Topical Advisory Panel for section 'D:Materials and Processing'

Please see the section webpage for more information on this section.

Members


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Department of Technologies and Equipment for Materials Processing, Faculty of Materials Science and Engineering, Technical University Gheorghe Asachi of Iasi, 700050 Iasi, Romania
Interests: materials science; durability of materials in civil engineering; sustainable cementitious materials; metallic alloys; biomaterials; biodegradable alloys; biomaterials characterization; coatings and thin films
Special Issues, Collections and Topics in MDPI journals
Department of Materials Engineering, Tallinn University of Technology | TTU, Tallinn, Estonia
Interests: additive manufacturing; powder metallurgy; finite element analysis
Special Issues, Collections and Topics in MDPI journals

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CSIR-National Physical Laboratory, New Delhi 110012, India
Interests: nanomaterials; solar cells; gas sensors; photo detectors; thermoelectric; thin film
Special Issues, Collections and Topics in MDPI journals

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Mechanical Engineering, Gachon University, Seongnam 13120, Republic of Korea
Interests: triboelectric nanogenerators; hydrogels; soft robotics; ionotronics

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P.N. Lebedev Physical Institute of the Russian Academy of Sciences, Moscow 119991, Russia
Interests: laser-fabricated nanomaterials and structures; ultrashort-pulse laser nanoplasmonics; nanoparticles
Special Issues, Collections and Topics in MDPI journals
Department of Mechatronics Engineering, Parul University, Vadodara, Gujarat, India
Interests: micro-optics; metamaterials; metasurfaces; micro and nanofabrication; optical materials; electromagnetic materials; instrumentation; sensors; flexible electronics

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Faculty of Engineering and Natural Sciences, Kadir Has University, Cibali, Fatih, Istanbul 34083, Turkey
Interests: polymers; thin films; composite materials; biomedical applications; electronic applications; optical properties

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Lam Research Corporation, 4650 Cushing Parkway, Fremont, CA 94538, USA
Interests: advanced packaging; heterogenous integration; wafer level packaging; SiP; hybrid bonding; batteries; electrodeposition; electrochemistry; semiconductor fabrication; thin films; atomic layer deposition

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School of Mechanical Engineering, Shandong University, Jinan 250061, China
Interests: precision and ultra-precision abrasive machining; diamond wire saw slicing technology; semiconductor abrasive processing
Special Issues, Collections and Topics in MDPI journals
School of Mechanical Engineering and Automation, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, China
Interests: micromachining; ultra-precision machining; vibration-assisted machining; functional engineering surfaces; miniature tool design
Institute of Aerospace Science and Technology, School of Remote Sensing and Information Engineering, Wuhan University, Wuhan, China
Interests: adaptive optics; active optics; vibration control; precision mechanics; mechatronics
Special Issues, Collections and Topics in MDPI journals

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Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing 100124, China
Interests: precision micro/nano mould fabrication technologies; nanoimprinting technology; advanced applications of functional micro/nano structured surfaces; atomic and close to atomic-scale manufacturing
Special Issues, Collections and Topics in MDPI journals
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