Self-Assembly Circuits and Systems for Wireless Applications
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "E：Engineering and Technology".
Deadline for manuscript submissions: 30 May 2025 | Viewed by 718
Special Issue Editor
Interests: microwave substrate integrated circuits and systems; wireless communications; optical and imaging processing
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
With the rapid development of wireless applications such as communication, sensing, tracking, localizing and positioning in recent decades, the demand for system integration has been increasing. System-on-chip (SoC) and system-in-packing (SiP) are two of the mainstream approaches to realizing system integration, following on from the concept of system-on-packaging (SoP) but with a stronger emphasis on system-scale concepts to develop ultra-miniaturized, multi-functional and highly integrated systems such as smartphones. For SiP and SoP, the assembly and interconnection of components, circuits and systems are of high importance owing to their significant influence on the system performance. Therefore, this Special Issue focuses on the recent development of self-assembly components, circuits, systems and applications. Hence, the materials, modeling, processing and integration of various wireless scenarios of both self-assembly and non-self-assembly circuits and systems in high-speed/high-frequency/microwave/lightwave modes are of particular interest. Topics of interest include, but are not limited to, the following:
- Self-assembly and non-self-assembly components, circuits, modules and systems in 2D and 3D form for high-speed, high-frequency, radio-frequency, microwave, millimeter-wave, Terahertz, inferred and lightwave applications.
- Modeling methods, material development and characterization and fabrication processes, including epoxy growth/inkjet-printing/3D-printing/micromachining, of self-assembly circuits and systems.
- The development of high-performance elements, components and interconnections for non-self-assembly circuits and system integration.
- Measurements and wireless applications, including communication, sensing, imaging, detection, tracking, localizing, positioning and timing of self-assembly circuits, systems and non-self-assembly integration.
Dr. Yong Mao Huang
Guest Editor
Manuscript Submission Information
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Keywords
- assembly
- interconnection and packaging
- system integration
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