Search for Articles:
Title / Keyword
Author / Affiliation / Email
Journal
Article Type
 
 
Advanced Search
 
Section
Special Issue
Volume
Issue
Number
Page
 
5.2
3.0
Journals
Micromachines
Special Issues
Feature Papers of Micromachines in ‘Engineering and Technology’ 2024
share announcement

Feature Papers of Micromachines in ‘Engineering and Technology’ 2024

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "E：Engineering and Technology".

Deadline for manuscript submissions: 31 December 2024 | Viewed by 15371

Special Issue Editor

Prof. Dr. Stephen Edward Saddow

E-Mail Website
Guest Editor
Department of Electrical Engineering, University of South Florida, 4202 East Fowler Avenue, ENB118, Tampa, FL 33620, USA
Interests: SiC; neural interfaces; SiC MEMS; biotechnology
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

We are pleased to announce the Special Issue entitled “Feature Papers of Micromachines in ‘Engineering and Technology’ 2024”. In recent years, we have cooperated with many excellent scholars/scientific groups and published several very important high-level works that have already received numerous citations according to Web of Science data. We aim to introduce new insights into the scientific developments and cutting-edge technology related to micromachines in the engineering and technology fields, which will make a great contribution to the community.

This Special Issue will be a collection of high-quality papers by outstanding scholars from around the world. Both original research articles and comprehensive review papers are welcome. The papers will be published with full open access after peer review to benefit both authors and readers.

You are welcome to send short proposals for the submission of Feature Papers to our Editorial Office ([email protected]) before submission. These will undergo a preliminary evaluation by our Editors. Please note that selected full papers will still be subject to thorough and rigorous peer review.

We look forward to receiving your excellent work.

Prof. Dr. Stephen Edward Saddow
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • micro/nano fabrication and manufacturing
  • design and optimization principles of micro- and nanosystems
  • micro-nanosystems and advanced technologies for engineering applications
  • electronic system (including electrical circuits and devices, transistors, capacitors, inductors, resistors, diodes, insulators and conductors) engineering

Benefits of Publishing in a Special Issue

  • Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
  • Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
  • Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
  • External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
  • e-Book format: Special Issues with more than 10 articles can be published as dedicated e-books, ensuring wide and rapid dissemination.

Further information on MDPI's Special Issue polices can be found here.

Related Special Issues

Published Papers (7 papers)

Download All Papers
Order results
Result details
Show export options expand_more Show export options expand_less
Select all
Export citation of selected articles as:

Research

Jump to: Review

12 pages, 3235 KiB  
Article
Dynamic Acoustic Holography: One-Shot High-Precision and High-Information Methodology
by Zhaoxi Li, Yiheng Yang, Qi Lu, Xiongwei Wei, Chenxue Hou, Yi Quan, Xiaozhou Lü, Weimin Bao, Yintang Yang and Chunlong Fei
Micromachines 2024, 15(11), 1316; https://doi.org/10.3390/mi15111316 - 29 Oct 2024
Viewed by 579
Abstract
Acoustic holography technology is widely used in the field of ultrasound due to its capability to achieve complex acoustic fields. The traditional acoustic holography method based on single-phase holograms is limited due to its inability to complete acoustic field control with high dynamics [...] Read more.
Acoustic holography technology is widely used in the field of ultrasound due to its capability to achieve complex acoustic fields. The traditional acoustic holography method based on single-phase holograms is limited due to its inability to complete acoustic field control with high dynamics and accuracy. Here, we propose a method for constructing an acoustic holographic model, introducing an ultrasonic array to provide dynamic amplitude control degrees of freedom, and combining the dynamically controllable ultrasonic array and high-precision acoustic hologram to achieve the highest acoustic field accuracy and dynamic range. This simulation method has been proven to be applicable to both simple linear patterns and complex surface patterns. Moreover, it is possible to reconstruct the degree of freedom of the target plane amplitude effectively and achieve a breakthrough in high information content. This high-efficiency acoustic field control capability has potential applications in ultrasound imaging, acoustic tweezers, and neuromodulation. Full article
(This article belongs to the Special Issue Feature Papers of Micromachines in ‘Engineering and Technology’ 2024)
►▼ Show Figures

