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Micromachines
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Design and Fabrication of Micro/Nano Sensors and Actuators, Volume II
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Design and Fabrication of Micro/Nano Sensors and Actuators, Volume II

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A：Physics".

Deadline for manuscript submissions: closed (30 March 2023) | Viewed by 21846

Printed Edition Available!
A printed edition of this Special Issue is available here.

Special Issue Editors

Prof. Dr. Weidong Wang

E-Mail Website
Guest Editor
School of Mechano-Electronic Engineering, Xidian University, Xi'an 710071, China
Interests: MEMS; NEMS; micro/nano mechanics; flexible sensors; electronic packaging
Special Issues, Collections and Topics in MDPI journals
Dr. Yong Ruan

E-Mail Website1 Website2
Guest Editor
Department of Precision Instruments,Tsinghua University, Beijing 100084, China
Interests: MEMS/NEMS; silicon based surface/bulk and fabrication technology; MEMS Relay; MEMS pressure sensor; harsh environment MEMS devices; chip-scale atomic devices and system
Prof. Dr. Zai-Fa Zhou

E-Mail Website
Guest Editor
School of Electronic Science and Technology, Southeast University, Nanjing 210096, China
Interests: MEMS CAD; MEMS/NEMS design method; Micro/nano fabrication technology; In-situ test of material parameters

Special Issue Information

Dear Colleagues,

With the rapid development of materials science and manufacturing technology, numerous novel MEMS and NEMS devices, such as micro/nano sensors and micro/nano actuators, have emerged in many application fields. These above devices are always made of silicon, metals, ceramics, glass, and so on, whose mechanical and electrical properties have great influence on their working characteristics, including accuracy, sensitivity and working range. In addition, the design and fabrication method can directly affect the reliability of those MEMS and NEMS devices, especially lifetime, robustness and stability under extreme conditions of shock, temperature, humidity, irradiation, chemical exposure, or other challenges. Accordingly, this Special Issue seeks to showcase research papers and review articles that focus on design and fabrication of micro/nano sensors and actuators. Areas of interest include but are not limited to:

  • Structural design and optimization methods;
  • System modeling and simulation;
  • Advanced fabrication techniques;
  • In situ characterization and testing technology;
  • Reliability of devices and systems.

Prof. Dr. Weidong Wang
Dr. Yong Ruan
Prof. Dr. Zai-Fa Zhou
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • MEMS
  • NEMS
  • sensors
  • actuators
  • design and optimization
  • fabrication techniques
  • reliability
  • in situ test

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Related Special Issue

Published Papers (11 papers)

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Editorial

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4 pages, 155 KiB  
Editorial
Design and Fabrication of Micro/Nano Sensors and Actuators, Volume II
by Weidong Wang, Yong Ruan, Zaifa Zhou and Min Liu
Micromachines 2024, 15(6), 667; https://doi.org/10.3390/mi15060667 - 21 May 2024
Viewed by 3041
Abstract
Microelectromechanical system (MEMS) sensors are a miniaturized sensor technology that integrates sensors with microelectronic components using microelectromechanical system manufacturing technology [...] Full article
(This article belongs to the Special Issue Design and Fabrication of Micro/Nano Sensors and Actuators, Volume II)

