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Micromachines
Special Issues
MEMS/NEMS Sensors and Actuators, 3rd Edition
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MEMS/NEMS Sensors and Actuators, 3rd Edition

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A：Physics".

Deadline for manuscript submissions: 28 February 2025 | Viewed by 3436

Special Issue Editors

Prof. Dr. Yulong Zhao

E-Mail Website
Guest Editor
School of Mechanical Engineering, Xi'an Jiaotong University, Xi'an 710049, China
Interests: MEMS; sensors; micro/nano fabrication
Special Issues, Collections and Topics in MDPI journals
Dr. Qi Zhang

E-Mail Website
Guest Editor
State Key Laboratory for Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an 710049, China
Interests: micro/nano manufacturing; MEMS/NEMS sensors; measurements; carbon-based sensors; MoS2-based sensors; atomic simulation
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Since the rise of MEMS/NEMS devices in the 1970s, the field of MEMS/NEMS sensors and actuators has grown immensely. From the 21st century onwards, MEMS/NEMS sensors and actuators have been industrialized and applied to consumer markets (such as mobile phones and games), as well as intelligent manufacturing, robots, aerospace, and other fields. Compared with traditional machinery, MEMS/NEMS technology can be miniaturized and is intelligent, multifunctional, highly integrated, and suitable for mass manufacturing processes.

Accordingly, this Special Issue seeks to showcase research papers, communications, and review articles that focus on: (1) the novel structural design of MEMS/NEMS sensors and actuators; (2) improved fabrication, packaging processes, and circuit designs based on all kinds of MEMS/NEMS products; (3) new sensitive materials committed to a wider range of applications, such as polysilicon, graphene, carbon nanotubes, etc.; and (4) the new development of applying MEMS/NEMS sensors and actuators, including (but not limited to) MEMS/NEMS pressure sensors, accelerometers, gyroscopes, and microphones with capacitive, resonant, piezoelectric, and piezoresistive mechanism.

We look forward to receiving your contributions.

Prof. Dr. Yulong Zhao
Dr. Qi Zhang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • MEMS/NEMS sensors (based on capacitive, resonant, piezoelectric, and piezoresistive principles) 
  • MEMS/NEMS sensors (based on different physical quantities, including pressure, force, acceleration, flow, etc.)
  • MEMS/NEMS actuators
  • MEMS/NEMS applications
  • MEMS/NEMS fabrication and packaging processes
  • novel sensitive materials
  • novel structural designs

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Published Papers (1 paper)

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Research

18 pages, 6172 KiB  
Article
Integrated Amorphous Carbon Film Temperature Sensor with Silicon Accelerometer into MEMS Sensor
by Qi Zhang, Xiaoya Liang, Wenzhe Bi, Xing Pang and Yulong Zhao
Micromachines 2024, 15(9), 1144; https://doi.org/10.3390/mi15091144 - 12 Sep 2024
Viewed by 3264
Abstract
Amorphous carbon (a-C) has promising potential for temperature sensing due to its outstanding properties. In this work, an a-C thin film temperature sensor integrated with the MEMS silicon accelerometer was proposed, and a-C film was deposited on the fixed frame of the accelerometer [...] Read more.
Amorphous carbon (a-C) has promising potential for temperature sensing due to its outstanding properties. In this work, an a-C thin film temperature sensor integrated with the MEMS silicon accelerometer was proposed, and a-C film was deposited on the fixed frame of the accelerometer chip. The a-C film was deposited by DC magnetron sputtering and linear ion beam, respectively. The nanostructures of two types of films were observed by SEM and TEM. The cluster size of sp2 was analyzed by Raman, and the content of sp2 and sp3 of the carbon film was analyzed by XPS. It showed that the DC-sputtered amorphous carbon film, which had a higher sp2 content, had better temperature-sensitive properties. Then, an integrated sensor chip was designed, and the structure of the accelerometer was simulated and optimized to determine the final sizes. The temperature sensor module had a sensitivity of 1.62 mV/°C at the input voltage of 5 V with a linearity of 0.9958 in the temperature range of 20~150 °C. The sensitivity of the sensor is slightly higher than that of traditional metal film temperature sensors. The accelerometer module had a sensitivity of 1.4 mV/g/5 V, a nonlinearity of 0.38%, a repeatability of 1.56%, a total thermomechanical noise of 509 μg over the range of 1 to 20 Hz, and an average thermomechanical noise density of 116 µg/√Hz, which is smaller than the input acceleration amplitude for testing sensitivity. Under different temperatures, the performance of the accelerometer was tested. This research provided significant insights into the convenient procedure to develop a high-performance, economical temperature–accelerometer-integrated MEMS sensor. Full article
(This article belongs to the Special Issue MEMS/NEMS Sensors and Actuators, 3rd Edition)
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