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Article

Comparison of Different Topologies of Thermal Management Subsystems in Multi-Stack Fuel Cell Systems

1
School of Automotive Studies, Tongji University, Shanghai 201804, China
2
Chinesisch-Deutsches Hochschulkolleg, Tongji University, Shanghai 201804, China
*
Authors to whom correspondence should be addressed.
Energies 2022, 15(14), 5030; https://doi.org/10.3390/en15145030
Submission received: 25 June 2022 / Revised: 6 July 2022 / Accepted: 7 July 2022 / Published: 10 July 2022
(This article belongs to the Special Issue Research and Development of Proton Exchange Membrane Fuel Cells)

Abstract

:
The performance of a fuel cell stack is affected by the operating temperature of the stack. The thermal management subsystem of a multi-stack fuel cell system (MFCS) is particularly significant for the operating temperature control of each stack in the MFCS. To study the influence of different topologies of a MFCS thermal management subsystem, this paper proposes and establishes two different topologies. Firstly, the integrated topology is proposed. Secondly, seven component models, namely the mixer, thermostat, radiator, tank, pump, bypass value, and proton exchange membrane fuel cell stack temperature models, are described in detail. Finally, the performance of the two topologies of the MFCS thermal management subsystem under two working conditions, steady (200 A) and variable (China heavy-duty commercial test cycle, C-WTVC), is compared. Furthermore, there are two evaluating indicators, including the stability duration and deviation of the operating temperatures of the single stack in the MFCS. Results show that when the MFCS operates under steady working conditions, the integrated topology is superior in operating temperature control accuracy ( Δ T < 0.5   K ), while the distributed topology is superior in the adjustment process ( t     100   s ). Moreover, when the MFCS operates under variable working conditions, the distributed topology is superior in operating temperature control accuracy.

1. Introduction

Due to environmental protection and greenhouse gas emissions, the development of new energy resources is becoming a significant measure for governments [1]. Among them, hydrogen energy is a promising candidate because it has zero emissions, high power density, and a wide variety of sources [2]. The fuel cell system using hydrogen energy is developing rapidly [3]. However, with the enrichment of application scenarios for fuel cell systems, the requirement for its power level is becoming higher and higher [4,5]. It is difficult for a single fuel cell stack to meet the requirement because of uniformity, cost, and technology issues [5]. The multi-stack fuel cell system (MFCS) can solve these issues, and it has several advantages such as immense power, high efficiency, and a long lifespan [6]. It is widely known that the operating temperature is important to the fuel cell system because it determines the performance and normal operation of the fuel cell system [7]. In the MFCS, the thermal subsystem plays a significant role in controlling the operating temperature. Therefore, it is necessary to study the thermal subsystem of the MFCS. It is noted that the thermal management subsystem consisting of seven component models is applied to control the operating temperature of each stack in the MFCS. Each component has its function. For example, the mixer model is applied to filter different outlet coolant temperatures of the multi-stack into a temperature. The thermostat model is applied to control the large and small cycles of the coolant. The radiator model is applied to calculate the heat dissipation. The tank model is applied to store the coolant. The pump model is applied to provide the flow rate of the coolant. The bypass value model is applied to control the coolant flow rate of each stack. The proton exchange membrane fuel cell (PEMFC) stack temperature model is applied to calculate the stack heat production.
Unfortunately, there are few works about the thermal subsystem of the MFCS because of few MFCS applications [5]. In our opinion, there are four aspects of thermal subsystem research: topology, architecture, component selection, and control algorithm/strategy. For thermal subsystem topology, there are two topologies: distributed and integrated. Wu et al. [8] showed an actual 65 kW dual-stack PEMFC system, which arranges a parallel coolant pipeline. The thermal subsystem is used by the integrated topology. Moreover, the architecture is determined after the determination of the topology. For the thermal subsystem architecture, Dépature et al. [9] proposed the series- and parallel-type architectures and pointed out the advantages and disadvantages of the two architectures. In the series type, the coolant flows to each stack in sequence. In the parallel type, the coolant flows to each stack at the same time. It is noted that the integrated topology was used in two architectures of their work. For the component selection, the thermal subsystem components of the MFCS are similar to those of the single fuel cell stack. Therefore, the component selection can be conducted according to specific requirements. For the control algorithm/strategy, Mohamed et al. [10] proposed a thermal management control algorithm to control the operating temperature of each stack in the MFCS. In their algorithm, the excess heat quantity produced by the operating stack could preheat the next stack. There are three benefits, namely shortening the startup time of the next stack, saving energy, and improving the MFCS response. Furthermore, de Bortoli et al. [11] proposed a thermal management strategy to minimize the startup, heating/cooling, and cycling issues inside the EV. Results show that the appropriate thermal management strategy is helpful to improve the life span, cycling, and efficiency of the MFCS.
This paper fills the modeling gap of the MFCS thermal subsystem. It designs, models, and compares two different topologies of the MFCS. Firstly, two different topologies, distributed and integrated, are proposed. On the one hand, the distributed topology consists of three independent thermal management subsystems. On the other hand, the integrated topology consists of only one thermal management subsystem. Secondly, seven component models, namely the mixer, thermostat, radiator, tank, pump, bypass value, and PEMFC stack temperature, are described in detail. Finally, the performance of the two topologies of the MFCS thermal management subsystem under two working conditions, steady and variable, is compared.

