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Journal: Micromachines, 2021
Volume: 12
Number: 750
750
Article: Geometrical Effects on Ultrasonic Al Bump Direct Bonding for Microsystem Integration: Simulation and Experiments
Authors: by Jun-Hao Lee, Pin-Kuan Li, Hai-Wen Hung, Wallace Chuang, Eckart Schellkes, Kiyokazu Yasuda and Jenn-Ming Song
Link: https://www.mdpi.com/2072-666X/12/7/750

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