Zhang, P.; Xue, S.; Liu, L.; Wang, J.; Tatsumi, H.; Nishikawa, H.
Influence of Isothermal Aging on Microstructure and Shear Property of Novel Epoxy Composite SAC305 Solder Joints. Polymers 2023, 15, 4168.
https://doi.org/10.3390/polym15204168
AMA Style
Zhang P, Xue S, Liu L, Wang J, Tatsumi H, Nishikawa H.
Influence of Isothermal Aging on Microstructure and Shear Property of Novel Epoxy Composite SAC305 Solder Joints. Polymers. 2023; 15(20):4168.
https://doi.org/10.3390/polym15204168
Chicago/Turabian Style
Zhang, Peng, Songbai Xue, Lu Liu, Jianhao Wang, Hiroaki Tatsumi, and Hiroshi Nishikawa.
2023. "Influence of Isothermal Aging on Microstructure and Shear Property of Novel Epoxy Composite SAC305 Solder Joints" Polymers 15, no. 20: 4168.
https://doi.org/10.3390/polym15204168
APA Style
Zhang, P., Xue, S., Liu, L., Wang, J., Tatsumi, H., & Nishikawa, H.
(2023). Influence of Isothermal Aging on Microstructure and Shear Property of Novel Epoxy Composite SAC305 Solder Joints. Polymers, 15(20), 4168.
https://doi.org/10.3390/polym15204168