1. Introduction
The increasing performance of electronic components requires the dissipation of increasing amounts of heat generated and, consequently, the adoption of more and more efficient, but still small, cooling systems. In this context, the use of liquid-cooled microchannel heat sinks (MCHS) has long been established. In the early 1980s Tuckerman and Pease [
1] designed a very compact liquid cooled single-layered microchannel heat sink (SL-MCHS). Since then, a remarkable amount of investigation has been devoted to improving the overall thermal performance of this kind of devices. A comprehensive review can be found in the works of Adham et al. [
2] and He et al. [
3].
The most common option to increase SL-MCHS performance is to use two layers of microchannels. More than twenty years ago, Vafai and Zhu [
4] designed a double-layered microchannel heat sink (DL-MCHS) for electronic cooling with a counter-current flow arrangement. Over the years, it has been demonstrated that double-layered microchannel heat sinks allow to obtain particularly interesting performances in terms of reduction of thermal resistance and control of hotspots. Wei et al. [
5] manufactured and tested a DL-MCHS with co-current and counter-current arrangements; they found that the first flow configuration might be more + effective in reducing the hot spot temperature, while the second flow configuration provides a better temperature uniformity, reducing thermal stresses in the heat sink. Levac et al. [
6] also compared parallel flow and counter-flow configurations for DL-MCHSs; they found that the counter-flow arrangement provides the lowest thermal resistance, except for low flow rates. More recent scientific literature on this topic includes a large number of optimization studies. Hung et al. [
7,
8] took into account the effect of thermal properties of different substrate materials and optimized the geometric parameters to minimize the thermal resistance of DL-MCHSs; they came to the same conclusion as Leng et al. [
9] since the best configuration turned out to be the one with different microchannels heights for the bottom and top layers. Wu et al. [
10], through a parametric investigation on the thermal performance of DL-MCHSs, found that an improvement of the overall performance at a given pumping power can be obtained if the inlet velocity in the bottom microchannel layer is larger than that in the top one. Shen et al. [
11] proposed a novel staggered flow alternation structure in a DL-MCHS and found that the temperature of the substrate can be made quite uniform by increasing the number of staggered flow alternation, with affordable pressure drops. Chamoli et al. [
12] optimized an improved DL-MCHS design with truncated microchannels in the top layer and variable cross-sectional shape, providing better temperature uniformity and lower maximum temperature on the bottom wall of the heat sink. Zhou et al. [
13] carried out a geometric parameter optimization showing that changing the channel inclination angle, i.e., adopting variable channel heights in the axial direction for top and bottom layers, significantly reduces the thermal resistance. Patel and Mehta [
14] and Zhang et al. [
15] obtained significant improvement of the overall thermal performance by adopting channels with variable widths in the axial direction and having dense fins with a lesser thickness in the upper layer than in the lower one. Finally, in order to reduce thermal resistance and pumping power, a porous medium was used in DL-MCHSs as an alternative to conventional solid vertical ribs by Wang et al. [
16] and Li et al. [
17] and in place of the horizontal solid substrate between microchannel layers by Ghahremannezhad and Vafai [
18]. A comprehensive review of studies on DL-MCHSs can be found in the work of He et al. [
3].
The scientific literature analysis clearly shows the excellent thermal performances of double-layered microchannel heat sinks. Most of the studies on DL-MCHSs, however, only concern parallel- or counter-flow configurations and are based on the hypothesis of a uniform average velocity distribution in all the microchannels, thus not taking into account the performance degradation stemming from the often unavoidable flow maldistribution. Furthermore, the cross-flow configuration, where the flow in the microchannels of the bottom layer is perpendicular to the one in the microchannels of the top layer, was seldom considered.
The cross-flow arrangement was studied by Asnari and Kim [
19], who found that to obtain performances comparable to those yielded by the standard counter-flow design, modifications to the basic transverse configuration were needed, such as the subdivision of each layer into quarters with opposite flow directions in each quarter [
20]. Tang et al. [
21] performed an optimization on a DL-MCHS and came to the conclusion that, for the same pumping power, the counter-flow configuration offers better thermal performances than the cross-flow arrangement.