Research

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11 pages, 2852 KiB  
Article
A MEMS Electrochemical Angular Accelerometer with Silicon-Based Four-Electrode Structure
by Mingbo Zhang, Qinghua Liu, Maoqi Zhu, Jian Chen, Deyong Chen, Junbo Wang and Yulan Lu
Micromachines 2024, 15(3), 351; https://doi.org/10.3390/mi15030351 - 29 Feb 2024
Cited by 1 | Viewed by 1267
Abstract
This paper presents a MEMS electrochemical angular accelerometer with a silicon-based four-electrode structure, which was made of thousands of interconnected microchannels for electrolyte flow, anodes uniformly coated on structure surfaces and cathodes located on the sidewalls of flow holes. From the perspective of [...] Read more.
This paper presents a MEMS electrochemical angular accelerometer with a silicon-based four-electrode structure, which was made of thousands of interconnected microchannels for electrolyte flow, anodes uniformly coated on structure surfaces and cathodes located on the sidewalls of flow holes. From the perspective of device fabrication, in this study, the previously reported multi-piece assembly was simplified into single-piece integrative manufacturing, effectively addressing the problems of complex assembly and manual alignment. From the perspective of the sensitive structure, in this study, the silicon-based four-electrode structure featuring with complete insulation layers between anodes and cathodes can enable fast electrochemical reactions with improved sensitivities. Numerical simulations were conducted to optimize the geometrical parameters of the silicon-based four-electrode structure, where increases in fluid resistance and cathode area were found to expand working bandwidths and improve device sensitivity, respectively. Then, the silicon-based four-electrode structure was fabricated by conventional MEMS processes, mainly composed of wafer-level bonding and wafer-level etching. As to device characterization, the MEMS electrochemical angular accelerometer with the silicon-based four-electrode structure exhibited a maximum sensitivity of 1458 V/(rad/s2) at 0.01 Hz and a minimum noise level of −164 dB at 1 Hz. Compared with previously reported electrochemical angular accelerometers, the angular accelerometer developed in this study offered higher sensitivities and lower noise levels, indicating strong potential for applications in the field of rotational seismology. Full article
(This article belongs to the Special Issue Design and Fabrication of Micro/Nano Sensors and Actuators, Volume II)
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13 pages, 3353 KiB  
Article
MEMS Differential Pressure Sensor with Dynamic Pressure Canceler for Precision Altitude Estimation
by Shun Yasunaga, Hidetoshi Takahashi, Tomoyuki Takahata and Isao Shimoyama
Micromachines 2023, 14(10), 1941; https://doi.org/10.3390/mi14101941 - 18 Oct 2023
Viewed by 1890
Abstract
Atmospheric pressure measurements based on microelectromechanical systems (MEMSs) can extend accessibility to altitude information. A differential pressure sensor using a thin cantilever and an air chamber is a promising sensing element for sub-centimeter resolution. However, its vulnerability to wind and the lack of [...] Read more.
Atmospheric pressure measurements based on microelectromechanical systems (MEMSs) can extend accessibility to altitude information. A differential pressure sensor using a thin cantilever and an air chamber is a promising sensing element for sub-centimeter resolution. However, its vulnerability to wind and the lack of height estimation algorithms for real-time operation are issues that remain to be solved. We propose a sensor “cap” that cancels the wind effect and noise by utilizing the airflow around a sphere. A set of holes on the spherical cap transmits only the atmospheric pressure to the sensor. In addition, we have developed a height estimation method based on a discrete transfer function model. As a result, both dynamic pressure and noise are suppressed, and height is estimated under a 5 m/s wind, reconstructing the trajectory with an estimation error of 2.8 cm. The developed sensing system enhances height information in outdoor applications such as unmanned aerial vehicles and wave height measurements. Full article
(This article belongs to the Special Issue Design and Fabrication of Micro/Nano Sensors and Actuators, Volume II)
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13 pages, 5311 KiB  
Article
Flexible Thermoelectric Type Temperature Sensors Based on Graphene Fibers
by Chenying Wang, Yuxin Zhang, Feng Han and Zhuangde Jiang
Micromachines 2023, 14(10), 1853; https://doi.org/10.3390/mi14101853 - 28 Sep 2023
Cited by 6 | Viewed by 1683
Abstract
Graphene, as a novel thermoelectric (TE) material, has received growing attention because of its unique microstructure and excellent thermoelectric properties. In this paper, graphene fibers (GFs) are synthesized by a facile microfluidic spinning technique using a green reducing agent (vitamin C). The GFs [...] Read more.
