Carbon Nanotubes for Interconnects
A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Nanotechnology and Applied Nanosciences".
Deadline for manuscript submissions: closed (30 March 2018) | Viewed by 4338
Special Issue Editors
2. National Institute for Nuclear Physics (INFN), 00186 Roma, Italy
Interests: electromagnetic modeling
Special Issues, Collections and Topics in MDPI journals
Interests: field effect transistors; 1D/2D nanomaterials; biosensing
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Future nanoelectronics technology will be enabled by the effective possibility of complementing the nanoscale devices to the boards, and a major concern is given by the performance of interconnections in nanopackages.
When shrinking dimensions to the nanoscale, conventional materials and assessed architectural solutions are no longer adequate in terms of mechanical, electrical and thermal performance, and, therefore, efforts have been made to set new innovative architectural concepts and to study emerging materials.
Due to their outstanding physical properties, carbon-based materials are promising candidates for nanointerconnections: In particular, carbon nanotubes have sparked a great deal of interest because of their desirable properties, such as large electron mean free path, mechanical strength, high thermal conductivity, and large current carrying capacity. As a matter of fact, the interconnection innovation with novel materials, such as carbon nanotubes, have been the focus of extensive research in the last few years. This allowed moving from theoretical and modelling studies to the first real-world application of such new technologies, with the first examples of integration being between carbon nanotubes and CMOS technology.
Although a great deal of progress has been made, challenging problems still remain in the route to carbon nanotube interconnections, both in modeling (e.g., multiphysics effects, non-idealities, defects, variabilities, etc.) and in fabrication (chirality control, contacts, defects, etc.).
This Special Issue is aiming at providing the state-of-the-art on carbon-based interconnections, presenting the most relevant results in modelling, fabrication, and integration, and providing examples of the most recent applications for on-/off-chip interconnections.
Prof. Dr. Antonio MaffucciProf. Dr. Aida Todri-Sanial
Guest Editors
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Keywords
- Carbon Nanotubes
- Interconnects
- Modeling and Simulation
- Nanoelectronics
- Packaging
- Signal Integrity
- Power Integrity
- VLSI circuits
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