2. Topology of the MFCS Thermal Management Subsystem

Depending on whether it is integrated or not, there are two topologies of the MFCS thermal management subsystem. In this paper, the MFCS consists of three stacks, and detailed topologies are shown in Figure 1a,b. On the one hand, the distributed topology consists of three independent thermal management subsystems. On the other hand, the integrated topology consists of only one thermal management subsystem. The advantages and disadvantages of the two topologies are shown in Table 1. Moreover, the thermal management subsystem includes several components, such as the tank, pump, deionizer, thermostat, and radiator.

3. Component Models of the MFCS Thermal Management Subsystem

This section describes the main seven component models: the mixer, thermostat, radiator, tank, pump, bypass value, and PEMFC stack temperature models.

3.1. Mixer Model

The mixer model consists of two parts: the flow rate and temperature. The coolant flow rate of the mixer outlet can be represented in the form below:
W co _ mixer _ out = i = 1 3 W co _ st ( i ) _ out
where W co _ mixer _ out is the coolant flow rate of the mixer outlet, kg / s ; W co _ st ( i ) _ out is the coolant flow rate of the ith stack outlet, kg / s , i = 1, 2, 3.
It is assumed that the mixer does not exchange heat with the environment, so only the heat exchange between coolants with different temperatures occurs inside the mixer. The coolant temperature of the mixer outlet can be represented in the form below:
T co _ mixer _ out = i = 1 3 W co _ st ( i ) _ out T co _ st ( i ) _ out i = 1 3 W co _ st ( i ) _ out
where T co _ mixer _ out is the coolant temperature of the mixer outlet, K; T co _ st ( i ) _ out is the coolant temperature of the ith stack outlet, K, i = 1, 2, 3.
It is noted that the coolant temperature change is described by the first-order inertia link. The time constant can be determined by the experiment or experience. Moreover, it determines the stability time of the coolant temperature. In this paper, the time constant is set to 0.5 s.
The input and output and the Simulink model of the mixer are shown in Figure 2 and Figure 3. The input of the mixer includes flow rates and temperatures of the three stacks’ coolants (Co_ includes the flow rate and the temperature of the coolant), and the output includes the flow rate and temperature of the mixer outlet.