The present authors have proved that, with a different number of microchannels in the upper layer than in the lower layer, it is possible to achieve, even with cross-flow DL-MCHSs, thermal performances comparable to those provided by counter-flow DL-MCHSs [
22]. They have also shown that similar results can be obtained by exploiting the flow maldistribution yielded by appropriately designed headers [
23]. In this paper they address the problem of designing headers able to generate the desired type of flow maldistribution, i.e., able to produce an improvement in the performances of the cross-flow DL-MCHSs compared to those that would be yielded by uniform distributions of the microchannel velocities.
2. Motivations and Statement of the Problem
As illustrated in the Introduction, counter-flow double-layered microchannel heat sinks (CF-DL-MCHSs) have been shown to be very effective for thermal control of microchips and prevention of hotspot formation. Each layer of a CF-DL-MCHS consists of a large number of parallel microchannels, with the fluid flowing in the same direction in all the microchannels of the same layer, but in the opposite direction to the flow in the microchannels of the other layer. However, the counter-flow configuration requires rather complicated headers with two separate inlets and two outlets as shown in
Figure 1a, which represents a CF-DL-MCHS with triangular headers [
24], vertical cylindrical inlet/outlet ports and a Z type in/out configuration [
25], i.e., inlet and outlet ports for the same layer placed on opposite sides. In addition, it is inevitable that part of the outlet header of one of the two microchannel layers overlaps, at least partially, with the inlet header feeding the other microchannel layer and this can result in a significant reduction in actual thermal performance compared to theoretical one. Moreover, flow maldistribution can also play a negative role, as shown by Nonino and Savino [
26].
The disadvantages outlined above could be overcome by the adoption of a cross-flow configuration that would require only one inlet and one outlet header and would not result in heat exchanges between the inlet and outlet current, as can be seen in
Figure 1b. Previous investigations carried out by these authors [
22], however, have shown that, if the distribution of velocities in the microchannels is uniform, the use of cross-flow double-layered microchannel heat sinks (XF-DL-MCHSs) inevitably results in the formation of a hot spot at the corner opposite to that where the cold fluid inlet is located, as is apparent in
Figure 2a, where a three-dimensional map of the temperature distribution on the heated surface of a square microchip cooled with an XF-DL-MCHS is shown as an example. Obviously this determines a significant deterioration of the performance of the MCHS as it causes an increase in thermal resistance
which results in a reduction of the maximum heat flux that can be dissipated without exceeding the maximum allowable microchip temperatures. In the previous equation
is the fluid inlet temperature,
and
are the maximum temperature and the heat flow rate on the heated wall of the MCHS. Moreover, a high value of
causes a reduction of the temperature uniformity, which is relevant for thermal stress control and can be quantitatively expressed through the maximum temperature difference on the heated surface
where
is the minimum temperature on MCHS-microchip interface.
The authors also showed that if the microchannel velocity distribution in the XF-DL-MCHS is not uniform, but is such that the microchannels where velocities are the highest are located near the MCHS sides opposite to the inlet port and close to the outlet one, even an XF-DL-MCHS can achieve a thermal resistance and a temperature uniformity comparable to those produced by an CF-DL-MCHS, as can be seen by looking at
Figure 2b, where, with reference to the same test case of
Figure 2a the hotspot has been mitigated [
23]. The best results are obtained if the microchannel velocity varies linearly along the inlet sides as shown schematically in
Figure 2b. Therefore, an investigation has been conducted to find out which features of the inlet header can induce a flow maldistribution that is as close as possible to the desired linear trend. Headers with a shape similar to that shown in
Figure 1b can produce a flow maldistribution suitable for the purpose only when the fluid velocity is high enough. In the case of low flow rates, however, the effect is insufficient to ensure adequate hotspot control. Therefore, the objective of this work is to study the possibility of obtaining an adequate flow maldistribution with the aid of additional elements within the header such as full or partial height baffles made of solid or porous materials. Only the velocity fields in headers are analyzed in this work to get an indication of the microchannel velocity distribution, while the effects of the flow maldistribution on the thermal fields in MCHSs will be analyzed in a subsequent paper.
