (EDU) illumination modules and 3D-printed representations of the CCRS capture cone, orientation mechanism and both OS container endcaps (Photo Credit: Katherine M. Mellos).
Figure 36.
MTF of the lab testbed lens (orange), the flight camera lens (blue) and the minimum allowable vision system camera optics (red).
Figure 36.
MTF of the lab testbed lens (orange), the flight camera lens (blue) and the minimum allowable vision system camera optics (red).
Figure 37.
BRDF comparison for a variety of incidence angles (AOI) of the two laboratory testbed OS surface finishes (3D resin and 3D metallic paint) to the two OS surface finishes (CN145 Li-Doped and Req. limit) used in the non-sequential ray trace model. The 3D resin (a) represents the current OS surface finish in the testbed and matches well to the Ceranovis BRDF modeled in the non-sequential model except for the specular peak caused via friction testing. The metallic paint (b) represents the worst-case OS surface finish currently allowed by OS requirements. It agrees well with the OS BRDF requirement limit, particularly near the specular peaks.
Figure 37.
BRDF comparison for a variety of incidence angles (AOI) of the two laboratory testbed OS surface finishes (3D resin and 3D metallic paint) to the two OS surface finishes (CN145 Li-Doped and Req. limit) used in the non-sequential ray trace model. The 3D resin (a) represents the current OS surface finish in the testbed and matches well to the Ceranovis BRDF modeled in the non-sequential model except for the specular peak caused via friction testing. The metallic paint (b) represents the worst-case OS surface finish currently allowed by OS requirements. It agrees well with the OS BRDF requirement limit, particularly near the specular peaks.
Figure 38.
System-level images from the −Z camera position in the laboratory testbed, showing the vision system baseline performance for the lab surrogate of the current OS surface finish. The right column shows the same images reporting calibrated luminance values. Red indicates the areas in the image below the 7.8 candela/m2 OS luminance requirement. No areas on the OS are below the luminance requirement.
Figure 38.
System-level images from the −Z camera position in the laboratory testbed, showing the vision system baseline performance for the lab surrogate of the current OS surface finish. The right column shows the same images reporting calibrated luminance values. Red indicates the areas in the image below the 7.8 candela/m2 OS luminance requirement. No areas on the OS are below the luminance requirement.
Figure 39.
System-level images from the −Z camera position laboratory testbed, showing the baseline vision system performance for an OS with the most specularly reflective surface finish allowed by requirements. The right column shows the same images reporting calibrated luminance values. Red indicates the areas in the image below the 7.8 candela/m2 OS luminance requirement. Except for a few small points, the majority of the OS surface meets the luminance requirement.
Figure 39.
System-level images from the −Z camera position laboratory testbed, showing the baseline vision system performance for an OS with the most specularly reflective surface finish allowed by requirements. The right column shows the same images reporting calibrated luminance values. Red indicates the areas in the image below the 7.8 candela/m2 OS luminance requirement. Except for a few small points, the majority of the OS surface meets the luminance requirement.
Figure 40.
FRED BRDF model fit at various angles of incidence (AOI) to the measured data for the Ceranovis-145 with Li-Doped sealant after going through surface friction testing.
Figure 40.
FRED BRDF model fit at various angles of incidence (AOI) to the measured data for the Ceranovis-145 with Li-Doped sealant after going through surface friction testing.
Figure 41.
View of the CCRS vision system non-sequential ray trace model components. It includes both cameras, both illumination modules, the capture cone with porthole strengthening members, the major portions of the orientation mechanism and the OS.
Figure 41.
View of the CCRS vision system non-sequential ray trace model components. It includes both cameras, both illumination modules, the capture cone with porthole strengthening members, the major portions of the orientation mechanism and the OS.
Figure 42.
View of the CCRS vision system non-sequential ray trace model components looking from the capture side along the CCRS Y-axis. Viewable items include both cameras, both illumination modules, the capture cone interior, one OS endcap and small portions of the orientation mechanism.
Figure 42.
View of the CCRS vision system non-sequential ray trace model components looking from the capture side along the CCRS Y-axis. Viewable items include both cameras, both illumination modules, the capture cone interior, one OS endcap and small portions of the orientation mechanism.
Figure 43.