3.2. Thermostat Model

The thermostat model also consists of two parts: the flow rate and temperature. The coolant flow rate and temperature of the thermostat inlet can be represented in the form below:
T co _ thermostat _ in = T co _ mixer _ out
W co _ thermostat _ in = W co _ mixer _ out
where T co _ thermostat _ in is the coolant temperature of the thermostat inlet, K; W co _ thermostat _ in is the coolant flow rate of the thermostat inlet, kg/s.
The opening of the thermostat determines the proportion of the coolant flow rates of the big and small loops:
W co _ big = W co _ thermostat _ in · Phi _ bypass _ big
W co _ small = W co _ thermostat _ in · ( 1 Phi _ bypass _ big )
where W co _ big is the coolant flow rate of the big loop, kg/s; Phi _ bypass _ big is the opening of the thermostat; W co _ small is the coolant flow rate of the small loop, kg/s.
It is assumed that the thermostat does not exchange heat with the environment, so only the heat exchange between coolants with different temperatures occurs in the thermostat. The coolant temperature of the thermostat outlet can be represented in the form below:
T co _ big = T co _ thermostat _ in
T co _ small = T co _ thermostat _ in
where T co _ big and T co _ small are coolant temperatures of the big and small loop, respectively, K.
The input and output and the Simulink model of the thermostat are shown in Figure 4 and Figure 5. The input of the thermostat includes the opening of the thermostat, coolant flow rate, and temperature of the thermostat inlet, and the output includes flow rates and temperatures of the big and small loops.

3.3. Radiator Model

The flow rate of the radiator is equal to that of the big loop, and it can be represented in the form below:
W co _ rad _ out = W co _ big
The cooling capacity of the radiator is affected by its surface wind speed, heat dissipation area, ambient temperature, and installation position. Moreover, the surface wind speed is determined by vehicle and fan speeds and measured by the experiment. The relationship between the surface wind speed and vehicle and fan speeds obtained by the experimental data fitting can be represented in the form below:
v w = 0.1568 + 0.0015846 × n fan + 0.02233 × v
where v w is the surface wind speed, m/s; n fan is the fan speed, rpm; v is the vehicle speed, km/h.
When the ambient temperature and the radiator size are determined, the cooling capacity is determined by the surface wind speed and coolant flow rate, and the relationship can also be measured by the experiment. The LUT ( W co _ big , v wind ) applied in this model is shown in Figure 6.
The above relationship is obtained when the temperature difference between the coolant inlet and ambient temperature is 60 K. Moreover, the modified relationship is represented in the form below when the ambient temperature is changing:
Q ˙ rad _ rel = Q ˙ rad _ exp ( T co _ big T amb 60 )
where Q ˙ rad _ rel is the real cooling capacity of the radiator, kW; Q ˙ rad _ exp is the theoretical cooling capacity of the radiator, kW; T amb is the ambient temperature, K.
According to the heat transfer equation, the coolant temperature of the radiator outlet is represented in the form below:
T ˙ co _ rad _ out = C co W co _ rad _ out ( T co _ big T co _ rad _ out ) Q ˙ rad _ rel m co _ rad W co _ rad _ out
where T ˙ co _ rad _ out is the coolant temperature change rate of the radiator outlet, K / s ; C co is the specific heat capacity, J / ( kg · K ) ; T co _ rad _ out is the coolant temperature of the radiator outlet, K ; m co _ rad is the coolant mass inside the radiator, kg .
The input and output and the Simulink model of the radiator are shown in Figure 7 and Figure 8. The input of the radiator includes the fan speed, vehicle speed, coolant flow rate and temperature of the big loop, and ambient temperature. In addition, the output includes the coolant flow rate and temperature of the radiator outlet.