4. Numerical Simulations
Numerical simulations were conducted using the FVM commercial code ANSYS Fluent [
29] with the aim of verifying the effect on the uniformity of the microchannels inlet velocity distribution resulting from changes to the basic geometry of the inlet header in a cross-flow DL-MCHS. The considered geometry variations consist in the insertion in the inlet header of a baffle of suitable shape, possibly porous or of partial height, with the purpose of directing the flow towards the parts of the DL-MCHS farthest from the inlet port. In all the numerical simulations, water was assumed as the working fluid since this coolant is often used in MCHS applications [
12,
14,
20,
25]. The following properties of water at a temperature of 300 K were used:
ρ = 995.6 kg/m
3,
μ = 0.000854 kg/(m∗s). In all the test cases, the iterative solution of the model equation was obtained with an absolute tolerance on the residuals set at 10
−6 for all unknown variables.
4.1. Computational Domains and Boundary Conditions
In this work reference is made to a cross-flow DL-MCHS with 50 microchannel per layer having a height equal to mm and width of mm. The thickness of the walls that separate adjacent microchannels of the same layer and the thickness of the solid material between the two layers of microchannels are both assumed equal to mm. Thus, the footprint of the DL-MCHS has a size of mm2. The height of the fluid passages in the headers is equal to mm. The lengths of the two cylindrical inlet and outlet ports are mm and mm, respectively.
For the purposes of this study, the properties of the solid are irrelevant. However, in actual devices, silicon, copper or aluminum is used as the heat sink material. Advanced manufacturing technologies allow the application of porous media also in MCHSs. The porous baffle proposed in this study could be a sintered metallic medium, made from copper or stainless steel powders [
18,
30,
31,
32].
The overall geometry of the computational domain is shown in
Figure 1b and includes the two layers of microchannels in cross-flow represented in red and blue in the figure and modeled as porous media, the inlet and outlet headers, and two sections of the inlet and outlet piping. The dimensional details that can be deduced from a plan view of the MCHS are shown in
Figure 3a, where all the dimensions are in millimeters and the gray square corresponds to the area occupied by the layers of microchannels which were considered as porous media layers of equal height. Since the width of the microchannels is equal to the thickness of the separation walls, the porosity is 50% and the equivalent velocity in the microchannels, which is the parameter of interest in this work, is calculated as twice the average surface velocity at the position corresponding to the microchannel entrance on the internal boundary that forms the interface between the porous layer and the header. The two porous layers are separated by a distance of
mm, corresponding to the thickness of the wall between the two microchannel layers.
In addition to the basic geometrical configuration described above, several instances of the case where a symmetrical baffle, which may be made of solid or porous material, is inserted into the header were also analyzed. With reference to
Figure 3b, the position of the vertex of the baffle angle was kept fixed, while different values of the angle
and of the half-length
of the baffle were considered. However, the combinations of these values were chosen in such a way that the baffle ends are always placed in a position at the same distance
b from the plane where the microchannel inlets are located and from the solid wall on the opposite side, as shown in
Figure 3b. The minimum and maximum thickness of the baffles are equal to
and
mm, respectively. The following groups of test cases were considered:
no baffle in header (Case: NB);
full height solid baffle with half-length , and mm (Cases: S-L1, S-L2, S-L3);
partial height solid baffle with (i) half-length mm and heights equal to 75% and 90% of the height of the header fluid passage (Cases: C1-L3, C2-L3) and with (ii) half-length mm and heights equal to 75% and 90% of the height of the header fluid passage (Cases: C1-L4, C2-L4);
full height porous baffle with half-length
Lb = 6.5 mm and different permeability combinations in three baffle sections as detailed in
Section 5.4 (Cases: P1, P2, P3).
The boundary conditions applied for solution of the governing equations are: specified velocity on inlet boundaries, pressure boundary conditions on outlet boundaries and enhanced wall treatment (as implemented in ANSYS Fluent) on solid boundaries. More in detail, three values of the average microchannel velocity were considered, namely, , and m/s corresponding to values of , and m/s in the inlet pipes and Reynolds numbers equal to 2120, 4241 and 8482, respectively. Slip conditions are specified on the lateral, top and bottom boundaries of the porous layers.
4.2. Porous Coefficients
For the porous layers that replace the microchannels, the porous coefficients
and
that appear in Equation (
9) were derived based on the pressure drop data for microchannels of the same height, width and length as those considered here, obtained using an in-house FEM code for the solution of the parabolized form of the Navier-Stokes equations [
33]. The combinations of microchannel average velocity and corresponding pressure drop are shown in
Table 1, while the porous coefficients, computed according to [
28], are
m
2 and
m
−1 if the subscript
i identifies the flow direction and
m
2 and
if
.
