Chen, C.; Su, M.; Ma, R.; Zhou, Y.; Li, J.; Cao, L.
Investigation of Warpage for Multi-Die Fan-Out Wafer-Level Packaging Process. Materials 2022, 15, 1683.
https://doi.org/10.3390/ma15051683
AMA Style
Chen C, Su M, Ma R, Zhou Y, Li J, Cao L.
Investigation of Warpage for Multi-Die Fan-Out Wafer-Level Packaging Process. Materials. 2022; 15(5):1683.
https://doi.org/10.3390/ma15051683
Chicago/Turabian Style
Chen, Chuan, Meiying Su, Rui Ma, Yunyan Zhou, Jun Li, and Liqiang Cao.
2022. "Investigation of Warpage for Multi-Die Fan-Out Wafer-Level Packaging Process" Materials 15, no. 5: 1683.
https://doi.org/10.3390/ma15051683
APA Style
Chen, C., Su, M., Ma, R., Zhou, Y., Li, J., & Cao, L.
(2022). Investigation of Warpage for Multi-Die Fan-Out Wafer-Level Packaging Process. Materials, 15(5), 1683.
https://doi.org/10.3390/ma15051683