Combined Pulse Laser: A Reliable Tool for High-Quality, High-Efficiency Material Processing
A special issue of Photonics (ISSN 2304-6732). This special issue belongs to the section "Optical Interaction Science".
Deadline for manuscript submissions: 30 November 2024 | Viewed by 1071
Special Issue Editors
Interests: ultrafast laser micro/nano processing; nanomaterials; laser welding; laser ablation
Special Issues, Collections and Topics in MDPI journals
Interests: combined pulse laser; laser processing; laser damage; laser welding; laser drilling
Interests: ultrafast laser micro/nanofabrication; multiscale modeling of ultrafast laser-material interactions; novel micro/nanophotonic materials, structures, and devices
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
With wide applicability and low-cost processing advantages, laser processing, as a mature and versatile tool, is forming an alternative to conventional processing technologies. In recent years, combined pulse laser (CPL), one of the hybrid laser processing technologies, has proven to be a reliable tool for high-quality and high-efficiency processing through the processing advantages of different types of lasers and controlling the laser–matter interaction.
The basic idea of using CPL to process materials is to improve the material removal rate (MRR) by controlling the temporal or spatial profiles of CPL to meet the different laser energy requirements during the laser–matter interaction. Thus, the CPL method has driven the exploration to optimize the laser–matter interactions, and started the race toward these and many other attractive goals. Up to now, the ideas of developing CPL have been explored for improving the efficiency and quality of laser processing in a wealth of applications, such as ablation, drilling, welding, cutting, cleaning, and annealing.
This Special Issue aims at presenting original state-of-the-art research articles dealing with the fundamentals and application of the CPL processing methods. Researchers are invited to submit their contributions to this Special Issue. Topics include, but are not limited to, the following:
- Theoretical analysis of the CPL–matter interaction;
- Evolution of CPL-excited plasmas;
- Multiple types of applications for CPL processing methods;
- Process study of CPL processing;
- Temporal and spatial shaping CPL processing methods;
- Multi-timescale in situ observations of CPL processing.
We look forward to receiving your contributions.
Dr. Xianshi Jia
Prof. Dr. Xiao Zhu
Prof. Dr. Cong Wang
Guest Editors
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Keywords
- combined pulse laser
- laser–matter interaction
- laser processing
- temporal and spatial shaping
- laser plasma
- in situ observations
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