Tools and Languages for Object-Oriented Modeling and Simulation
A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Computer Science & Engineering".
Deadline for manuscript submissions: closed (21 March 2021) | Viewed by 18735
Special Issue Editor
Interests: software engineering, especially programming languages; high-level specification and modeling languages; programming and debugging tools and environments; parallel and multicore computing, compilers and compiler generators; tools and languages for object-oriented equation-based modeling and simulation; Modelica language
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
During the past two decades, object-oriented model-based design of complex cyberphysical systems (which mix physical dynamics with software and networks) has gained significant attention. Hybrid modeling languages based on equations, supporting both continuous-time and event-based aspects (e.g., Modelica, SysML, VHDL-AMS, and Simulink/ Simscape) enable high-level reuse and integrated modeling capabilities of both the physically surrounding system and software for embedded systems.
This Special Issue on Tools and Languages for object-oriented modeling and simulation solicits papers in this area, including but not limited to the following subtopics: object-oriented modeling and simulation languages and tools, cyberphysical and multidomain system modeling and development, Industry 4.0, hardware modeling (electrical, hydraulic, multi-body systems, etc.), integrated hardware–software modeling, metamodeling (Modelica, UML, SysML, etc.), methods and standards for co-modeling and co-simulation (e.g. FMI, SSP, DCP), design optimization and sensitivity analysis, numeric and symbolic methods for simulation, parallel and distributed simulation, verification and validation, requirement modeling, real-time and hardware-in-the-loop simulation, Internet of Things and embedded systems modeling, experiences of application of model-based product development, integration of machine learning models, and object-oriented systems modeling.
Prof. Dr. Peter Fritzson
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- object-oriented
- equation-based
- modeling
- simulation
- Industry 4.0
- optimization
- compilation
- requirement validation and verification
Benefits of Publishing in a Special Issue
- Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
- Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
- Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
- External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
- e-Book format: Special Issues with more than 10 articles can be published as dedicated e-books, ensuring wide and rapid dissemination.
Further information on MDPI's Special Issue polices can be found here.