Heat Management in Microdevices
A special issue of Micromachines (ISSN 2072-666X).
Deadline for manuscript submissions: closed (31 July 2021) | Viewed by 2524
Special Issue Editor
Interests: low dimensional materials; nanomanufacturing; thermal science; sensing
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Thermal management in micro/nanosystems is hailed as a revolutionary field for practical applications. According to Moore’s law, the size of electronic devices and circuitry is decreasing, and their number keeps increasing. The resultant change on thermal management will challenge device performance, including measurement reliability and durability of material component stability, electric transports, and data communication. Discovering and understanding thermal properties in micro- and nanoscale devices and realizing an efficient performance of micro/nanosystems is fundamentally important to harnessing thermal management in the field of micro/nanoelectronics. This Special Issue will cover fundamental thermal transport theory and modeling of micro/nanosystems and elucidate how thermal management can improve device performance. Interdisciplinary topics in thermal science at the interaction of electrical engineering, mechanical engineering, materials science, and physics will be welcomed to accelerate the understanding of thermal management in micro/nanosystems.
Dr. Xian Zhang
Guest Editor
Manuscript Submission Information
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Keywords
- micro/nanosystems
- thermal management
- thermal transport
- thermoelectric
- electronic devices
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