Comparison of the OS base luminance results from the laboratory measurements and the FRED non-sequential ray trace model prediction. Agreement between the two results is typically ~10%, consistent with our photometer calibration uncertainty and our ability to measure and model the OS BRDF. Luminance values shown in the table above are region averages calculated within square windows equivalent to a 28 × 28 pixel area on the flight vision system camera detector.
Figure 43.
Comparison of the OS base luminance results from the laboratory measurements and the FRED non-sequential ray trace model prediction. Agreement between the two results is typically ~10%, consistent with our photometer calibration uncertainty and our ability to measure and model the OS BRDF. Luminance values shown in the table above are region averages calculated within square windows equivalent to a 28 × 28 pixel area on the flight vision system camera detector.
Figure 44.
Four nominal vision system imaging performance predictions for the OS lid (top row) and OS base (bottom row) based on the laboratory testbed results for the +Z camera (left column) and −Z camera (right column) with the primary LED circuits in both illumination modules providing illumination.
Figure 44.
Four nominal vision system imaging performance predictions for the OS lid (top row) and OS base (bottom row) based on the laboratory testbed results for the +Z camera (left column) and −Z camera (right column) with the primary LED circuits in both illumination modules providing illumination.
Figure 45.
Eight nominal vision system performance predictions for the OS lid (top row) and OS base (bottom row) based on non-sequential ray trace modeling in FRED. Left to right: +Z camera, primary circuit LEDs; +Z camera, redundant circuit LEDs; −Z camera, primary circuit LEDs and −Z camera, redundant circuit LEDs.
Figure 45.
Eight nominal vision system performance predictions for the OS lid (top row) and OS base (bottom row) based on non-sequential ray trace modeling in FRED. Left to right: +Z camera, primary circuit LEDs; +Z camera, redundant circuit LEDs; −Z camera, primary circuit LEDs and −Z camera, redundant circuit LEDs.
Figure 46.
Eight worst-case vision system performance predictions for the OS lid (top row) and OS base (bottom row) based on non-sequential ray trace modeling in FRED. The worst-case lens contamination; OS surface treatment; OS position and orientation; lens performance and detector noise are added to the nominal conditions to create the images. Left to right: +Z camera, primary circuit LEDs; +Z camera, redundant circuit LEDs; −Z camera, primary circuit LEDs; −Z camera, redundant circuit LEDs.
Figure 46.
Eight worst-case vision system performance predictions for the OS lid (top row) and OS base (bottom row) based on non-sequential ray trace modeling in FRED. The worst-case lens contamination; OS surface treatment; OS position and orientation; lens performance and detector noise are added to the nominal conditions to create the images. Left to right: +Z camera, primary circuit LEDs; +Z camera, redundant circuit LEDs; −Z camera, primary circuit LEDs; −Z camera, redundant circuit LEDs.
Figure 47.
Four nominal vision system performance predictions for the OS lid (top row) and OS base (bottom row) based on non-sequential ray trace modeling in FRED when all 28 vision system LEDs are powered on. +Z camera images are shown in the left column. −Z camera images are shown in the right column.
Figure 47.
Four nominal vision system performance predictions for the OS lid (top row) and OS base (bottom row) based on non-sequential ray trace modeling in FRED when all 28 vision system LEDs are powered on. +Z camera images are shown in the left column. −Z camera images are shown in the right column.
Figure 48.
The receiver operating characteristic (ROC) curves for the trained fully connected network (FCN) and convolutional neural network (CNN) models, which illustrates the false positive rate at different decision thresholds. ROC curves that stay close to the top left corner indicate better performance while the dashed line corresponds to random (50/50) classification.
Figure 48.
The receiver operating characteristic (ROC) curves for the trained fully connected network (FCN) and convolutional neural network (CNN) models, which illustrates the false positive rate at different decision thresholds. ROC curves that stay close to the top left corner indicate better performance while the dashed line corresponds to random (50/50) classification.
Figure 49.
Examples of misidentified images and the corresponding probabilities calculated by each neural network model for a decision (identification) threshold set to p > 0.5. (Left) A random sample of 9 test images from the 38 that were misidentified via the FCN model. Several images that are easily identified by humans are confidently assigned the incorrect label via the model; for example, the bottom middle image is identified as a base endcap with an 89% probability. (Right) The three test images that were misidentified via the CNN model. These would also be challenging for a human observer to identify.
Figure 49.
