sensors-logo

Journal Browser

Journal Browser

Intelligent Mechatronic Systems—Materials, Sensors and Interfaces: 2nd Edition

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Intelligent Sensors".

Deadline for manuscript submissions: closed (30 June 2024) | Viewed by 2034

Special Issue Editors


E-Mail Website
Guest Editor
Department of Mechatronics, Faculty of Electrical Engineering, Silesian University of Technology, Akademicka 10A, 44-100 Gliwice, Poland
Interests: modelling of branched kinematic chains of hard disk drives positioning systems, electromechanical transducers used in biomedical engineering; homogeneous transformations in the modelling of energy harvesting systems; torque converters and drilling techniques using torsional vibrations; methods of inverting block matrices

E-Mail Website
Guest Editor
Department of Theoretical and Applied Mechanics, Silesian University of Technology, Konarskiego 18a, 44-100 Gliwice, Poland
Interests: dynamics of electromechanical systems; feedback control of dynamic systems; vibration with control; smart materials; smart sensors
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
Faculty of Mechatronics and Electrical Engineering, Maritime University of Szczecin, 70-500 Szczecin, Poland
Interests: modeling and research of machining processes; dynamics of machine tools and robots; designing of machine diagnostic systems; intelligent man-machine interfaces and mechatronics
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
Department of Applied Mechanics and Robotics, Faculty of Mechanical Engineering and Aeronautics, Rzeszow University of Technology, 35-959 Rzeszow, Poland
Interests: programing of industrial robots, vision systems and image processing, implementation of mobile robots control systems, path planning tasks, behavioural control and robots formation control, modeling of mechanical systems

Special Issue Information

Dear Colleagues,

Due to the high interest of scientists in the first edition of Special Issue "Intelligent Mechatronic Systems—Materials, Sensors and Interfaces" published in Sensors journal, editors decided to continue this series as a second volume. Taking into account the balanced coverage of all scientific areas, the group of guest editors has been extended for the needs of the special issue.

Thematic scope of the special issue:

  • intelligent mechatronic systems in manufacturing and industrial robotics;
  • intelligent mechatronic systems and cyber-physical production systems;
  • intelligent mechatronic systems using Internet of Things (IoT);
  • intelligent mechatronic systems in smart factories;
  • decision support systems using artificial intelligence methods for mechatronic systems;
  • innovative human–machine interactions for intelligent mechatronic systems;
  • industrial big data analytics in Industry 4.0;
  • artificial intelligence applications in mechatronic systems;
  • intelligent materials;
  • innovative use of new materials;
  • testing the properties and structure of materials in Industry 4.0.

Prof. Dr. Tomasz Trawiński
Prof. Dr. Sławomir Duda
Prof. Dr. Mirosław Pajor
Dr. Andrzej Burghardt
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • mechatronic systems
  • intelligent materials
  • control systems
  • robotics
  • electromechanical systems dynamics
  • vibration and control
  • smart sensors
  • human–machine interface and teaming
  • autonomous robotics
  • Industry 4.0

Benefits of Publishing in a Special Issue

  • Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
  • Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
  • Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
  • External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
  • e-Book format: Special Issues with more than 10 articles can be published as dedicated e-books, ensuring wide and rapid dissemination.

Further information on MDPI's Special Issue polices can be found here.

Related Special Issue

Published Papers (1 paper)

Order results
Result details
Select all
Export citation of selected articles as:

Research

15 pages, 3766 KiB  
Article
Identifying the Sweet Spot of Padel Rackets with a Robot
by Carlos Blanes, Antonio Correcher, Jaime Martínez-Turégano and Carlos Ricolfe-Viala
Sensors 2023, 23(24), 9908; https://doi.org/10.3390/s23249908 - 18 Dec 2023
Viewed by 1512
Abstract
Although the vibration of rackets and the location of the sweet spot for players when hitting the ball is crucial, manufacturers do not specify this behavior precisely. This article analyses padel rackets, provides a solution to determine the sweet spot position (SSP), quantifies [...] Read more.
Although the vibration of rackets and the location of the sweet spot for players when hitting the ball is crucial, manufacturers do not specify this behavior precisely. This article analyses padel rackets, provides a solution to determine the sweet spot position (SSP), quantifies its behavior, and determines the level of vibration transmitted along the racket handle. The proposed methods serve to locate the SSP without quantifying it. This article demonstrates the development of equipment capable of analyzing the vibration behavior of padel rackets. To do so, it employs a robot that moves along the surface of the padel racket, striking it along its central line. Accelerometers are placed on a movable cradle where rackets are positioned and adjusted. A method for analyzing accelerometer signals to quantify vibration severity is proposed. The SSP and vibration behavior along the central line are determined and quantified. As a result of the study, 225 padel rackets are analyzed and compared. SSP is independent of the padel racket shape, balance, weight, moment of inertia, and padel racket shape (tear, diamond, or round) and is not located at the same position as the center of percussion. Full article
Show Figures

Figure 1

Back to TopTop