3.4. Tank and Pump Model

The temperature of the tank outlet is determined by the coolant states of the radiator outlet, small loop, and the remaining coolant in the tank, and it can be represented in the form below:
T co _ tank _ out = W co _ rad _ out T co _ rad _ out + W co _ small T co _ small + W co _ tank T co _ tank _ out W co _ rad _ out + W co _ small + W co _ tank
where T co _ tank _ out is the temperature of the tank outlet, K ; W co _ rad _ out is the coolant flow rate of the radiator outlet, kg / s ; W co _ small is the coolant flow rate of the small loop, kg / s ; W co _ tank is the coolant flow rate of the remaining coolant in the tank, kg / s ; T co _ rad _ out is the coolant temperature of the radiator outlet, K ; T co _ small is the coolant temperature of the small loop, K .
The coolant flow rate of the tank outlet is determined by the pump and can be represented in the form below:
W co _ rad _ out = W co _ pump _ out
where W co _ pump _ out is the coolant flow rate of the pump outlet, kg / s .
The input and output and the Simulink model of the tank and pump are shown in Figure 9 and Figure 10. The input of the tank and pump includes the coolant flow rates and temperatures of the radiator outlet and small loop. Additionally, the output includes the coolant flow rate and temperature of the tank outlet.

3.5. Bypass Value Model

Coolant flow rates of different loops are determined by the coolant flow rate and opening of the bypass:
W co _ 1 = W co _ bypass _ in · Phi bypass
W co _ 2 = W co _ bypass _ in ( 1 Phi bypass )
where W co _ i is the coolant flow rate flowing to the ith stack, kg / s ; W co _ bypass _ in is the coolant flow rate flowing to the bypass, kg / s ; Phi bypass is the bypass opening.
It is assumed that the temperature flowing to the bypass is not changed:
T co _ 1 = T co _ 2 = T co _ bypass _ in
where T co _ i is the temperature flowing to the ith stack, K ; T co _ bypass _ in is the temperature flowing to the bypass, K .
The input and outputand the Simulink model of the bypass are shown in Figure 11 and Figure 12. The input of the bypass includes the bypass opening, coolant flow rate and temperature of the bypass inlet. In addition, the output includes the coolant flow rates and temperatures of different loops.

3.6. PEMFC Stack Temperature Model

The PEMFC stack temperature is determined by four parts: the stack heat generation, natural convection, radiation convection, and force convection (radiator heat dissipation):
Q ˙ st = Q ˙ add Q ˙ conv _ nat Q ˙ conv _ rad Q ˙ conv _ force
where Q ˙ st is the stack heat change, W ; Q ˙ add is the stack heat generation, W ; Q ˙ conv _ nat is the natural convection, W; Q ˙ conv _ rad is the radiation convection, W ; Q ˙ conv _ force is the forced convection, W.
Q ˙ st = C st m st d T st d t
Q ˙ add = ( n cell E nernst V st ) I st + ( Q ˙ in Q ˙ out ) react
