Yun, J.; Kim, Y.; Gao, C.; Kim, M.; Lee, J.Y.; Lee, C.-H.; Bae, T.-H.; Lee, S.W.
Copper Hexacyanoferrate Thin Film Deposition and Its Application to a New Method for Diffusion Coefficient Measurement. Nanomaterials 2021, 11, 1860.
https://doi.org/10.3390/nano11071860
AMA Style
Yun J, Kim Y, Gao C, Kim M, Lee JY, Lee C-H, Bae T-H, Lee SW.
Copper Hexacyanoferrate Thin Film Deposition and Its Application to a New Method for Diffusion Coefficient Measurement. Nanomaterials. 2021; 11(7):1860.
https://doi.org/10.3390/nano11071860
Chicago/Turabian Style
Yun, Jeonghun, Yeongae Kim, Caitian Gao, Moobum Kim, Jae Yoon Lee, Chul-Ho Lee, Tae-Hyun Bae, and Seok Woo Lee.
2021. "Copper Hexacyanoferrate Thin Film Deposition and Its Application to a New Method for Diffusion Coefficient Measurement" Nanomaterials 11, no. 7: 1860.
https://doi.org/10.3390/nano11071860
APA Style
Yun, J., Kim, Y., Gao, C., Kim, M., Lee, J. Y., Lee, C. -H., Bae, T. -H., & Lee, S. W.
(2021). Copper Hexacyanoferrate Thin Film Deposition and Its Application to a New Method for Diffusion Coefficient Measurement. Nanomaterials, 11(7), 1860.
https://doi.org/10.3390/nano11071860