Wei, G.; Wang, P.; Li, M.; Lin, Z.; Nai, C.
Simulation and Optimization of a Planar-Type Micro-Hotplate with Si3N4-SiO2 Transverse Composite Dielectric Layer and Annular Heater. Micromachines 2022, 13, 601.
https://doi.org/10.3390/mi13040601
AMA Style
Wei G, Wang P, Li M, Lin Z, Nai C.
Simulation and Optimization of a Planar-Type Micro-Hotplate with Si3N4-SiO2 Transverse Composite Dielectric Layer and Annular Heater. Micromachines. 2022; 13(4):601.
https://doi.org/10.3390/mi13040601
Chicago/Turabian Style
Wei, Guangfen, Pengfei Wang, Meihua Li, Zhonghai Lin, and Changxin Nai.
2022. "Simulation and Optimization of a Planar-Type Micro-Hotplate with Si3N4-SiO2 Transverse Composite Dielectric Layer and Annular Heater" Micromachines 13, no. 4: 601.
https://doi.org/10.3390/mi13040601
APA Style
Wei, G., Wang, P., Li, M., Lin, Z., & Nai, C.
(2022). Simulation and Optimization of a Planar-Type Micro-Hotplate with Si3N4-SiO2 Transverse Composite Dielectric Layer and Annular Heater. Micromachines, 13(4), 601.
https://doi.org/10.3390/mi13040601