Graphene, as a novel thermoelectric (TE) material, has received growing attention because of its unique microstructure and excellent thermoelectric properties. In this paper, graphene fibers (GFs) are synthesized by a facile microfluidic spinning technique using a green reducing agent (vitamin C). The GFs have the merits of high electrical conductivity (2448 S/m), high flexibility, and light weight. Further, a flexible temperature sensor based on GF and platinum (Pt) with a sensitivity of 29.9 μV/°C is proposed, and the thermal voltage output of the sensor can reach 3.45 mV at a temperature gradient of 120 °C. The sensor has good scalability in length, and its sensitivity can increase with the number of p-n thermocouples. It has good cyclic stability, repeatability, resistance to bending interference, and stability, showing great promise for applications in real-time detection of human body temperature. Full article
(This article belongs to the Special Issue Design and Fabrication of Micro/Nano Sensors and Actuators, Volume II)
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12 pages, 3957 KiB  
Article
Structural Design of Dual-Type Thin-Film Thermopiles and Their Heat Flow Sensitivity Performance
by Hao Chen, Tao Liu, Nanming Feng, Yeming Shi, Zigang Zhou and Bo Dai
Micromachines 2023, 14(7), 1458; https://doi.org/10.3390/mi14071458 - 20 Jul 2023
Cited by 2 | Viewed by 1316
Abstract
Aiming at the shortcomings of the traditional engineering experience in designing thin-film heat flow meters, such as low precision and long iteration time, the finite element analysis model of thin-film heat flow meters is established based on finite element simulation methods, and a [...] Read more.
Aiming at the shortcomings of the traditional engineering experience in designing thin-film heat flow meters, such as low precision and long iteration time, the finite element analysis model of thin-film heat flow meters is established based on finite element simulation methods, and a double-type thin-film heat flow sensor based on a copper/concentrate thermopile is made. The influence of the position of the thermal resistance layer, heat flux density and thickness of the thermal resistance layer on the temperature gradient of the hot and cold ends of the heat flow sensor were comprehensively analyzed by using a simulation method. When the applied heat flux density is 50 kW/m2 and the thermal resistance layer is located above and below the thermopile, respectively, the temperature difference between the hot junction and the cold junction is basically the same, but comparing the two, the thermal resistance layer located above is more suitable for rapid measurements of heat flux at high temperatures. In addition, the temperature difference between the hot and cold contacts of the thin-film heat flux sensor increases linearly with the thickness of the thermal resistance layer. Finally, we experimentally tested the response–recovery characteristics of the sensors, with a noise of 2.1 μV and a maximum voltage output of 15 μV in a room temperature environment, respectively, with a response time of about 2 s and a recovery time of about 3 s. Therefore, the device we designed has the characteristic of double-sided use, which can greatly expand the scope of use and service life of the device and promote the development of a new type of heat flow meter, which will provide a new method for the measurement of heat flow density in the complex environment on the surface of the aero-engine. Full article
(This article belongs to the Special Issue Design and Fabrication of Micro/Nano Sensors and Actuators, Volume II)
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12 pages, 5931 KiB  
Article
Weak Capacitance Detection Circuit of Micro-Hemispherical Gyroscope Based on Common-Mode Feedback Fusion Modulation and Demodulation
by Xiaoyang Zhang, Pinghua Li, Xuye Zhuang, Yunlong Sheng, Jinghao Liu, Zhongfeng Gao and Zhiyu Yu
Micromachines 2023, 14(6), 1161; https://doi.org/10.3390/mi14061161 - 31 May 2023
Cited by 1 | Viewed by 1555
Abstract
As an effective capacitance signal produced by a micro-hemisphere gyro is usually below the pF level, and the capacitance reading process is susceptible to parasitic capacitance and environmental noise, it is highly difficult to acquire an effective capacitance signal. Reducing and suppressing noise [...] Read more.
As an effective capacitance signal produced by a micro-hemisphere gyro is usually below the pF level, and the capacitance reading process is susceptible to parasitic capacitance and environmental noise, it is highly difficult to acquire an effective capacitance signal. Reducing and suppressing noise in the gyro capacitance detection circuit is a key means to improve the performance of detecting the weak capacitance generated by MEMS gyros. In this paper, we propose a novel capacitance detection circuit, where three different means are utilized to achieve noise reduction. Firstly, the input common-mode feedback is applied to the circuit to solve the input common-mode voltage drift caused by both parasitic capacitance and gain capacitance. Secondly, a low-noise, high-gain amplifier is used to reduce the equivalent input noise. Thirdly, the modulator–demodulator and filter are introduced to the proposed circuit to effectively mitigate the side effects of noise; thus, the accuracy of capacitance detection can be further improved. The experimental results show that with the input voltage of 6 V, the newly designed circuit produces an output dynamic range of 102 dB and the output voltage noise of 5.69 nV/√Hz, achieving a sensitivity of 12.53 V/pF. Full article
(This article belongs to the Special Issue Design and Fabrication of Micro/Nano Sensors and Actuators, Volume II)
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20 pages, 6934 KiB  
Article
