RF/MM-Wave Circuits Design and Applications, 2nd Edition

Dear Colleagues,

Radio frequency (RF) and millimeter-wave (mm-wave) circuits are enabling the development of applications that are crucial to our life, such as wireless communication (e.g., 5G mobile communication, wireless LANs, low-data-rate and low-power communication, NFC), industrial automation (e.g., IoTs, high-precision positioning sensors, galvanic isolation), automotive safety (e.g., vehicular radar sensors, ADASs) and medical instrumentations (non-ionizing imaging systems, wearable sensors, implanted devices, etc.). Nanoscale CMOS technologies are able to cope with such applications up to the mm-wave spectrum, while SiGe BiCMOS processes are still dominating from 120 GHz to terahertz. In this context, GaN technlogies are also gaining significance in RF/mm-wave power applications owing to their intrinsic benefits in terms of power efficiency, especially at high temperatures.

This Special Issue aims to present the latest results in the field of RF and mm-wave ICs in CMOS, BiCMOS and GaN technologies, with a focus on the modelling of active/passive components, the electromagnetic (EM) simulation of integrated passive devices, integrated circuit design, system-on-chip (SoC) integration, advanced package-to-chip co-design, new transceiver architectures, antenna-to-chip co-design, and the application of artificial intelligence (AI) to RF/mm-wave circuit/layout design.

The topics of interest include, but are not limited to, the following:

• RX front-end circuits (LNAs, mixers, VGAs, T/R switches, amplifiers, filters, demodulators);
• Low-power transceivers (wireless circuits for low power operation, battery-less transceivers, wakeup receivers, RFID, near-field communications);
• Oscillators and frequency synthesizers (VCOs, frequency dividers, LO distribution, multipliers, PLLs, charge pumps);
• Transmitters and power amplifiers for 5G and mm-wave applications;
• Integrated radars, including vehicular radar sensors;
• mm-wave communication circuits and systems-on-chip;
• Galvanically isolated data/power transfer systems based on RF coupling;
• Application of artificial intelligence (AI) to RF/mm-wave circuit and layout design.

Dr. Egidio Ragonese
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

• LNA
• mixer
• PA
• radar
• VCO
• antenna
• PLL
• transmitter
• receiver
• transceiver