Emerging Technologies in Explainable Artificial Intelligence (XAI) for Big Data

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Artificial Intelligence".

Deadline for manuscript submissions: closed (15 August 2024) | Viewed by 1377

Special Issue Editors

Department of Computer Science, The University of Sunderland, Sunderland NE36 0AS, UK
Interests: artificial intelligence; natural language processing; big data; data science
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Guest Editor
Department of Computer Science, The University of Sunderland, Sunderland NE36 0AS, UK
Interests: artificial intelligence; natural language processing; machine learning; data science

E-Mail Website
Guest Editor
Department of Computer Science, University of Bradford, Bradford BD7 1DP, UK
Interests: cyber security; artificial intelligence; Internet of Things; machine learning; security in cyber physical systems
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Artificial intelligence applications, methods, techniques, and approaches are rapidly advancing. Although they contribute positively to many aspects of our lives, there are major concerns about how they process and learn from our information, their critical decision making, etc. There is increasing demand from individuals in societies, businesses, organizations, and government bodies to increase our understanding of AI applications in performing tasks. For example, ChatGPT raised concerns from practitioners in many industries (e.g., education) and even prompted certain governments around the world (e.g., Italy) to ban its use by the public. The need for explainable AI has prompted researchers, businesses, and governments to take action to increase form theories and application designs that allow transparency and explanations of the processes and decisions of AI algorithms and products. Thus, this Special Issue invites the contribution of original theoretical or applied research, as well as survey papers, related to methods, approaches, and techniques to explain AI in relation to big data.

The aim of this Special Issue is to invite, encourage, and disseminate original research contributions to expand our knowledge boundary on explainable AI and its applications to big data.

In this Special Issue, original research articles and reviews are welcome. Research areas may include (but are not limited to) the following:

  1. Theory and foundations of explainable AI using big data;
  2. Abstraction, validation, and generalization of explainable AI;
  3. Methods and standards for explainable AI;
  4. Explainable AI approaches to natural language processing, computer vision, image processing, robotics, cybersecurity, etc.
  5. Analyses of AI or machine learning model training;
  6. Explainable machine learning algorithms;
  7. Explainable AI training processes or model representations;
  8. Literature reviews on recent trends, methods, and approaches to explainable AI;
  9. Challenges and solutions in the design and application of explainable AI;
  10. User trust and privacy issue in AI and machine learning models;
  11. Assessment and impact of national and international laws and regulations on explainable AI;
  12. Artificial intelligence and machine learning for the security and privacy of big data;
  13. Artificial intelligence, safety assurance, and reliability of big data;
  14. Artificial intelligence and intrusion detection for big data;
  15. Artificial intelligence and blockchain for big data.

Dr. Sardar Jaf
Dr. Qiang Huang
Dr. Ibrahim Ghafir
Guest Editors

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Keywords

  • explainable AI
  • explainable AI methods
  • explainable AI for big data
  • security issues in AI models
  • privacy in AI models
  • safety issues in AI models
  • interpretable AI
  • artificial intelligence
  • machine learning
  • AI application to big data
  • machine learning model analyses
  • machine learning applications
  • machine learning algorithm analyses

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Published Papers (1 paper)

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Research

14 pages, 5577 KiB  
Article
Advancements in Electronic Component Assembly: Real-Time AI-Driven Inspection Techniques
by Eyal Weiss
Electronics 2024, 13(18), 3707; https://doi.org/10.3390/electronics13183707 - 18 Sep 2024
Cited by 1 | Viewed by 941
Abstract
This study presents an advanced methodology for improving electronic assembly quality through real-time, inline inspection utilizing state-of-the-art artificial intelligence (AI) and deep learning technologies. The primary goal is to ensure compliance with stringent manufacturing standards, notably IPC-A-610 and IPC-J-STD-001. Employing the existing infrastructure [...] Read more.
This study presents an advanced methodology for improving electronic assembly quality through real-time, inline inspection utilizing state-of-the-art artificial intelligence (AI) and deep learning technologies. The primary goal is to ensure compliance with stringent manufacturing standards, notably IPC-A-610 and IPC-J-STD-001. Employing the existing infrastructure of pick-and-place machines, this system captures high-resolution images of electronic components during the assembly process. These images are analyzed instantly by AI algorithms capable of detecting a variety of defects, including damage, corrosion, counterfeit, and structural irregularities in components and their leads. This proactive approach shifts from conventional reactive quality assurance methods by integrating real-time defect detection and strict adherence to industry standards into the assembly process. With an accuracy rate exceeding 99.5% and processing speeds of about 5 ms per component, this system enables manufacturers to identify and address defects promptly, thereby significantly enhancing manufacturing quality and reliability. The implementation leverages big data analytics, analyzing over a billion components to refine detection algorithms and ensure robust performance. By pre-empting and resolving defects before they escalate, the methodology minimizes production disruptions and fosters a more efficient workflow, ultimately resulting in considerable cost reductions. This paper showcases multiple case studies of component defects, highlighting the diverse types of defects identified through AI and deep learning. These examples, combined with detailed performance metrics, provide insights into optimizing electronic component assembly processes, contributing to elevated production efficiency and quality. Full article
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