Design and Optimization of Hemispherical Resonators Based on PSO-BP and NSGA-II
by Jinghao Liu, Pinghua Li, Xuye Zhuang, Yunlong Sheng, Qi Qiao, Mingchen Lv, Zhongfeng Gao and Jialuo Liao
Micromachines 2023, 14(5), 1054; https://doi.org/10.3390/mi14051054 - 16 May 2023
Cited by 3 | Viewed by 1535
Abstract
Although one of the poster children of high-performance MEMS (Micro Electro Mechanical Systems) gyroscopes, the MEMS hemispherical resonator gyroscope (HRG) is faced with the barrier of technical and process limits, which makes it unable to form a resonator with the best structure. How [...] Read more.
Although one of the poster children of high-performance MEMS (Micro Electro Mechanical Systems) gyroscopes, the MEMS hemispherical resonator gyroscope (HRG) is faced with the barrier of technical and process limits, which makes it unable to form a resonator with the best structure. How to obtain the best resonator under specific technical and process limits is a significant topic for us. In this paper, the optimization of a MEMS polysilicon hemispherical resonator, designed by patterns based on PSO-BP and NSGA-II, was introduced. Firstly, the geometric parameters that significantly contribute to the performance of the resonator were determined via a thermoelastic model and process characteristics. Variety regulation between its performance parameters and geometric characteristics was discovered preliminarily using finite element simulation under a specified range. Then, the mapping between performance parameters and structure parameters was determined and stored in the BP neural network, which was optimized via PSO. Finally, the structure parameters in a specific numerical range corresponding to the best performance were obtained via the selection, heredity, and variation of NSGAII. Additionally, it was demonstrated using commercial finite element soft analysis that the output of the NSGAII, which corresponded to the Q factor of 42,454 and frequency difference of 8539, was a better structure for the resonator (generated by polysilicon under this process within a selected range) than the original. Instead of experimental processing, this study provides an effective and economical alternative for the design and optimization of high-performance HRGs under specific technical and process limits. Full article
(This article belongs to the Special Issue Design and Fabrication of Micro/Nano Sensors and Actuators, Volume II)
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11 pages, 2463 KiB  
Article
Analysis of Acousto-Optic Phenomenon in SAW Acoustofluidic Chip and Its Application in Light Refocusing
by Xianming Qin, Xuan Chen, Qiqi Yang, Lei Yang, Yan Liu, Chuanyu Zhang, Xueyong Wei and Weidong Wang
Micromachines 2023, 14(5), 943; https://doi.org/10.3390/mi14050943 - 26 Apr 2023
Viewed by 2192
Abstract
This paper describes and analyzes a common acousto-optic phenomenon in surface acoustic wave (SAW) microfluidic chips and accomplishes some imaging experiments based on these analyses. This phenomenon in acoustofluidic chips includes the appearance of bright and dark stripes and image distortion. This article [...] Read more.
This paper describes and analyzes a common acousto-optic phenomenon in surface acoustic wave (SAW) microfluidic chips and accomplishes some imaging experiments based on these analyses. This phenomenon in acoustofluidic chips includes the appearance of bright and dark stripes and image distortion. This article analyzes the three-dimensional acoustic pressure field and refractive index field distribution induced by focused acoustic fields and completes an analysis of the light path in an uneven refractive index medium. Based on the analysis of microfluidic devices, a SAW device based on a solid medium is further proposed. This MEMS SAW device can refocus the light beam and adjust the sharpness of the micrograph. The focal length can be controlled by changing the voltage. Moreover, the chip is also proven to be capable of forming a refractive index field in scattering media, such as tissue phantom and pig subcutaneous fat layer. This chip has the potential to be used as a planar microscale optical component that is easy to integrate and further optimize and provides a new concept about tunable imaging devices that can be attached directly to the skin or tissue. Full article
(This article belongs to the Special Issue Design and Fabrication of Micro/Nano Sensors and Actuators, Volume II)
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18 pages, 8558 KiB  
Article
Microwave Dual-Crack Sensor with a High Q-Factor Using the TE20 Resonance of a Complementary Split-Ring Resonator on a Substrate-Integrated Waveguide
by Yelim Kim, Eiyong Park, Ahmed Salim, Junghyeon Kim and Sungjoon Lim
Micromachines 2023, 14(3), 578; https://doi.org/10.3390/mi14030578 - 28 Feb 2023
Cited by 5 | Viewed by 2137
Abstract
Microwave sensors have attracted interest as non-destructive metal crack detection (MCD) devices due to their low cost, simple fabrication, potential miniaturization, noncontact nature, and capability for remote detection. However, the development of multi-crack sensors of a suitable size and quality factor (Q-factor) remains [...] Read more.
