Molecular Research of Nanocomposites: Design, Properties and Application
A special issue of International Journal of Molecular Sciences (ISSN 1422-0067). This special issue belongs to the section "Materials Science".
Deadline for manuscript submissions: 20 March 2025 | Viewed by 705
Special Issue Editor
Interests: design and construction of polymer-based nanocomposite and its application in ion selective separation and integrated circuit thermal management
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
With the rapid development of energy, electrical and electronic technologies, the rapid accumulation of heat in related equipment and components will inevitably result in a serious threat to their stabilities and reliabilities. Thermally conductive polymer nanocomposites offer new possibilities for replacing metal parts in several applications, including power electronics, electric motors and generators, heat exchangers, etc., thanks to the advantages of polymer such as light weight, corrosion resistance and ease of processing. Current interest in improving the thermal conductivity of polymers is focused on the selective addition of nanofillers with high thermal conductivity. High-performance thermal management materials for electronic devices are obtained by designing the structure of fillers in nanocomposites. The thermal conductivity of the composite material can be efficiently improved through the structural design of the thermal conductivity filler and the molecular structure design of the polymer substrate. Meanwhile, computational simulation (such as molecular dynamics simulation) is used to further analyze and verify the influence of structural design on the heat transfer mechanism. Synthesis, property characterization and application of materials should focus on biological or molecular research.
Dr. Bin Wu
Guest Editor
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Keywords
- interfacial thermal resistance
- polymer-based nanocomposites
- polymers
- thermal conductivity
- thermal-interface materials
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