Examples of misidentified images and the corresponding probabilities calculated by each neural network model for a decision (identification) threshold set to p > 0.5. (Left) A random sample of 9 test images from the 38 that were misidentified via the FCN model. Several images that are easily identified by humans are confidently assigned the incorrect label via the model; for example, the bottom middle image is identified as a base endcap with an 89% probability. (Right) The three test images that were misidentified via the CNN model. These would also be challenging for a human observer to identify.
Figure 50.
The impact of increasing Gaussian blur widths on the confidence of the CNN model. Different levels of blurring were applied to an image of the lid endcap, which is outlined in green on the rightmost panel. All units are in image space. (Left) Probabilities generated via the CNN for different Gaussian convolution kernel widths. Images that fall below the decision threshold of 0.5 are colored pink. Bluer points correspond to a higher confidence in identification. (Middle top) The Gaussian convolution kernels, which are effectively PSFs, next to the expected PSF of the vision system cameras (labeled “Malin PSF”). The curves are color-coded to match the points—or probabilities—shown to the left. (Middle bottom) The MTF for each of the blurring cases, which are the modulus of the Fourier transform of the PSFs. (Right) Five levels of blurring applied to the images of the lid and the base. The top row corresponds to the nominal vision system camera PSF.
Figure 50.
The impact of increasing Gaussian blur widths on the confidence of the CNN model. Different levels of blurring were applied to an image of the lid endcap, which is outlined in green on the rightmost panel. All units are in image space. (Left) Probabilities generated via the CNN for different Gaussian convolution kernel widths. Images that fall below the decision threshold of 0.5 are colored pink. Bluer points correspond to a higher confidence in identification. (Middle top) The Gaussian convolution kernels, which are effectively PSFs, next to the expected PSF of the vision system cameras (labeled “Malin PSF”). The curves are color-coded to match the points—or probabilities—shown to the left. (Middle bottom) The MTF for each of the blurring cases, which are the modulus of the Fourier transform of the PSFs. (Right) Five levels of blurring applied to the images of the lid and the base. The top row corresponds to the nominal vision system camera PSF.
Figure 51.
Summary of the vision system camera PCB pre-population inspection process.
Figure 51.
Summary of the vision system camera PCB pre-population inspection process.
Figure 52.
Summary flow diagram of the illumination system printed circuit board (PCB) flight screening and illumination module qualification plans.
Figure 52.
Summary flow diagram of the illumination system printed circuit board (PCB) flight screening and illumination module qualification plans.
Table 1.
Summary of the key CCRS-to-vision-system interface values. Values in brackets represent the maximum allowed while other values shown are the current best estimate (CBE).
Table 1.
Summary of the key CCRS-to-vision-system interface values. Values in brackets represent the maximum allowed while other values shown are the current best estimate (CBE).
Key CCRS Vision System Interface Values—CBE [Max Budget] |
---|
Metric | Camera (Each) | Illumination Module (Each) |
---|
Mass (kg) | 0.5 [0.525] without cable | 0.075 [0.115] without flying leads |
Volume (mm) | 100 (dia) by 120 (height) | Base 62 × 38 × 18 (height) Baffle Ø36 × 36 (height) |
Distance (mm) mounting plane to OS endcap | 589.44 | 723.56 |
Angle (deg) boresight to OS centerline | 38.0 | 26.5 |
Data Interface | SpaceWire | N/A |
Power (W) | 2.0 [2.5] | 6.35 [7.0] |
Supplied Bus Voltage (V) | 5 (unswitched) | 28 (switched) |
Supplied Max Bus Current (amps) | [1.0] | [0.5] |
Survival Temp Range (°C) | −50 to +70 | −40 to +55 |
Operating Temp Range (°C) | −30 to +40 | −30 to +45 |
Turn-on Temp Range (°C) | −40 to +55 | −40 to +55 |
Thermal Dissipation (W) | 1.25 on, not imaging [2.0] | [5.0] both strings |
Table 2.
Summary of the key CCRS vision system cameras’ parameters.
Table 2.
Summary of the key CCRS vision system cameras’ parameters.