Figure 1

13 pages, 4206 KiB  
Article
Physics-Based Artificial Neural Network Assisting in Extracting Transient Properties of Extrinsically Triggering Photoconductive Semiconductor Switches
by Zhong Zheng, Huiyong Hu, Yutian Wang, Tianlong Zhao, Qian Sun and Hui Guo
Micromachines 2024, 15(8), 1003; https://doi.org/10.3390/mi15081003 - 1 Aug 2024
Viewed by 781
Abstract
In this paper, a physics-based ANN assisting method for extracting transient properties of extrinsically triggering photoconductive semiconductor switches (ET-PCSSs) is proposed. It exploits the nonlinear mapping of ANN between transient current (input) and doping concentration (output). According to the basic laws of photoelectric [...] Read more.
In this paper, a physics-based ANN assisting method for extracting transient properties of extrinsically triggering photoconductive semiconductor switches (ET-PCSSs) is proposed. It exploits the nonlinear mapping of ANN between transient current (input) and doping concentration (output). According to the basic laws of photoelectric device operating, two types of ANN models are constructed by gaussian and polynomial fitting. The mean absolute error (MAE) of forecasting transient photocurrent can be less than 10 A under low triggering optical powers, which verifies the feasibility of ANN assisting TCAD applied to PCSSs. The results are comparable to computation by Mixed-Mode simulation, yet even thousands of seconds of CPU runtime cost are saved in every period. To improve the robustness of the Poly-ANN predictor, Bayesian optimization (BO) is implemented for minimizing the curl deviation of photocurrent-time curves. Full article
(This article belongs to the Special Issue Feature Papers of Micromachines in ‘Engineering and Technology’ 2024)
►▼ Show Figures

Figure 1

14 pages, 2717 KiB  
Article
Characterizing Acoustic Behavior of Silicon Microchannels Separated by a Porous Wall
by Mehrnaz Hashemiesfahan, Jo Wim Christiaens, Antonio Maisto, Pierre Gelin, Han Gardeniers and Wim De Malsche
Micromachines 2024, 15(7), 868; https://doi.org/10.3390/mi15070868 - 30 Jun 2024
Viewed by 1118
Abstract
Lateral flow membrane microdevices are widely used for chromatographic separation processes and diagnostics. The separation performance of microfluidic lateral membrane devices is determined by mass transfer limitations in the membrane, and in the liquid phase, mass transfer resistance is dependent on the channel [...] Read more.
Lateral flow membrane microdevices are widely used for chromatographic separation processes and diagnostics. The separation performance of microfluidic lateral membrane devices is determined by mass transfer limitations in the membrane, and in the liquid phase, mass transfer resistance is dependent on the channel dimensions and transport properties of the species separated by the membrane. We present a novel approach based on an active bulk acoustic wave (BAW) mixing method to enhance lateral transport in micromachined silicon devices. BAWs have been previously applied in channels for mixing and trapping cells and particles in single channels, but this is, to the best of our knowledge, the first instance of their application in membrane devices. Our findings demonstrate that optimal resonance is achieved with minimal influence of the pore configuration on the average lateral flow. This has practical implications for the design of microfluidic devices, as the channels connected through porous walls under the acoustic streaming act as 760 µm-wide channels rather than two 375 µm-wide channels in the context of matching the standing pressure wave criteria of the piezoelectric transducer. However, the roughness of the microchannel walls does seem to play a significant role in mixing. A roughened (black silicon) wall results in a threefold increase in average streaming flow in BAW mode, suggesting potential avenues for further optimization. Full article
(This article belongs to the Special Issue Feature Papers of Micromachines in ‘Engineering and Technology’ 2024)
►▼ Show Figures

Figure 1

13 pages, 4854 KiB  
Article
A Novel EWOD Platform for Freely Transporting Droplets in Double and Single-Plate Structures
by Yii-Nuoh Chang, Ting-Rui Huang and Da-Jeng Yao
Micromachines 2024, 15(6), 797; https://doi.org/10.3390/mi15060797 - 17 Jun 2024
Viewed by 3647
Abstract
This study developed a novel dielectric wetting microfluidic operation platform combining parallel-plate and coplanar-plate regions with a curved surface structure as the connection structure. With the new electrowetting on dielectric (EWOD) platform, “droplet pull-out” has been successfully achieved and viewed as an essential [...] Read more.
This study developed a novel dielectric wetting microfluidic operation platform combining parallel-plate and coplanar-plate regions with a curved surface structure as the connection structure. With the new electrowetting on dielectric (EWOD) platform, “droplet pull-out” has been successfully achieved and viewed as an essential new operation for microfluidics with the dielectric wetting technique. The EWOD system is divided into a PDMS substrate top plate and an indium tin oxide (ITO) glass substrate as a bottom layer on this chip. In the parallel-plate region, the droplets can be generated and transported through the square parallel electrodes; in the single-plate area, the droplets can be pulled out from the parallel structure, transported and mixed through the common grounded coplanar electrodes. In dielectric wetting performance testing, coplanar electrodes can apply a maximum driving force of 31.22 µN to DI water and 13.38 µN to propylene carbonate (PC). This driving force is sufficient to detach the sample from the top cover and pull the sub-droplet from the parallel plate structure for DI water, PC and polyethylene glycol diacrylate (PEGDA) buffer. The novel EWOD system also possesses the advantage of precise volume control for liquid samples; the volume error of the generated droplet can be controlled within 0.1% to 2%. Full article
(This article belongs to the Special Issue Feature Papers of Micromachines in ‘Engineering and Technology’ 2024)
►▼ Show Figures

