Photonic Integration: Technologies and Applications
A special issue of Photonics (ISSN 2304-6732). This special issue belongs to the section "Optoelectronics and Optical Materials".
Deadline for manuscript submissions: closed (31 December 2021) | Viewed by 7388
Special Issue Editors
Interests: photonics; optical communications; optical networks; optical computing; optical signal processing
Interests: orbital angular momentum; chip; metamaterials
Interests: nanophotonics; acoustic metamaterials; optical 3D printing
Special Issue Information
Dear Colleagues,
Photonic integration appears to be a revolutionary technological breakthrough similar to the one that happened with electronics in the 20th century. It has put photonic technologies on a new, dramatically growing track. The development of ultrasmall and high-bandwidth electro-optic modulators, low-noise frequency synthesizers, chip-scale signal processors with orders-of-magnitude enhanced spectral resolution, plus complete integration of semiconductor-based light sources, modulators, and detectors in a single photonic chip has ushered the creation of multifunctional and reconfigurable photonic integrated circuits (PIC) similar to electronic circuits. PIC provide unparalleled performance in terms of bandwidth, power efficiency, footprint, and cost savings at all levels of the hierarchy, deploying a wealth of photonic integration platforms, spanning from electro-optic boards to silicon photonics, III–V materials, and novel materials.
The possible applications of PIC range from optical communication (including but not limited to free space, 5 and 6G, QKD), microwave photonics, structural health monitoring, optical clocks, optical computers, and emulators to biomedical and agricultural photonics.
The forecasted market capacity for the PIC in practically all technological areas is expected to exceed USD 1.5 billion by 2023. Some of the key players are Agilent Technologies, Inc. (US), Aifotec AG (Germany), Alcatel-Lucent SA (France), Broadcom Inc. (US), Ciena Corporation (US), CyOptics Inc. (US), EMCORE Corporation (US), Enablence Technologies Inc. (Canada), Finisar Corporation (US), Hewlett-Packard Company (US), Infinera Corporation (US), Intel Corporation (US), JDS Uniphase Corporation (US), Kaiam Corporation (US), and Mellanox Technologies Ltd (US). These players contribute majorly toward market growth. Others (Luxtera Inc. (US), NeoPhotonics Corp (US), Oclaro Inc. (US), OneChip Photonics Inc. (US), TE Connectivity (Switzerland), etc.) contribute nearly 30–35% on the PIC market.
The goal of this Special Issue is to attract contributions from world-leading experts in the area of PIC in an effort to offer an overview of the field with a particular emphasis on major advances and outstanding challenges. The accepted contributions will include visionary works emphasizing state-of-the-art design, technological breakthroughs, experimental verifications, proof-of-concept demonstrations, and industrial applications.
All papers need to present original, previously unpublished work and will be subject to the normal standards and peer-review processes of the journal. Manuscripts must be prepared according to the usual standards for submission to Photonics and uploaded through the MDPI electronic submission system.
Prof. Dr. Franko Küppers
Prof. Dr. Arkadi Shipulin
Prof. Dr. Nicholas Xuanlai Fang
Prof. Dr. Idelfonso Tafur Monroy
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Photonics is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- photonic integrated circuits (PIC)
- PIC in optical communication
- PIC in optical computing
- PIC in microwave photonics
- PIC in quantum key distribution
- PIC in quantum computing
- PIC in structural health monitoring
- PIC-based neural networks
- PIC in bio-photonics
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