Microwave sensors have attracted interest as non-destructive metal crack detection (MCD) devices due to their low cost, simple fabrication, potential miniaturization, noncontact nature, and capability for remote detection. However, the development of multi-crack sensors of a suitable size and quality factor (Q-factor) remains a challenge. In the present study, we propose a multi-MCD sensor that combines a higher-mode substrate-integrated waveguide (SIW) and complementary split-ring resonators (CSRRs). In order to increase the Q-factor, the device is miniaturized; the MCD is facilitated; and two independent CSRRs are loaded onto the SIW, where the electromagnetic field is concentrated. The concentrated electromagnetic field of the SIW improves the Q-factor of the CSRRs, and each CSRR creates its own resonance and produces a miniaturizing effect by activating the sensor below the cut-off frequency of the SIW. The proposed multi-MCD sensor is numerically and experimentally demonstrated for cracks with different widths and depths. The fabricated sensor with a TE20-mode SIW and CSRRs is able to efficiently detect two sub-millimeter metal cracks simultaneously with a high Q-factor of 281. Full article
(This article belongs to the Special Issue Design and Fabrication of Micro/Nano Sensors and Actuators, Volume II)
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9 pages, 3025 KiB  
Article
Effect of Annealing Time on the Cyclic Characteristics of Ceramic Oxide Thin Film Thermocouples
by Yuning Han, Yong Ruan, Meixia Xue, Yu Wu, Meng Shi, Zhiqiang Song, Yuankai Zhou and Jiao Teng
Micromachines 2022, 13(11), 1970; https://doi.org/10.3390/mi13111970 - 13 Nov 2022
Cited by 4 | Viewed by 1563
Abstract
Oxide thin film thermocouples (TFTCs) are widely used in high-temperature environment measurements and have the advantages of good stability and high thermoelectric voltage. However, different annealing processes affect the performance of TFTCs. This paper studied the impact of different annealing times on the [...] Read more.
Oxide thin film thermocouples (TFTCs) are widely used in high-temperature environment measurements and have the advantages of good stability and high thermoelectric voltage. However, different annealing processes affect the performance of TFTCs. This paper studied the impact of different annealing times on the cyclic characteristics of ceramic oxide thin film thermocouples. ITO/In2O3 TFTCs were prepared on alumina ceramics by a screen printing method, and the samples were annealed at different times. The microstructure of the ITO film was studied by scanning electron microscopy (SEM), X-ray diffraction (XRD), and X-ray photoelectron spectroscopy (XPS). The results show that when the annealing temperature is fixed, the stability of the thermocouple is worst when it is annealed for 2 h. Extending the annealing time can improve the properties of the film, increase the density, slow down oxidation, and enhance the thermal stability of the thermocouple. The thermal cycle test results show that the sample can reach five temperature rise and fall cycles, more than 50 h, and can meet the needs of stable measurement in high temperature and harsh environments. Full article
(This article belongs to the Special Issue Design and Fabrication of Micro/Nano Sensors and Actuators, Volume II)
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11 pages, 3993 KiB  
Article
3D Numerical Simulation and Structural Optimization for a MEMS Skin Friction Sensor in Hypersonic Flow
by Huihui Guo, Xiong Wang, Tingting Liu, Zhijiang Guo and Yang Gao
Micromachines 2022, 13(9), 1487; https://doi.org/10.3390/mi13091487 - 7 Sep 2022
Viewed by 1600
Abstract
The skin friction of a hypersonic vehicle surface can account for up to 50% of the total resistance, directly affecting the vehicle’s effective range and load. A wind tunnel experiment is an important and effective method to optimize the aerodynamic shape of aircraft, [...] Read more.
The skin friction of a hypersonic vehicle surface can account for up to 50% of the total resistance, directly affecting the vehicle’s effective range and load. A wind tunnel experiment is an important and effective method to optimize the aerodynamic shape of aircraft, and Micro-Electromechanical System (MEMS) skin friction sensors are considered the promising sensors in hypersonic wind tunnel experiments, owing to their miniature size, high sensitivity, and stability. However, the sensitive structure including structural appearance, a gap with the package shell, and flatness of the sensor will change the measured flow field and cause the accurate measurement of friction resistance. Aiming at the influence of sensor-sensitive structure on wall-flow characteristics and friction measurement accuracy, the two-dimensional and three-dimensional numerical models of the sensor in the hypersonic flow field based on Computational Fluid Dynamics (CFD) are presented respectively in this work. The model of the sensor is verified by using the Blathius solution of two-dimensional laminar flow on a flat plate. The results show that the sensor model is in good agreement with the Blathius solution, and the error is less than 0.4%. Then, the influence rules of the sensitive structure of the sensor on friction measurement accuracy under turbulent flow and laminar flow conditions are systematically analyzed using 3D numerical models of the sensor, respectively. Finally, the sensor-sensitive unit structure’s design criterion is obtained to improve skin friction’s measurement accuracy. Full article
(This article belongs to the Special Issue Design and Fabrication of Micro/Nano Sensors and Actuators, Volume II)
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