Advancements in Artificial Intelligence (AI) for Engineering Applications
A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Computer Science & Engineering".
Deadline for manuscript submissions: 15 April 2025 | Viewed by 957
Special Issue Editor
Special Issue Information
Dear Colleagues,
We are excited to issue a call for papers for a Special Issue of Electronics focusing on the intersection of artificial intelligence (AI) with engineering applications. This Special Issue aims to explore the latest advancements and practical implementations within the realms of swarm intelligence, optimization, fuzzy logic, natural language processing (NLP), computer vision, and reinforcement learning.
The overall focus, scope, and purpose of this Special Issue are delineated as follows:
(a) Focus: The Special Issue will concentrate on exploring innovative methodologies and algorithms within the fields of swarm intelligence, optimization, fuzzy logic, NLP, computer vision, and reinforcement learning, with a specific emphasis on their application in engineering domains.
(b) Scope: We welcome contributions that present novel research findings, methodologies, case studies, and applications related to the aforementioned AI fields in engineering contexts. Topics of interest include, but are not limited to, the following:
- Development of advanced AI-based optimization techniques for engineering problems;
- Integration of fuzzy logic principles into engineering systems to enhance adaptability and decision-making;
- Utilization of NLP for improving human–computer interaction in engineering applications;
- Application of computer vision techniques for object recognition, image analysis, and visual perception in engineering tasks;
- Implementation of reinforcement learning algorithms for autonomous decision-making and control in engineering systems.
(c) Purpose: The purpose of this Special Issue is to provide a platform for researchers to disseminate their latest findings, exchange insights, and foster collaborations for advancing the state of the art in AI-driven engineering applications. By showcasing practical implementations and case studies, we aim to bridge the gap between theoretical advancements in AI and their real-world applications in engineering.
This Special Issue will complement the existing literature by taking the following steps:
- Offering a comprehensive overview of the latest trends and advancements in AI techniques as applied to engineering problems;
- Providing in-depth discussions and analyses of practical case studies and applications, thereby offering valuable insights for both academia and industry practitioners;
- Stimulating further research and innovation in this field by identifying emerging challenges and potential areas for future exploration.
We encourage researchers from academia, industry, and other relevant sectors to contribute their original research articles for publication in this Special Issue.
We eagerly anticipate your contributions to this Special Issue and advance our collective understanding of AI-driven engineering applications.
Dr. Hubert Zarzycki
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- artificial intelligence
- swarm intelligence
- optimization
- fuzzy logic
- natural language processing (NLP)
- computer vision
- reinforcement learning
- engineering applications
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