The porous coefficients for the different parts of the baffle in cases P1, P2 and P3 are set based on literature data, as detailed in
Section 5.4.
4.3. Domain Discretization and Validation
The computational domains have been discretized using tetrahedral cells in the parts corresponding to the ports and headers and hexahedral cells (parallelepipeds) in the parts of the domain corresponding to the microchannel layers (porous medium). At the common interfaces, the grids of the two types are non-conformal. An inflation layer, with hexahedral cells of increasing thickness with the distance from the wall, was generated at the solid surfaces in the parts of the domain where the flow is turbulent, as can be seen in
Figure 4, which illustrates the structure of one of the computational grids. In the porous layers, represented in red and blue in the figure, the grid is very coarse in the flow direction since only the pressure drop in these layers affects the flow in the headers and not the details of the velocity field.
A grid independence study was conducted with reference to case S-L3 (header with full height solid baffle of half-length mm) for an average microchannel velocity m/s, which is the highest among those considered in this investigation. Five grids, named G1, G2, G3, G4 and G5, were used, with a number of cells equal to ; ; ; and , respectively.
The effect of refining the grid was verified with reference to the changes in the two flow features that are most relevant for this study, namely, the pressure drop in the MCHS (with the exclusion of the cylindrical inlet and outlet ports) and the microchannel average velocity distribution. The values of the following parameters are reported in
Table 2 as computed from the results obtained with the five grids considered:
the percentage variation of the pressure drop
between two successive grids
the percentage mean deviation of the microchannel velocity distribution
in each layer between two successive grids
where subscripts
K and
identify two successive grids and
. The values of
reported in
Table 2 are the average of those obtained for the top and bottom layers.
As can be seen, the changes of both parameters are only marginal when going from grid G4 to grid G5. Therefore, grid G4 with cells and a maximum cell size in the non-porous part of the domain equal to mm was adopted for this test case. With this grid, the maximum value of the dimensionless distance from the wall is , while the average value is . Grids based on the same maximum cell size and with a similar number of cells were used for all the other test cases.
No experimental data are available for the validation of this problem. However, this should not be of too much concern because the purpose of this work is not the detailed simulation of a real case, but it is just to demonstrate the validity of a method to obtain a desired microchannel velocity distribution. Moreover, the reliability of the ANSYS Fluent code for the accurate solution of single-phase turbulent flow problems is already well established. In fact, in the past several researchers have satisfactorily used this code with the same turbulence model adopted in here (Realizable
model) for the numerical analysis of the flow in different types of heat sinks [
34,
35,
36].
6. Discussion
The performances of different heat-sink headers, evaluated with respect to the ability of generating a velocity distribution that is adequate for hotspot mitigation when using an XF-DL-MCHS with 50 microchannels per layer for microchip thermal control, are compared with reference to the following parameters:
the maximum normalized velocity difference at the two ends of the microchannel inlet sides, i.e., the difference between the normalized velocities in the last microchannel of a layer,
, and in the first microchannel of a layer,
the mean deviation of the normalized microchannel velocities from a corresponding linear velocity distribution, which preliminary calculations showed to be the most effective to achieve a good temperature uniformity on the microchip surface
In Equation (
14),
is the velocity in the
j-th microchannel and
is the velocity in the same microchannel position in the case of a linear microchannel velocity distribution. For every actual velocity distribution
, velocities
are calculated by imposing a linear trend that ensures the same flow rate and, at the same time, minimizes the mean velocity deviation
from the actual distribution. As an example,
Figure 12 shows the flow maldistribution profile for case S-L1 and
m/s in red dots. The corresponding linear trend, in blue dots, ensures the same flow rate and is obtained by minimizing the mean distance between red and blue points for each microchannel.
A large value of the flow maldistribution factor means a high velocity in the microchannels farthest form the inlet port and a low velocity in the microchannels closest to the inlet port, with a positive effect on the hot spot control. A small value of means that the velocity distribution in the microchannel layer is close to a linear trend, that should also have a positive effect from the thermal point of view. Thus, for the purpose of this work, the higher the and the lower the , the better it is. Both parameters have been calculated as the average of their values in the top and bottom microchannel layers.
In addition to the parameters and , which measure how good a certain velocity distribution is from the hotspot control point of view, the pressure drop in the MCHS also needs to be carefully considered. In this study, is an overall pressure drop that includes losses in the inlet and outlet headers and in the microchannel layers, but not in the cylindrical inlet and outlet ports.
