Multilayer-Forming Behavior of Cr Nitrides and Carbides for Thermoreactive Deposition
Abstract
:1. Introduction
2. Experimental Details
3. Results and Discussion
3.1. Microstructure and Crystal Structure of the Coating Layer
3.1.1. Plasma-Nitrided Layer
3.1.2. Thermoreactive Deposited Layer
3.2. Formation Behavior of the Coating Layer with Respect to Temperature
3.3. Formation Behavior of Coating Layers with Respect to the TRD Time at 950 °C
3.4. Diffusion of Fe, Cr, C, and N During the Formation of Coating Layers
4. Conclusions
- (1)
- In the direct-TRD process, a coating layer of ~4 μm thickness was formed at 950 °C. Mostly, a Cr7C3 layer was formed and a small amount of CrN phase formed.
- (2)
- The PN-TRD process showed a faster coating layer formation rate than the direct-TRD process, and a coating layer of ~7 μm thickness was formed at 950 °C. When the TRD temperature was increased to 800 °C, the rich N supplied from the decomposition of Fe2-3N and the Cr supplied from the TRD powder reacted to produce the CrN layer with a thickness of 2 μm. The outermost surface layer consisted of a mixed (Cr7C3 + CrN) layer. Furthermore, a C-rich zone was formed under the CrN layer.
- (3)
- When the TRD temperature was increased to 950 °C, a 2 μm-thick Cr7C3 layer was formed between the (Cr7C3 + CrN) layer, and the CrN layer formed at the interface between the base material and the coating layer. The whole composite layer consisted of (Cr7C3 + CrN)–Cr7C3–CrN and had a thickness of ~7 μm.
- (4)
- For the 950 °C 6 h specimen, the coating layer had the same elemental distribution as that of the 3 h specimen and the thickness of 10–12 μm. However, the multilayer and interface were concretely filled without the formation of voids as the TRD time increased to 6 h at 950 °C. The TRD process on the pre-nitrided layer was successfully applied to produce a multilayer of (CrN + Cr7C3)–Cr7C3–CrN–(Cr, Fe)7C3 from the outermost layer.
Author Contributions
Acknowledgments
Conflicts of Interest
References
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Element | C | Cr | Mn | Si | P | S | Cu | Ni | Mo | Fe |
---|---|---|---|---|---|---|---|---|---|---|
wt % | 0.95 | 1.39 | 0.4 | 0.31 | 0.08 | 0.05 | 0.12 | 0.08 | 0.03 | Balanced |
Position | Fe (at %) | Cr (at %) | C (at %) | N (at %) |
---|---|---|---|---|
A | 26.8 | 42.7 | 30.5 | - |
B | 0.6 | 55.4 | 5.6 | 38.4 |
C | 39.7 | 29.3 | 31.0 | - |
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Park, K.; Kim, J.-H.; Kim, S.; Kang, N. Multilayer-Forming Behavior of Cr Nitrides and Carbides for Thermoreactive Deposition. Metals 2018, 8, 400. https://doi.org/10.3390/met8060400
Park K, Kim J-H, Kim S, Kang N. Multilayer-Forming Behavior of Cr Nitrides and Carbides for Thermoreactive Deposition. Metals. 2018; 8(6):400. https://doi.org/10.3390/met8060400
Chicago/Turabian StylePark, Kyeongmo, Jun-Ho Kim, Sunkwang Kim, and Namhyun Kang. 2018. "Multilayer-Forming Behavior of Cr Nitrides and Carbides for Thermoreactive Deposition" Metals 8, no. 6: 400. https://doi.org/10.3390/met8060400
APA StylePark, K., Kim, J. -H., Kim, S., & Kang, N. (2018). Multilayer-Forming Behavior of Cr Nitrides and Carbides for Thermoreactive Deposition. Metals, 8(6), 400. https://doi.org/10.3390/met8060400