Hu, D.; Zeng, X.; Lin, Y.; Chen, Y.; Chen, W.; Jia, Z.; Lin, J.
High Value-Added Reutilization of Waste-Printed Circuit Boards Non-Metallic Components in Sustainable Polymer Composites. Molecules 2023, 28, 6199.
https://doi.org/10.3390/molecules28176199
AMA Style
Hu D, Zeng X, Lin Y, Chen Y, Chen W, Jia Z, Lin J.
High Value-Added Reutilization of Waste-Printed Circuit Boards Non-Metallic Components in Sustainable Polymer Composites. Molecules. 2023; 28(17):6199.
https://doi.org/10.3390/molecules28176199
Chicago/Turabian Style
Hu, Dechao, Xianghong Zeng, Yinlei Lin, Yongjun Chen, Wanjuan Chen, Zhixin Jia, and Jing Lin.
2023. "High Value-Added Reutilization of Waste-Printed Circuit Boards Non-Metallic Components in Sustainable Polymer Composites" Molecules 28, no. 17: 6199.
https://doi.org/10.3390/molecules28176199
APA Style
Hu, D., Zeng, X., Lin, Y., Chen, Y., Chen, W., Jia, Z., & Lin, J.
(2023). High Value-Added Reutilization of Waste-Printed Circuit Boards Non-Metallic Components in Sustainable Polymer Composites. Molecules, 28(17), 6199.
https://doi.org/10.3390/molecules28176199