Q ˙ conv _ rad = A st _ exterior × 0.85 × 5.67 × 10 8 × ( T st 4 T amb 4 )
Q ˙ conv _ nat = h st A st _ exterior ( T st T amb )
Q ˙ conv _ force = C co W co _ st _ in ( T st T co _ st _ in )
where:
Q ˙ in = C p O 2 W O 2 _ in ( T ca _ in T amb ) + C p N 2 W N 2 _ ca _ in ( T ca _ in T amb ) + C p N 2 W N 2 _ an _ in ( T an _ in T amb ) + C p H 2 W H 2 _ in ( T an _ in T amb ) + C p vap W vap _ ca _ in ( T ca _ in T amb ) + C p vap W vap _ an _ in ( T an _ in T amb )
Q ˙ out = C p O 2 W O 2 _ out ( T ca _ out T amb ) + C p N 2 W N 2 _ ca _ out ( T ca _ out T amb ) + C p N 2 W N 2 _ an _ out ( T an _ out T amb ) + C p H 2 W H 2 _ out ( T an _ out T amb ) + C p vap W vap _ ca _ out ( T ca _ out T amb ) + C p vap W vap _ an _ out ( T an _ out T amb )
where C st is the stack-specific heat capacity, J / ( kg · K ) ; m st is the stack mass, kg ; T st is the stack temperature, K ; n cell is the number of the single fuel cell in the stack; E nernst is Nernst voltage, V ; V st is the stack voltage, V ; A st _ exterior is the external surface area of the stack, m 2 ; T amb is the ambient temperature, K ; h st is the convective heat transfer coefficient, W / ( m 2 · K ) ; C co is the coolant-specific heat capacity,   J / ( kg · K ) ; T co _ st _ in is the coolant temperature of the stack inlet, K ; C p O 2 is the O2-specific heat capacity,   J / ( kg · K ) ; C p N 2 is the N2-specific heat capacity,   J / ( kg · K ) ; C p H 2 is the H2-specific heat capacity,   J / ( kg · K ) ; C p vap is the vapor-specific heat capacity,   J / ( kg · K ) ; T ca _ in is the cathode inlet temperature, K ; T an _ in is the anode inlet temperature, K ; W N 2 _ ca _ in is the N2 flow rate of the cathode inlet, kg / s ;   W O 2 _ in is the O2 flow rate of the cathode inlet, kg / s ;   W vap _ ca _ in is the vapor flow rate of the cathode inlet, kg / s ; W N 2 _ an _ in is the N2 flow rate of the anode inlet, kg / s ; W H 2 _ in is the H2 flow rate of the anode inlet, kg / s ; T ca _ out is the cathode outlet temperature, K ; T an _ out is the anode outlet temperature, K ; W N 2 _ ca _ out is the N2 flow rate of the cathode outlet, kg / s ;   W O 2 _ out is the O2 flow rate of the cathode outlet, kg / s ; W vap _ ca _ out is the vapor flow rate of the cathode outlet, kg / s ; W N 2 _ an _ out is the N2 flow rate of the anode outlet, kg / s ; W H 2 _ out is the H2 flow rate of the anode outlet, kg / s .
The input and outputand the Simulink model of the stack temperature are shown in Figure 13 and Figure 14. The input of the stack temperature includes the current, voltage of the stack, H2, O2, N2 and vapor flow rates of the inlet and outlet, coolant flow rate of the stack inlet, reacant temperatures of the inlet and outlet, ambient temperature, and coolant temperature rate of the stack inlet. In addition, the output includes the stack temperature, coolant flow rate and temperature of the stack outlet.

