Refrigeration and Heat Dissipation: Refrigeration System, Low-GWP Refrigerants, and Cooling Technology for High Heat Flux Space
A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Mechanical Engineering".
Deadline for manuscript submissions: closed (31 October 2022) | Viewed by 28996
Special Issue Editors
Interests: refrigerant replacement; refrigerant leakage; refrigerant recovery and reclamation; high heat flux cooling technology (heat pipes, microchannel cooling and immersion cooling technology for data centers and power batteries)
Special Issues, Collections and Topics in MDPI journals
Interests: air-source heat pump systems; low-grade heat driven refrigeration; control system with intelligent defrost and diagnosis for cold chain and air-source heat pumps; thermophysical properties for working fluids
Special Issue Information
Dear Colleagues,
Refrigeration and air conditioning technologies have a large impact on industry, lifestyle, agriculture, and settlement patterns. New refrigeration and air conditioning systems involve lots of key technologies, such as new components for domestic, commercial, and industrial refrigeration, new technology in air conditioning, refrigeration, process and design, mobile air conditioning, energy efficiency, low-GWP refrigerants, and case studies.
With the rapid development of the semiconductor industry, more and more semiconductor devices, such as electronic chips and power electronic devices, face the challenge of thermal management. To solve the heat dissipation problem of various devices in different situations, many kinds of cooling techniques have been developed, for example, heat pipe technology, microchannel cooling, immersion liquid cooling, etc.
Prof. Dr. Xiaohong Han
Dr. Yingjie Xu
Guest Editors
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Keywords
- refrigeration
- air conditioning
- refrigerant
- thermophysical properties
- heat pump
- data center
- cold chain
- heat exchanger
- liquid cooling
- high flux
- heat pipe
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