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Journal: Materials, 2024
Volume: 17
Number: 2150

Article: Effect of Cu Film Thickness on Cu Bonding Quality and Bonding Mechanism
Authors: by Tsan-Feng Lu, Kai-Ning Hsu, Ching-Chi Hsu, Chia-Yu Hsu and YewChung Sermon Wu
Link: https://www.mdpi.com/1996-1944/17/9/2150

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