Parameter | Value |
---|
Effective Focal Length (mm) | 7.1 |
F/# | 3.5 |
Best Focus Distance from First Lens Surface (mm) | 493 |
Pixel Spacing (μm) | 2.2 |
Pixel Scale/IFOV (mrad/pixel) | 0.31 |
FOV (°) | 45.6 (H) × 34.3 (V) |
Entrance Pupil Diameter (mm) | 2.0 |
Optical Transmission (%) | >80% |
Optical Distortion (%) | <8% |
Detector Type | CMOS |
Detector | ON Semiconductor MT9P031 |
Array Size | 2592 × 1944 image area (2752 × 2004 total) |
Camera Head Power (W) | 1.5 standby, 2.0 per camera |
Maximum Frame Rate (FPS) | 1 |
Quantization (bits/pixel) | 12 |
Read Noise (e-) | 7 |
Minimum Exposure Durations (ms) | 0.1528 12-bit mode, 0.0764 8-bit mode |
Maximum Exposure Duration (s) | 30.7675 |
Full Well (e-) | 5400 |
Data Interface (100 MHz output) | SpaceWire |
Mass (kg) | 0.5 |
Volume Allocation (mm) | 120 (long) × 100 (diameter) |
Power (W) | 2 |
Table 3.
Radiated emissions, electric field, on-orbit, receiver notches planned for the capture enclosure camera prior to hardware delivery. The X-band test was recently added with the specific test parameters still to be determined (TBD) or revised (TBR) by the CCRS project.
Table 3.
Radiated emissions, electric field, on-orbit, receiver notches planned for the capture enclosure camera prior to hardware delivery. The X-band test was recently added with the specific test parameters still to be determined (TBD) or revised (TBR) by the CCRS project.
Radiated Emission, On-Orbit, Receiver Notches |
---|
Receiver | Frequency Range (MHz) | Electric Field (dBµV/m) | Measurement Bandwidth |
---|
ELECTRA Channel 0 | 401.585625 ± 2 | −5 | 100 Hz |
401.585625 ± 0.1 | −10 | 100 Hz |
ELECTRA Channel 1 | 404.4 ± 2 | −5 | 100 Hz |
404.4 ± 0.1 | −10 | 100 Hz |
ELECTRA Channel 2 | 391 ± 2 | −5 | 100 Hz |
391 ± 0.1 | −10 | 100 Hz |
ELECTRA Channel 3 | 392 ± 2 | −5 | 100 Hz |
392 ± 0.1 | −10 | 100 Hz |
X-Band | 7145–7190 | −26 (TBR) | TBD |
Table 4.
Summary of the key illumination system requirements.
Table 4.
Summary of the key illumination system requirements.
Description | Requirement | Required Value |
---|
Illuminance | At two specified planes, near and far planes, over a specified area | 50 to 750 lux per module |
Illumination Uniformity | Luminance variation over defined local Illumination zones | <5% over a 10mm diameter zone |
Electrical | Operating voltage range and power consumption | 25.7 to 28.2 V <7 W |
Maximum derated operating current (75% derating) | 375 mA |
Thermal | Survival temp (protoflight qualification) | −40° to 55 °C |
Operation temp (allowable flight temp) | −30° to 45 °C |
Maximum derated LED junction temp | 95 °C (after 40 °C derating) |
Maximum thermal dissipation per module | 5 W |
Mass | Maximum mass per module | 100 g |
Stiffness | Minimum frequency | 100 Hz |
Table 5.
Radiation dosage exposures for individual test PCBs. The control PCBs, unexposed to radiation, were evaluated at the same intervals as the test PCBs to account for systematic variables, including environmental temperature variation and measurement repeatability. This ensures accurate comparison between irradiated and unirradiated conditions.
Table 5.
Radiation dosage exposures for individual test PCBs. The control PCBs, unexposed to radiation, were evaluated at the same intervals as the test PCBs to account for systematic variables, including environmental temperature variation and measurement repeatability. This ensures accurate comparison between irradiated and unirradiated conditions.
