Advanced Science and Technology of Thin Film Deposition
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Thin Films and Interfaces".
Deadline for manuscript submissions: 20 April 2025 | Viewed by 64
Special Issue Editor
Interests: strongly correlated thin films; magnetism; superconductivity and topology
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
This Special Issue, "Advanced Science and Technology of Thin Film Deposition", aims to bring together pioneering research and developments in the field of thin film deposition techniques, materials, and applications. This issue focuses on exploring innovative methodologies, advanced materials, and emerging technologies that enhance the performance, functionality, and scalability of thin films across various domains, including electronics, energy, optics, and biomedical devices. The scope of this issue encompasses both fundamental studies and applied research.
Contributions are invited on topics such as novel deposition techniques (e.g., chemical vapor deposition, physical vapor deposition, and atomic layer deposition) and the development of functional materials like multiferroics, superconductors, and topological insulators. Additionally, the issue will highlight advancements in heterostructures and superlattices, emphasizing their role in tailoring material properties for specific applications. Research on the characterization and modeling of thin films, as well as the development of new materials with enhanced electrical, magnetic, and optical properties, is particularly encouraged.
This issue also seeks to explore deposition processes that enable the production of films with controlled thickness, composition, microstructure, and interfaces, which are critical for the integration of these functional materials in next-generation devices. This Special Issue aims to serve as a comprehensive resource for scientists, engineers, and practitioners working in the field of thin film technology. It will provide insights into the latest trends, challenges, and future directions, fostering collaboration and innovation in this rapidly evolving area.
Dr. Ludi Miao
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- thin film deposition
- chemical vapor deposition (CVD)
- physical vapor deposition (PVD)
- atomic layer deposition (ALD)
- pulsed laser deposition (PLD)
- molecular beam epitaxy (MBE)
- heterostructures
- superlattices
- nanostructured materials
- surface engineering
- functional coatings
- multiferroics
- superconductors
- topological insulators
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