4. Results and Discussion

This section compares the performance of the two topologies of the MFCS thermal management subsystem under two working conditions: steady and variable. Steady (200 A) and variable (China heavy-duty commercial test cycle, C-WTVC) working conditions are shown in Figure 15a,b. There are two evaluating indicators: the stability duration and deviation of the operating temperatures of the single stack in the MFCS. It is noted that for the evaluation index of the thermal management, besides stability duration and deviation of the operating temperatures, there are also the power consumption and life of the thermal management subsystem. However, in the whole MFCS, the power consumption of the thermal management subsystem accounts for only less than 1% of the power provided by the MFCS, while the power consumption of the compressor (supply air) accounts for 10~20% of the power provided by the MFCS. Therefore, the power consumption of the thermal management is negligible. Moreover, the life of the thermal management subsystem is much longer than that of the MFCS. So, the life of the thermal management subsystem is also negligible.

4.1. Steady Working Conditions

The three stacks’ temperatures of the two topologies when the MFCS operates under steady working conditions are shown in Figure 16a,b. On the one hand, the temperature overshoot of the distributed topology is large, and the operating temperature of this topology has a steady-state error. However, its advantage is the short stabilization time. Moreover, the temperature overshoot of three stacks is T st 3 > T st 2 > T st 1 . The possible reason is that the temperature has characteristics of a strong time delay and slow response, and the heat transfer process is related to the quality of the stack ( m st 3 > m st 2 > m st 1 ). The reason for the steady-state error of the operating temperature is that the component selection is not completely matched due to the parameters of components. The stabilization time of the three stacks is the same because the thermal subsystem of each stack in this topology is independent of the others, and the temperature of each stack has no interference with the others. This is also the biggest advantage of this topology. On the other hand, the temperature overshoot of the integrated topology is minimal. However, it needs a long stabilization time. The reason is that the three stacks interfere with each other. Moreover, the temperature overshoot of the three stacks is T st 2 > T st 3 > T st 1 . The reason is that the coolant flow rate change of stack 2 is severe because it is at the intersection of two coolant flows. It is noted that the operating temperature adjustment of the integrated topology needs a longer time than that of the distributed topology because the coolant flow rates of the three stacks interfere with each other.
In this paper, the desired operating temperature is 348.15 K. The temperature overshoot is defined as the difference between the actual maximum operating temperatures during the adjustment process and the desired operating temperature. The stabilization time is defined as the adjustment process time. The temperature deviation is defined as the difference between the steady-state operating temperatures after the adjustment process and the desired operating temperature. A detailed comparison of the two topologies under steady working conditions is shown in Table 2. Results show that the temperature overshoot of the distributed topology is larger than that of the integrated topology, while the stabilization time of the distributed topology is shorter than that of the integrated topology. This means that when the MFCS operates under steady working conditions, the integrated topology is superior in operating temperature control accuracy, while the distributed topology is superior in the adjustment process.

4.2. Variable Working Conditions

The three stacks’ temperatures of the two topologies when the MFCS operates under variable working conditions are shown in Figure 17a,b. On the one hand, the operating temperature fluctuation of the distributed topology is obvious, and its range is 1 ~ 0.8 K . Operating temperature deviations in the three stacks are minimal. The operating temperature response of this topology is fast because each stack is separately controlled. On the other hand, the operating temperature fluctuation of the integrated topology is relatively moderate, and its range is 1 ~ 1.5 K . Operating temperature deviations in the three stacks are large. The operating temperature response of this topology is slow because the coordinate control is adopted among the stacks.
A detailed comparison of the two topologies under variable working conditions is shown in Table 3. Results show that the operating temperature difference of the distributed topology is smaller than that of the integrated topology. This means that when the MFCS operates under variable working conditions, the distributed topology is superior in operating temperature control accuracy because the operating temperature of each stack is controlled independently.

5. Conclusions

This paper compares the stability duration and deviation of the operating temperature between the distributed and integrated topologies of the MFCS. Detailed conclusions are as follows:
(1)
There are two topologies of the MFCS thermal management subsystem: the distributed and integrated topologies.
(2)
When the MFCS operates under steady working conditions, the integrated topology is superior in operating temperature control accuracy ( Δ T < 0.5   K ), while the distributed topology is superior in the adjustment process ( t     100   s ).
(3)
When the MFCS operates under variable working conditions, the distributed topology is superior in operating temperature control accuracy.

Author Contributions

W.S.: Conceptualization, Software, Writing—original draft, Project administration. L.F.: Software, Writing—original draft, Project administration, Formal analysis. Z.P.: Methodology, Software. C.C.: Validation, Data curation. N.W.: Funding acquisition, Resources, Supervision. S.Z.: Conceptualization, Methodology, Writing—review and editing, Funding acquisition, Supervision. All authors have read and agreed to the published version of the manuscript.

Funding

This research received no external funding.

Institutional Review Board Statement

Not applicable.

Informed Consent Statement

Not applicable.

Data Availability Statement

Not applicable.

Acknowledgments

This work was supported by Shanghai REFIRE Technology Co., Ltd.

Conflicts of Interest

The authors declare no conflict of interest.