In
Figure 13a,c,e,
is plotted against the maldistribution factor
for
,
and
m/s, respectively. The three charts show a nearly linear correlation between the pressure drop
and the maldistribution factor
pertaining to the different cases. For all values of
, the headers without baffle (NB) exhibit the lowest pressure drops but also the lowest values of
. For all points, the larger the maldistribution factor the larger the pressure drop: the gray lines which connect points pertaining to cases with the same type of baffle (solid, cut, porous) have almost the same slope. Pressure losses are always higher than in the case without baffle, but are of the same order of magnitude and their maximum increase compared with the NB case goes from 28% for
m/s to 51% for
m/s. As expected, for the same header geometry
is much larger at high flow rates, meaning a more pronounced flow maldistribution. As an example, if we consider the case P2,
varies from 46% to 100% when
goes from
to
m/s. Cut baffle cases have small maldistribution factors but not so little pressure drops: cases C2-L4 and S-L1 have almost the same value of
, but the pressure losses for the solid baffle case are smaller. Solid and porous baffle geometries present the largest values of
and not so different pressure drops
, especially at low flow rates. As far as these two parameters are concerned, it could be concluded that they have similar performance.
In
Figure 13b,d,f,
is plotted against the mean deviation from a linear distribution
for
,
and
m/s, respectively. The header without baffle (NB) always shows the lowest pressure drops, but some cut baffle configurations (C1-L4 and C1-L3, i.e., those with the smaller baffle height) show slightly lower values of
. As in the case of
, for the same header geometry
is larger at high flow rates, meaning a less linear-like trend. As an example, if we consider the case P2,
varies from 0.036 to 0.045 when
goes from
to
m/s.The largest values of this performance parameter are yielded by the solid baffle headers, especially for cases S-L2 and S-L3 (larger values of
) because, as explained in
Section 5.2, velocity distributions feature peaks and valleys and are pretty far from a linear trend. In contrast to what happens with
, here the solid and the porous baffle geometries exhibit very different performances: although pressure drops are very similar, headers with porous baffles show much lower values of
than headers with solid ones for all values of
.
Comparing the results displayed in
Figure 13a–f, it can be concluded that, for a given pressure drop, headers with porous baffles yield values of the maldistribution factor
similar to the ones that can be obtained with the other types of baffles, but for a given value of
, in almost all cases, the corresponding values of
are lower than the others, meaning that velocity distributions in the microchannel layers are not too far from a linear one. The results in
Figure 13 also show that by changing the permeability of the porous baffle a wide range of maldistribution factor
can be obtained while maintaining low values of
. Finally, cut baffle headers yield very smooth microchannel velocity distributions, i.e., small values of
, but limited velocity differences, i.e., small values of
, and could only be of interest if a mild maldistribution is sufficient for the hot spot control, for example at intermediate to high flow rates. All this demonstrates that, with an appropriate baffle selection, inlet headers of cross-flow MCHSs can yield microchannel velocity distributions that are close enough to those that would allow optimal hotspot management when heat sinks of this kind are used for the thermal control of electronic devices.
Although the effects of the flow maldistribution on the thermal field in cross-flow double-layered microchannel heat sinks will be the subject of a future study, some preliminary outcomes are reported here to highlight the usefulness of the findings of this work. An in-house finite element method (FEM) procedure [
22,
41] was used to carry out sample numerical simulations of the temperature and velocity fields in a MCHS with 50 microchannels as the one considered here with reference to the following conditions:
m/s,
K,
W and heat sink made of silicon with thermal conductivity
W/(m K). Three microchannel velocity distributions were considered: a uniform distribution (the corresponding temperature field is the one already shown in
Figure 2a), a linear distribution with
(the corresponding temperature field is the one already shown in
Figure 2b) and the velocity distribution of case P2, which is characterized by a value of
equal to
, very similar to that of the linear distribution.
Table 4 presents the maximum and minimum temperatures
and
, the maximum temperature difference
on the heated wall of the MCHS, the thermal resistance
and the percentage variations
of
and
of
with reference to the uniform microchannel velocity case.
As can be seen, the maximum temperature difference and the thermal resistance for the P2 case are very similar to those for the linear velocity distribution, and significantly lower than those yielded by the uniform microchannel velocity distribution.