Article Versions Notes

Robinson J, Munagala SP, Arjunan A, Simpson N, Jones R, Baroutaji A, Govindaraman LT, Lyall I. Electrical Conductivity of Additively Manufactured Copper and Silver for Electrical Winding Applications. Materials. 2022; 15(21):7563. https://doi.org/10.3390/ma15217563

Robinson, John, Sai Priya Munagala, Arun Arjunan, Nick Simpson, Ryan Jones, Ahmad Baroutaji, Loganathan T. Govindaraman, and Iain Lyall. 2022. "Electrical Conductivity of Additively Manufactured Copper and Silver for Electrical Winding Applications" Materials 15, no. 21: 7563. https://doi.org/10.3390/ma15217563

Robinson, J., Munagala, S. P., Arjunan, A., Simpson, N., Jones, R., Baroutaji, A., Govindaraman, L. T., & Lyall, I. (2022). Electrical Conductivity of Additively Manufactured Copper and Silver for Electrical Winding Applications. Materials, 15(21), 7563. https://doi.org/10.3390/ma15217563