References

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Figure 1. Topologies of the MFCS thermal management subsystem: (a) distributed and (b) integrated.
Figure 1. Topologies of the MFCS thermal management subsystem: (a) distributed and (b) integrated.
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Figure 2. The input and output of the mixer model.
Figure 2. The input and output of the mixer model.
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Figure 3. The Simulink model of the mixer.
Figure 3. The Simulink model of the mixer.
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Figure 4. The input and output of the thermostat model.
Figure 4. The input and output of the thermostat model.
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Figure 5. The Simulink model of the thermostat.
Figure 5. The Simulink model of the thermostat.
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Figure 6. The LUT of the radiator.
Figure 6. The LUT of the radiator.
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Figure 7. The input and output of the radiator model.
Figure 7. The input and output of the radiator model.
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Figure 8. The Simulink model of the radiator.
Figure 8. The Simulink model of the radiator.
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Figure 9. The input and output of the tank and pump model.
Figure 9. The input and output of the tank and pump model.
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Figure 10. The Simulink model of the tank and pump.
Figure 10. The Simulink model of the tank and pump.
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Figure 11. The input and output of the bypass model.
Figure 11. The input and output of the bypass model.
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Figure 12. The Simulink model of the bypass.
Figure 12. The Simulink model of the bypass.
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Figure 13. The input and output of the stack temperature model.
Figure 13. The input and output of the stack temperature model.
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Figure 14. The Simulink model of the stack temperature.
Figure 14. The Simulink model of the stack temperature.
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Figure 15. Two working conditions: (a) steady working conditions and (b) variable working conditions.
Figure 15. Two working conditions: (a) steady working conditions and (b) variable working conditions.
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Figure 16. Three stacks’ temperatures of the two topologies under steady working conditions: (a) distributed topology and (b) integrated topology.
Figure 16. Three stacks’ temperatures of the two topologies under steady working conditions: (a) distributed topology and (b) integrated topology.
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Figure 17. Three stacks’ temperatures of the two topologies under variable working conditions: (a) distributed topology and (b) integrated topology.
Figure 17. Three stacks’ temperatures of the two topologies under variable working conditions: (a) distributed topology and (b) integrated topology.
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Table 1. The advantages and disadvantages of the two topologies.
Table 1. The advantages and disadvantages of the two topologies.
AdvantagesDisadvantages
Distributed topologyIndependently controls each stack
operating temperature
A large number of components, high cost
Integrated topologyA small number of components, low costThe operating temperature of each stack
interferes with the others
Table 2. The detailed comparison of the two topologies under steady working conditions.
Table 2. The detailed comparison of the two topologies under steady working conditions.
ParameterDistributed TopologyIntegrated Topology
Stack1Stack2Stack3Stack1Stack2Stack3
Temperature overshoot (K)0.8360.9830.9780.3710.4840.397
Stabilization time (s)1005050>300>300>300
Temperature deviation (K)−0.0770.04−0.058---
Table 3. The detailed comparison of the two topologies under variable working conditions.
Table 3. The detailed comparison of the two topologies under variable working conditions.
ParameterDistributed TopologyIntegrated Topology
Stack1Stack2Stack3Stack1Stack2Stack3
Maximum temperature (K)348.738348.45348.611349.2349.165349.218
Minimum temperature (K)347.061347.577347.283347.142347.143347.144
Temperature difference (K)1.6770.8731.3282.0582.0222.074
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Shen, W.; Fan, L.; Pan, Z.; Chen, C.; Wang, N.; Zhou, S. Comparison of Different Topologies of Thermal Management Subsystems in Multi-Stack Fuel Cell Systems. Energies 2022, 15, 5030. https://doi.org/10.3390/en15145030

AMA Style

Shen W, Fan L, Pan Z, Chen C, Wang N, Zhou S. Comparison of Different Topologies of Thermal Management Subsystems in Multi-Stack Fuel Cell Systems. Energies. 2022; 15(14):5030. https://doi.org/10.3390/en15145030

Chicago/Turabian Style

Shen, Wei, Lei Fan, Zhirong Pan, Chunguang Chen, Ning Wang, and Su Zhou. 2022. "Comparison of Different Topologies of Thermal Management Subsystems in Multi-Stack Fuel Cell Systems" Energies 15, no. 14: 5030. https://doi.org/10.3390/en15145030

APA Style

Shen, W., Fan, L., Pan, Z., Chen, C., Wang, N., & Zhou, S. (2022). Comparison of Different Topologies of Thermal Management Subsystems in Multi-Stack Fuel Cell Systems. Energies, 15(14), 5030. https://doi.org/10.3390/en15145030

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