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Chips, Volume 3, Issue 1 (March 2024) – 3 articles

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20 pages, 5257 KiB  
Article
High-Efficiency Reconfigurable CMOS RF-to-DC Converter System for Ultra-Low-Power Wireless Sensor Nodes with Efficient MPPT Circuitry
by Roberto La Rosa, Danilo Demarchi, Sandro Carrara and Catherine Dehollain
Chips 2024, 3(1), 49-68; https://doi.org/10.3390/chips3010003 - 12 Mar 2024
Viewed by 1516
Abstract
This paper presents a novel CMOS RF-to-DC converter for ultra-low-power wireless sensor nodes powered by RF wireless power transfer. The proposed converter achieves 10% higher power conversion efficiency than a conventional rectifier, with only a 1% increase in power consumption. The system employs [...] Read more.
This paper presents a novel CMOS RF-to-DC converter for ultra-low-power wireless sensor nodes powered by RF wireless power transfer. The proposed converter achieves 10% higher power conversion efficiency than a conventional rectifier, with only a 1% increase in power consumption. The system employs a reconfigurable Dickson topology, operates on the unlicensed 868 MHz ISM band, and includes a built-in power-efficient MPPT system architecture. Experimental measurements show a maximum power conversion efficiency of 55% in the power range from −22 dBm to 0 dBm, with a power sensitivity of −22 dBm for a DC output voltage of 2.4 V. The proposed converter offers a promising solution for efficient wireless power transfer and energy harvesting in ultra-low-power wireless sensor nodes. Full article
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17 pages, 3093 KiB  
Article
Real-Time Compact Digital Processing Chain for the Detection and Sorting of Neural Spikes from Implanted Microelectrode Arrays
by Andrea Vittimberga, Riccardo Corelli and Giuseppe Scotti
Chips 2024, 3(1), 32-48; https://doi.org/10.3390/chips3010002 - 8 Feb 2024
Viewed by 1398
Abstract
Implantable microelectrodes arrays are used to record electrical signals from surrounding neurons and have led to incredible improvements in modern neuroscience research. Digital signals resulting from conditioning and the analog-to-digital conversion of neural spikes captured by microelectrodes arrays have to be elaborated in [...] Read more.
Implantable microelectrodes arrays are used to record electrical signals from surrounding neurons and have led to incredible improvements in modern neuroscience research. Digital signals resulting from conditioning and the analog-to-digital conversion of neural spikes captured by microelectrodes arrays have to be elaborated in a dedicated DSP core devoted to a real-time spike-sorting process for the classification phase based on the source neurons from which they were emitted. On-chip spike-sorting is also essential to achieve enough data reduction to allow for wireless transmission within the power constraints imposed on implantable devices. The design of such integrated circuits must meet stringent constraints related to ultra-low power density and the minimum silicon area, as well as several application requirements. The aim of this work is to present real-time hardware architecture able to perform all the spike-sorting tasks on chip while satisfying the aforementioned stringent requirements related to this type of application. The proposed solution has been coded in VHDL language and simulated in the Cadence Xcelium tool to verify the functional behavior of the digital processing chain. Then, a synthesis and place and route flow has been carried out to implement the proposed architecture in both a 130 nm and a FD-SOI 28 nm CMOS process, with a 200 MHz clock frequency target. Post-layout simulations in the Cadence Xcelium tool confirmed the proper operation up to a 200 MHz clock frequency. The area occupation and power consumption of the proposed detection and clustering module are 0.2659 mm2/ch, 7.16 μW/ch, 0.0168 mm2/ch, and 0.47 μW/ch for the 130 nm and 28 nm implementation, respectively. Full article
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31 pages, 11095 KiB  
Article
A 0.5-V Four-Stage Amplifier Using Cross-Feedforward Positive Feedback Frequency Compensation
by Feifan Gao and Pak Kwong Chan
Chips 2024, 3(1), 1-31; https://doi.org/10.3390/chips3010001 - 30 Dec 2023
Viewed by 1350
Abstract
This paper presents a low-voltage CMOS four-stage amplifier operating in the subthreshold region. The first design technique includes the cross-feedforward positive feedback frequency compensation (CFPFC) for obtaining better bandwidth efficiency in a low-voltage multi-stage amplifier. The second design technique incorporates both the bulk-drain-driven [...] Read more.
This paper presents a low-voltage CMOS four-stage amplifier operating in the subthreshold region. The first design technique includes the cross-feedforward positive feedback frequency compensation (CFPFC) for obtaining better bandwidth efficiency in a low-voltage multi-stage amplifier. The second design technique incorporates both the bulk-drain-driven input stage topology in conjunction with a low-voltage attenuator to permit operation at a low voltage, and improves the input common-mode range (ICMR). The proposed circuit is implemented using TSMC-40 nm process technology. It consumes 0.866 μW at a supply voltage of 0.5 V. With a capacitive load of 50 pF, this four-stage amplifier can achieve 84.59 dB in gain, 161.00 kHz in unity-gain bandwidth, 96 deg in phase margin, and 5.7 dB in gain margin whilst offering an input-referred noise of 213.63 nV/Hz @1 kHz, small-signal power-bandwidth FoMss of 9.31 (MHz∙pF/μW), and noise-power per bandwidth-based FoMnpb of 1.15 × 10−6 ((µV/Hz)·µW/Hz). Compared to the conventional bulk-driven input stage design technique, it offers improved multi-parameter performance metrics in terms of noise, power, and bandwidth at a compromising tradeoff on ICMR with respect to bulk-driven amplifier design. Compared with conventional gate-source input stage design, it offers improved ICMR. The amplifier is useful for low-voltage analog signal-processing applications. Full article
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