| Radiation Test Dosage Summary (DDD = Displacement Damage Dose; TID = Total Ionizing Dose) |
---|
PCB No. | Round 0 DDD (InGaN) [MeV/g]; 64 MeV Proton Eq. Fluence [cm−2]; TID (Si) [krad(Si)]; DDD (Si) [MeV/g] | Round 1 DDD (InGaN) [MeV/g]; 64 MeV Proton Eq. Fluence [cm−2]; TID (Si) [krad(Si)]; DDD (Si) [MeV/g] | Round 2 DDD (InGaN) [MeV/g]; 64 MeV Proton Eq. Fluence [cm−2]; TID (Si) [krad(Si)]; DDD (Si) [MeV/g] | Round 3 DDD (InGaN) [MeV/g]; 64 MeV Proton Eq. Fluence [cm−2]; TID (Si) [krad(Si)]; DDD (Si) [MeV/g] | Round 4 DDD (InGaN) [MeV/g]; 64 MeV Proton Eq. Fluence [cm−2]; TID (Si) [krad(Si)]; DDD (Si) [MeV/g] |
---|
SN005 | 0 | 0 | 0 | 0 | 0 |
0 | 0 | 0 | 0 | 0 |
0 | 0 | 0 | 0 | 0 |
0 | 0 | 0 | 0 | 0 |
SN004 | 0 | 7.16 × 107 | 1.43 × 108 | 2.87 × 108 | n/a |
0 | 2.10 × 1010 | 4.20 × 1010 | 8.39 × 1010 | n/a |
0 | 2.8 | 5.5 | 11.0 | n/a |
0 | 8.13 × 107 | 1.63 × 108 | 3.25 × 108 | n/a |
SN021 | 0 | 1.43 × 108 | 2.87 × 108 | 5.73 × 108 | n/a |
0 | 4.20 × 1010 | 8.39 × 1010 | 1.68 × 1011 | n/a |
0 | 5.5 | 11.0 | 22.0 | n/a |
0 | 1.63 × 108 | 3.25 × 108 | 6.51 × 108 | n/a |
SN002 | 0 | 0 | 0 | 0 | 0 |
0 | 0 | 0 | 0 | 0 |
0 | 0 | 0 | 0 | 0 |
0 | 0 | 0 | 0 | 0 |
SN010 | 0 | 1.43 × 108 | 2.87 × 108 | 5.73 × 108 | 7.95 × 108 |
0 | 4.20 × 1010 | 8.39 × 1010 | 1.68 × 1011 | 2.33 × 1011 |
0 | 5.5 | 11.0 | 22.0 | 30.5 |
0 | 1.63 × 108 | 3.25 × 108 | 6.51 × 108 | 9.03 × 108 |
SN025 | 0 | 2.87 × 108 | 5.73 × 108 | 7.95 × 108 | 1.59 × 109 |
0 | 8.39 × 1010 | 1.68 × 1011 | 2.33 × 1011 | 4.66 × 1011 |
0 | 11.0 | 22.0 | 30.5 | 61.1 |
0 | 3.25 × 108 | 6.51 × 108 | 9.03 × 108 | 1.81 × 109 |
Table 6.
Summary of the MSR and CCRS material whose surface scattering characteristics were measured.
Table 6.
Summary of the MSR and CCRS material whose surface scattering characteristics were measured.
Coating | Coupon Description | Relevant MSR CCRS Component |
---|
Ceranovis CN-V14, No Sealant | 60 mm × 60 mm, 50 µm coating thickness, 1.5 mm Ti-6Al-4V substrate, pre-friction testing | Potential OS endcap surface finish |
Ceranovis CN-V14 Li-doped Sealant | 60 mm × 60 mm, 50 µm coating thickness, 1.5 mm Ti-6Al-4V substrate, pre-friction testing | Nominal OS endcap surface finish |
Ceranovis CN-V14 Sealant | 60 mm × 60 mm, 50 µm coating thickness, 1.5 mm Ti-6Al-4V substrate, pre-friction testing | Potential OS endcap surface finish |
Ceranovis CN-V14, No Sealant | 60 mm × 60 mm, 50 µm coating thickness, 1.5 mm Ti-6Al-4V substrate, post-friction testing | Potential OS endcap surface finish after CCRS capture |
Ceranovis CN-V14 Li-doped Sealant | 60 mm × 60 mm, 50 µm coating thickness, 1.5 mm Ti-6Al-4V substrate, post-friction testing | Nominal OS endcap surface finish after CCRS capture |
Ceranovis CN-V14 Sealant | 60 mm × 60 mm, 50 µm coating thickness, 1.5 mm Ti-6Al-4V substrate, post-friction testing | Potential OS endcap surface finish after CCRS capture |
20 psi Bead-blasted Aluminum with Clear Anodize | 60 mm × 60 mm, aluminum 6061-T6 | Potential illumination module baffle interior coating |
30 psi Bead-blasted Aluminum with Clear Anodize | 60 mm × 60 mm, aluminum 6061-T6 | Nominal illumination module baffle interior coating |
40 psi Bead-blasted Aluminum with Clear Anodize | 60 mm × 60 mm, aluminum 6061-T6 | Potential illumination module baffle interior coating |
Final EDU Baffle Interior | 60 mm × 60 mm aluminum | 30 psi bead-blasted aluminum with clear anodize |
Final EDU Baffle Exterior | 60 mm × 60 mm aluminum | Black anodize |
3D Printed White Resin | 60 mm × 60 mm, 3D-printed resin RS-F2-GPWH-04 | CCRS vision system lab capture cone and orientation mechanism |
Aluminum 7075 with Teflon coating | 60 mm × 60 mm aluminum coupon | CCRS capture cone interior and exterior |
Aluminum 6061 with Teflon coating | 60 mm × 60 mm aluminum coupon | CCRS capture cone flange interior and exterior |
Table 7.
