Micro- and Nanotechnologies: Materials, Manufacturing and Applications

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D:Materials and Processing".

Deadline for manuscript submissions: closed (31 October 2024) | Viewed by 2162

Special Issue Editors


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Department of Machine Manufacturing Technology, Gheorghe Asachi Technical University of Iași, 61-63 D. Mangeron Blvd., 700050 Iasi, Romania
Interests: additive manufacturing; injection moulding; characterization of polymeric and biodegradable materials
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School of Mechanical, Materials, Mechatronic and Biomedical Engineering, University of Wollongong, Wollongong, NSW, 2522, Australia
Interests: numerical simulation of metal forming; tribology in metal forming; multi-scale materials processing; advanced rolling technology; microforming; manufacturing of composites; contact mechanics; friction and wear in manufacturing; lubrication technology; development of novel lubricants
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Guest Editor
Department of Product and Systems Design Engineering, University of Western Macedonia, 50100 Kila Kozani, Greece
Interests: computational design; CAD/CAM/CAE; digital manufacturing; product design; FEA; industry 4.0; prototyping; reverse engineering
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Special Issue Information

Dear Colleagues,

In this Special Issue, both selected papers from the 12th International Conference on Modern Technologies in Industrial Engineering, (https://www.modtech.ro, 24–27 June 2024, Kuala Lumpur, Malaysia) and external contributions will be published. The word count of manuscripts submitted to the journal Micromachines should be extended by at least 40% compared with those of the conference proceedings.

The current state of manufacturing technology is essentially attributed to the many gradual advancements made to earlier inventions over the years. Modern tools and appliances are the result of technological breakthroughs, and have made daily life more straightforward than we ever could have imagined.

Modern technology has quickly become an essential element of our lives due to its rapid development. These days, everything we use in our daily lives is connected to technology, either directly or indirectly; we could not avoid technology even if we tried. Whether they are assisting workers or doing the work themselves, machines are more accurate and efficient than people. As a result, we are making use of them to make our daily tasks easier. The key aim of corporations is to streamline procedures in order for more work to be completed in less time and with less effort, which has laid the foundation for contemporary technology.

Because of global issues like resources for new industrial applications, smart manufacturing, and energy efficiency in manufacturing, new perspectives on modern technology and materials development are becoming more and more important in the field of materials science and manufacturing process and technology research. Thus, a large number of researchers are actively investigating novel/biomaterials, gadgets, processing technologies, and modern manufacturing in order to enable advancements across a wide range of industrial applications.

The focus of this conference was primarily on technology, materials characterization, and industrial applications. We would like to extend this focus by welcoming the submission of papers on, but not limited to, the following topics:

  • Engineering of manufacturing processes: novel manufacturing methods, advances in nontraditional manufacturing processes, virtual manufacturing; advanced methods and tools for computer-integrated manufacturing; new industrial applications; smart manufacturing; energy efficiency in manufacturing.
  • Advances in composite materials and technologies: advanced metals, ceramics and polymers; biomaterials; recycling of materials.
  • Micro- and nanotechnologies: new developments in micro-/nanoscale processes; fabrication of nanostructures and materials; nanofilms, nanobubbles, nanodroplets, nanofluids.

Prof. Dr. Nedelcu Dumitru
Prof. Dr. Zhengyi Jiang
Prof. Dr. Panagiotis Kyratsis
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • micro/nano technologies
  • materials
  • manufacturing
  • industrial applications

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Published Papers (2 papers)

