Luis, E.; Pan, H.M.; Sing, S.L.; Bajpai, R.; Song, J.; Yeong, W.Y.
3D Direct Printing of Silicone Meniscus Implant Using a Novel Heat-Cured Extrusion-Based Printer. Polymers 2020, 12, 1031.
https://doi.org/10.3390/polym12051031
AMA Style
Luis E, Pan HM, Sing SL, Bajpai R, Song J, Yeong WY.
3D Direct Printing of Silicone Meniscus Implant Using a Novel Heat-Cured Extrusion-Based Printer. Polymers. 2020; 12(5):1031.
https://doi.org/10.3390/polym12051031
Chicago/Turabian Style
Luis, Eric, Houwen Matthew Pan, Swee Leong Sing, Ram Bajpai, Juha Song, and Wai Yee Yeong.
2020. "3D Direct Printing of Silicone Meniscus Implant Using a Novel Heat-Cured Extrusion-Based Printer" Polymers 12, no. 5: 1031.
https://doi.org/10.3390/polym12051031
APA Style
Luis, E., Pan, H. M., Sing, S. L., Bajpai, R., Song, J., & Yeong, W. Y.
(2020). 3D Direct Printing of Silicone Meniscus Implant Using a Novel Heat-Cured Extrusion-Based Printer. Polymers, 12(5), 1031.
https://doi.org/10.3390/polym12051031