Figure 1

20 pages, 40920 KiB  
Article
Digital Eddy Current Detection Method Based on High-Speed Sampling with STM32
by Xiong Cao, Erlong Li, Zilan Yuan and Kaituo Zheng
Micromachines 2024, 15(6), 775; https://doi.org/10.3390/mi15060775 - 11 Jun 2024
Cited by 1 | Viewed by 921
Abstract
The electromagnetic eddy current non-destructive testing system enables the non-destructive analysis of surface defect information on tested materials. Based on the principles of eddy current detection, this paper presents a digital eddy current detection method using high-speed sampling based on STM32. A differential [...] Read more.
The electromagnetic eddy current non-destructive testing system enables the non-destructive analysis of surface defect information on tested materials. Based on the principles of eddy current detection, this paper presents a digital eddy current detection method using high-speed sampling based on STM32. A differential eddy current coil is used as the detection probe, and the combination of a differential bridge and a differential amplifier circuit helps to reduce common-mode noise interference. The detection signal is collected via an STM32-based acquisition circuit and transmitted to the host computer through Ethernet for digital demodulation processing. The host computer performs operations such as smoothing averaging, sinusoidal fitting, and outlier removal to extract the amplitude and phase of the detection signal. The system also visually displays the condition of the tested object’s surface in real time through graphical visualization. Testing showed that this system can operate at frequencies up to 8.84 MHz and clearly identify defects as narrow as 1 mm on the surface of the tested steel plate. Full article
(This article belongs to the Special Issue Feature Papers of Micromachines in ‘Engineering and Technology’ 2024)
►▼ Show Figures

Figure 1

17 pages, 4576 KiB  
Article
A Wearable Fingertip Force Feedback Device System for Object Stiffness Sensing
by Changcheng Wu, Jianli Ren, Qingqing Cao, Zeran Yue, Ting Fang and Aiguo Song
Micromachines 2024, 15(6), 693; https://doi.org/10.3390/mi15060693 - 24 May 2024
Viewed by 1151
Abstract
Virtual reality technology brings a new experience to human-computer interaction, while wearable force feedback devices can enhance the immersion of users in interaction. This paper proposes a wearable fingertip force feedback device that uses a tendon drive mechanism, with the aim of simulating [...] Read more.
Virtual reality technology brings a new experience to human-computer interaction, while wearable force feedback devices can enhance the immersion of users in interaction. This paper proposes a wearable fingertip force feedback device that uses a tendon drive mechanism, with the aim of simulating the stiffness characteristics of objects within virtual scenes. The device adjusts the rotation angle of the torsion spring through a DC motor, and then uses a wire to convert the torque into a feedback force at the user’s index fingertips, with an output force of up to 4 N and a force change rate of up to 10 N/s. This paper introduces the mechanical structure and design process of the force feedback device, and conducts a mechanical analysis of the device to select the appropriate components. Physical and psychological experiments are conducted to comprehensively evaluate the device’s performance in conveying object stiffness information. The results show that the device can simulate different stiffness characteristics of objects, and users can distinguish objects with different stiffness characteristics well when wearing the force feedback device and interacting with the three-dimensional virtual environments. Full article
(This article belongs to the Special Issue Feature Papers of Micromachines in ‘Engineering and Technology’ 2024)
►▼ Show Figures

Figure 1

Review

Jump to: Research

20 pages, 15185 KiB  
Review
Comprehensive Review of FinFET Technology: History, Structure, Challenges, Innovations, and Emerging Sensing Applications
by Koosha Karimi, Ali Fardoost and Mehdi Javanmard
Micromachines 2024, 15(10), 1187; https://doi.org/10.3390/mi15101187 - 25 Sep 2024
Viewed by 4037
Abstract
The surge in demand for 3D MOSFETs, such as FinFETs, driven by recent technological advances, is explored in this review. FinFETs, positioned as promising alternatives to bulk CMOS, exhibit favorable electrostatic characteristics and offer power/performance benefits, scalability, and control over short-channel effects. Simulations [...] Read more.
The surge in demand for 3D MOSFETs, such as FinFETs, driven by recent technological advances, is explored in this review. FinFETs, positioned as promising alternatives to bulk CMOS, exhibit favorable electrostatic characteristics and offer power/performance benefits, scalability, and control over short-channel effects. Simulations provide insights into functionality and leakage, addressing off-current issues common in narrow band-gap materials within a CMOS-compatible process. Multiple structures have been introduced for FinFETs. Moreover, some studies on the fabrication of FinFETs using different materials have been discussed. Despite their potential, challenges like corner effects, quantum effects, width quantization, layout dependencies, and parasitics have been acknowledged. In the post-planar CMOS landscape, FinFETs show potential for scalability in nanoscale CMOS, which leads to novel structures for them. Finally, recent developments in FinFET-based sensors are discussed. In a general view, this comprehensive review delves into the intricacies of FinFET fabrication, exploring historical development, classifications, and cutting-edge ideas for the used materials and FinFET application, i.e., sensing. Full article
(This article belongs to the Special Issue Feature Papers of Micromachines in ‘Engineering and Technology’ 2024)
►▼ Show Figures

Figure 1

Show export options expand_more Show export options expand_less
Select all
Export citation of selected articles as:
 
Displaying articles 1-7
Back to TopTop