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Microstructure, Mechanical Properties and Manufacturing Techniques of Advanced High-Entropy Alloys

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Metals and Alloys".

Deadline for manuscript submissions: 20 October 2025 | Viewed by 72

Special Issue Editor


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Guest Editor
School of Mechanical Engineering, University of Science and Technology Beijing, Beijing 100083, China
Interests: high-entropy alloys
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

High-entropy alloys (HEAs) are a new class of materials that have garnered significant attention due to their unique composition and superior properties. HEAs exhibit remarkable mechanical performance and are typically composed of multiple principal elements, including high strength, ductility, excellent corrosion resistance, impact resistance, oxidation resistance, and thermal stability. These characteristics make HEAs particularly promising for applications in various industrial fields, including aerospace, energy, and automotive sectors.

However, the relationship between the microstructural characteristics of HEAs and their mechanical performance requires further exploration. A key issue in material design is the strength-ductility trade-off, where achieving high strength while maintaining adequate ductility is crucial for ensuring material reliability. Additionally, developing novel HEA fibers and investigating their performance in extreme environments are important research directions in this field.

This Special Issue welcomes original research manuscripts, review articles, and methodological contributions, particularly focusing on the following topics:

  • Microstructural evolution and characterization of HEAs;
  • The relationship between microstructure and mechanical performance, especially strength and ductility;
  • Manufacturing and applications of HEA fibers;
  • The influence of temperature and strain rate on the mechanical behavior of HEAs;
  • Phase transformations and their effects on the performance of HEAs;
  • Applications of HEAs in extreme environments;
  • Advanced manufacturing techniques in HEA research.

Dr. Dongyue Li
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • high-entropy alloys
  • high-entropy alloy fibers
  • strength-ductility trade-off
  • microstructural characterization
  • mechanical performance
  • phase transformations
  • advanced manufacturing techniques
  • size effects
  • low-temperature performance
  • deformation mechanisms
  • strengthening mechanisms

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Published Papers

This special issue is now open for submission.
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