Summary of the surface properties assigned to the CCRS vision system non-sequential ray trace model (FRED) key components.
Table 7.
Summary of the surface properties assigned to the CCRS vision system non-sequential ray trace model (FRED) key components.
FRED Model Component | Optical Properties Assigned | Notes |
---|
Capture Cone Interior | AL 7075 with Teflon coating | Measured BRDF at NASA/GSFC |
Capture Cone Exterior | AL 7075 with Teflon coating | Measured BRDF at NASA/GSFC |
Capture Cone Collar Interior | AL 6061 with Teflon coating | Measured BRDF at NASA/GSFC |
Capture Cone Collar Exterior | AL 6061 with Teflon coating | Measured BRDF at NASA/GSFC |
Lens Volumes | 0% absorbing; 100% transmittance; 0% reflectance; 0% scatter | Assumes ideal lens system |
Lens Surfaces | 100% anti-reflection coating | Assumes ideal lens system |
Camera Housing Interior | 100% absorbing | Not necessary for analyzing target scene luminance |
Camera Housing Exterior | 100% absorbing | Not necessary for analyzing target scene luminance |
Camera Detector | 100% absorbing | Not necessary for analyzing target scene luminance |
Illumination Module Baffle Interior | 100% absorbing | LED directivity varied less than 2% due to baffle multi-scatter and absorption |
Illumination Module Baffle Exterior | 100% absorbing | N/A |
Illumination Module Base Interior | 100% absorbing | Multi-scatter and back-scatter effects negligible |
Illumination Module Base Exterior | 100% absorbing | N/A |
Illumination Module PCB | 100% absorbing | Multi-scatter and back-scatter effects negligible |
Orientation Mechanism Inner Liner Exterior | AL 6061 with Teflon Coating | Measured BRDF at NASA/GSFC |
Orientation Mechanism Flat- and V-Paddles | AL 6061 with Teflon Coating | Measured BRDF at NASA/GSFC |
Orientation Mechanism Primary Structure Exterior | AL6061-T651 Machined; Clear Coat | OSIRIS-REx surface property library |
Nominal OS Base | Friction-Tested Ceranovis with Li-Doped Sealant | Measured BRDF at NASA/GSFC |
Nominal OS Lid | Friction-Tested Ceranovis with Li-Doped Sealant | Measured BRDF at NASA/GSFC |
Highly Specular OS Base | Requirement-Limited BRDF | Harvey–Shack BRDF model fitted to requirement limits |
Highly Specular OS Lid | Requirement-Limited BRDF | Harvey–Shack BRDF model fitted to requirement limits |
Table 8.
Worst-case lens tolerances used in the 1000 Monte Carlo instances of the MSSS prescription. These tolerances were used to create a point spread function that just meets the minimum camera MTF requirement. Perturbed parameter values were sampled from uniform distributions centered on the nominal values. Actual MSSS fabrication and assembly tolerances are better constrained than the worst-case tolerances summarized here.
Table 8.
Worst-case lens tolerances used in the 1000 Monte Carlo instances of the MSSS prescription. These tolerances were used to create a point spread function that just meets the minimum camera MTF requirement. Perturbed parameter values were sampled from uniform distributions centered on the nominal values. Actual MSSS fabrication and assembly tolerances are better constrained than the worst-case tolerances summarized here.
Parameter | Perturbation Limits |
---|
Radius of curvature | ±0.2% |
Center thickness | ±0.15 mm |
Element decenter | ±0.13 mm |
Element tilt | ±0.91° |
Wedge | ±0.05 mm |
Surface irregularity | ±633 nm PTV |
nd | ±0.001 |
Vd | ±0.8% |