Yang, F.; Liu, J.; Ji, R.; Yu, X.; Yang, H.; Su, G.
Degradable Gel for Temporary Plugging in High Temperature Reservoir and Its Properties. Gels 2024, 10, 445.
https://doi.org/10.3390/gels10070445
AMA Style
Yang F, Liu J, Ji R, Yu X, Yang H, Su G.
Degradable Gel for Temporary Plugging in High Temperature Reservoir and Its Properties. Gels. 2024; 10(7):445.
https://doi.org/10.3390/gels10070445
Chicago/Turabian Style
Yang, Fan, Jinhua Liu, Renjing Ji, Xiaorong Yu, Huan Yang, and Gaoshen Su.
2024. "Degradable Gel for Temporary Plugging in High Temperature Reservoir and Its Properties" Gels 10, no. 7: 445.
https://doi.org/10.3390/gels10070445
APA Style
Yang, F., Liu, J., Ji, R., Yu, X., Yang, H., & Su, G.
(2024). Degradable Gel for Temporary Plugging in High Temperature Reservoir and Its Properties. Gels, 10(7), 445.
https://doi.org/10.3390/gels10070445