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Research

21 pages, 19988 KiB  
Article
Study on Electrical and Mechanical Properties of Double-End Supported Elastic Substrate Prepared by Wet Etching Process
by Ding Song and Wenge Wu
Micromachines 2024, 15(7), 929; https://doi.org/10.3390/mi15070929 - 20 Jul 2024
Cited by 1 | Viewed by 920
Abstract
Preparing elastic substrates as a carrier for dual-end supported nickel chromium thin film strain sensors is crucial. Wet etching is a vital microfabrication process widely used in producing microelectronic components for various applications. This article combines lithography and wet etching methods to microprocess [...] Read more.
Preparing elastic substrates as a carrier for dual-end supported nickel chromium thin film strain sensors is crucial. Wet etching is a vital microfabrication process widely used in producing microelectronic components for various applications. This article combines lithography and wet etching methods to microprocess the external dimensions and rectangular grooves of 304 stainless steel substrates. The single-factor variable method was used to explore the influence mechanism of FeCl3, HCl, HNO3, and temperature on the etching rate, etching factor, and etching surface roughness. The optimal etching parameter combination was summarized: an FeCl3 concentration of 350 g/L, HCl concentration of 150 mL/L, HNO3 concentration of 100 mL/L, and temperature of 40 °C. In addition, by comparing the surface morphology, microstructure, and chemical and mechanical properties of a 304 stainless steel substrate before and after etching treatment, it can be seen that the height difference of the substrate surface before and after etching is between 160 μm and −70 μm, which is basically consistent with the initial design of 0.2 mm. The results of an XPS analysis and Raman spectroscopy analysis both indicate that the surface C content increases after etching, and the corrosion resistance of the surface after etching decreases. The nano-hardness after etching increased by 26.4% compared to before, and the ζ value decreased by 7%. The combined XPS and Raman results indicate that the changes in surface mechanical properties of 304 stainless steel substrates after etching are mainly caused by the formation of micro-nanostructures, grain boundary density, and dislocations after wet etching. Compared with the initial rectangular substrate, the strain of the I-shaped substrate after wet etching increased by 3.5–4 times. The results of this study provide the preliminary process parameters for the wet etching of a 304 stainless steel substrate of a strain measuring force sensor and have certain guiding significance for the realization of simple steps and low cost of 304 stainless steel substrate micro-nano-processing. Full article
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18 pages, 36956 KiB  
Article
Multi-Step Two-Dimensional Ultrasonic-Assisted Grinding of Silicon Carbide: An Experimental Study on Surface Topography and Roughness
by Hongbo Li, Tao Chen, Wenbo Bie, Fan Chen, Yuhao Suo and Zhenyan Duan
Micromachines 2024, 15(7), 915; https://doi.org/10.3390/mi15070915 - 15 Jul 2024
Viewed by 716
Abstract
Two-dimensional ultrasonic-assisted grinding (2D-UAG) has exhibited advantages in improving the machining quality of hard and brittle materials. However, the grinding mechanism in this process has not been thoroughly revealed due to the complicated material removal behaviors. In this study, multi-step 2D-UAG experiments of [...] Read more.
Two-dimensional ultrasonic-assisted grinding (2D-UAG) has exhibited advantages in improving the machining quality of hard and brittle materials. However, the grinding mechanism in this process has not been thoroughly revealed due to the complicated material removal behaviors. In this study, multi-step 2D-UAG experiments of silicon carbide are conducted to investigate the effects of machining parameters on surface quality. The experimental results demonstrate that the tool amplitude and the workpiece amplitude have similar effects on surface roughness. In the rough grinding stage, the surface roughness decreases continuously with increasing ultrasonic amplitudes and the material is mainly removed by brittle fracture with different surface defects. Under semi-finishing and finishing grinding steps, the surface roughness first declines and then increases as the tool amplitude or workpiece amplitude grows from 0 μm to 8 μm and the inflection point appears around 4 μm. The surface damage contains small-sized pits with band-like distribution and localized grooves. Furthermore, the influences of cutting parameters on surface quality are similar to those in conventional grinding. Discussions of the underlying mechanisms for the experimental phenomena are also provided based on kinematic analysis. The conclusions gained in this study can provide references for the optimization of machining parameters in 2D-UAG of hard and brittle materials. Full article
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