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Temperature Sensors 2019
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Temperature Sensors 2019

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Physical Sensors".

Deadline for manuscript submissions: closed (15 July 2020) | Viewed by 8455

Special Issue Editor

Dr. Tomoyuki Yokota

E-Mail Website
Guest Editor
Department of Electrical Engineering and Information Systems, School of Engineering, The University of Tokyo, Bunkyo-ku, Tokyo 113-8656, Japan
Interests: temperature sensor; organic electronics; flexible sensor; printed electronics; wearbale sensor
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Temperature sensors play an important role in industry and research, such as in controlling process temperatures, chemical reactions, and also for use in agriculture. Another important application of temperature sensors is the measurement of body temperature. The accurate measurement of localized temperature changes is important for understanding the thermal phenomena of homeostasis and realizing future sophisticated health diagnostics. For this reason, temperature sensors are integrated into wearables electronics to monitor body temperature.

The aim of this Special Issue is to cover a wide range of topics, including materials, fabrication process, mechanisms, and applications of temperature sensors for improving human life.

Both review articles and original research papers relating to temperature sensors are welcome.

Dr. Tomoyuki Yokota
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Temperature sensors
  • Electronic skin
  • Biomedical applications
  • Characterization
  • Fabrication process
  • Flexible electronics
  • Printed electronics
  • Composite material

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Published Papers (2 papers)

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Research

14 pages, 4037 KiB  
Article
Investigation of the Effect of Process Parameters on Bone Grinding Performance Based on On-Line Measurement of Temperature and Force Sensors
by Lihui Zhang, Lei Zou, Donghui Wen, Xudong Wang, Fanzhi Kong and Zhongyu Piao
Sensors 2020, 20(11), 3325; https://doi.org/10.3390/s20113325 - 11 Jun 2020
Cited by 13 | Viewed by 3337
Abstract
This study investigates the effect of process parameters on neurosurgical bone grinding performance using a miniature surgical diamond wheel. Bone grinding is an important procedure in the expanded endonasal approach for removing the cranial bone and access to the skull base tumor via [...] Read more.
This study investigates the effect of process parameters on neurosurgical bone grinding performance using a miniature surgical diamond wheel. Bone grinding is an important procedure in the expanded endonasal approach for removing the cranial bone and access to the skull base tumor via nasal corridor. Heat and force are generated during the grinding process, which may cause thermal and mechanical damage to the adjacent tissues. This study investigates the effect of grinding process parameters (including the depth of cut, feed rate, and spindle speed) on the bone grinding performance using temperature and force measurement sensors in order to optimize the grinding process. An orthogonal experimental design with a standard orthogonal array, L9 (33), is selected with each parameter in three levels. The experimental results have been statistically analyzed using the range and variance analysis methods in order to determine the importance order of the process parameters. The results indicate that the effect of the cutting depth on the grinding temperature and normal force is the largest, while the effect of the spindle speed on the tangential force is the largest. A high spindle speed would make the temperature rise to a certain extent; however, it significantly reduces the grinding force. At a certain spindle speed, a lower depth of cut and feed rate help to reduce the grinding temperature and force. Full article
(This article belongs to the Special Issue Temperature Sensors 2019)
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16 pages, 4861 KiB  
Article
400 °C Sensor Based on Ni/4H-SiC Schottky Diode for Reliable Temperature Monitoring in Industrial Environments
by Florin Draghici, Gheorghe Brezeanu, Gheorghe Pristavu, Razvan Pascu, Marian Badila, Adriana Pribeanu and Emilian Ceuca
Sensors 2019, 19(10), 2384; https://doi.org/10.3390/s19102384 - 24 May 2019
Cited by 20 | Viewed by 4444
Abstract
This paper presents a high-temperature probe suitable for operating in harsh industrial applications as a reliable alternative to low-lifespan conventional solutions, such as thermocouples. The temperature sensing element is a Schottky diode fabricated on 4H-SiC wafers, with Ni as the Schottky metal, which [...] Read more.
This paper presents a high-temperature probe suitable for operating in harsh industrial applications as a reliable alternative to low-lifespan conventional solutions, such as thermocouples. The temperature sensing element is a Schottky diode fabricated on 4H-SiC wafers, with Ni as the Schottky metal, which allows operation at temperatures up to 400 °C, with sensitivities over 2 mV/°C and excellent linearity (R2 > 99.99%). The temperature probe also includes dedicated circuitry for signal acquisition and conversion to the 4 mA–20 mA industrial standard output signal. This read-out circuit can be calibrated for linear response over a tunable temperature detection range. The entire system is designed for full electrical and mechanical compatibility with existing conventional probe casings, allowing for seamless implementation in a factory’s sensor network. Such sensors are tested alongside standard thermocouples, with matching temperature monitoring results, over several months, in real working conditions (a cement factory), up to 400 °C. Full article
(This article belongs to the Special Issue Temperature Sensors 2019)
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