Wang, W.; Liu, Z.; Qiu, D.; Zhu, Z.; Yan, N.; Ding, S.; Zhang, D.W.
A Method for Fast Au-Sn Bonding at Low Temperature Using Thermal Gradient. Micromachines 2023, 14, 2242.
https://doi.org/10.3390/mi14122242
AMA Style
Wang W, Liu Z, Qiu D, Zhu Z, Yan N, Ding S, Zhang DW.
A Method for Fast Au-Sn Bonding at Low Temperature Using Thermal Gradient. Micromachines. 2023; 14(12):2242.
https://doi.org/10.3390/mi14122242
Chicago/Turabian Style
Wang, Wenchao, Ziyu Liu, Delong Qiu, Zhiyuan Zhu, Na Yan, Shijin Ding, and David Wei Zhang.
2023. "A Method for Fast Au-Sn Bonding at Low Temperature Using Thermal Gradient" Micromachines 14, no. 12: 2242.
https://doi.org/10.3390/mi14122242
APA Style
Wang, W., Liu, Z., Qiu, D., Zhu, Z., Yan, N., Ding, S., & Zhang, D. W.
(2023). A Method for Fast Au-Sn Bonding at Low Temperature Using Thermal Gradient. Micromachines, 14(12), 2242.
https://doi.org/10.3390/mi14122242