Wood Adhesives, Bond Durability, and Bonding Theory
A special issue of Forests (ISSN 1999-4907). This special issue belongs to the section "Wood Science and Forest Products".
Deadline for manuscript submissions: closed (10 August 2021) | Viewed by 4319
Special Issue Editor
Interests: use of fundamental studies as applied to the performance of bonded wood products; emphasis on measuring properties of the bondline and after durability testing with moisture, heat including fire, force applied immediately or over time (creep); adhesive, coatings, and primer interactions with wood ; analysis techniques (mechanical, chemical, and microscopy) related to bonded wood performance; bio-based and synthetic adhesives; different wood species performance; unique bonded products, adhesives, or analysis methods; hypotheses
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Efficient use of our forest resources involves the use of improved adhesives, both renewable and non-renewable, to provide new bonded products at lower cost or with improved properties for use with laminated or binder adhesives. As uses of wood have moved from solid wood products to adhesively bonded products, this allows for greater use of wood in conventional and tall wood buildings. Products like cross laminated timber and mass plywood panels allow for taller buildings and greatly simplified construction processes. Accelerated tests are now used instead of end use tests to assess all forms of durability (creep, water, insect, biodegradation, heat, fire, etc.). All these along with normal strength tests and relationships of new products to older products that have demonstrated good performance are used in certification process. This leads to the need for a better understanding of bonded wood performance, especially in the bondline. This Special Issue will cover everything from load transfer from one wood piece to another through the adhesive to the interaction of the adhesive and wood at the nanoscale level. Papers can include reviews and recent unique research on bonded prospects from (a) mechanical, (b) chemical, (c) analytical, or (d) theoretical aspects.
Dr. Charles R. Frihart
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Forests is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- wood bonding
- adhesives
- synthetic
- bio-based
- strength
- durability
- analysis
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