3D Printing of Functional Components and Devices for Smart Systems

A special issue of Machines (ISSN 2075-1702). This special issue belongs to the section "Advanced Manufacturing".

Deadline for manuscript submissions: 30 April 2025 | Viewed by 194

Special Issue Editors

Department of Mechanical Engineering, San Diego State University, San Diego, CA 92182, USA
Interests: bioinspired 3D printing; additive manufacturing; micro- and nano-fabrication; multifunctional composites; energy harvesting and wearable sensors; surface/interface structures
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Guest Editor
Department of Mechanical and Aerospace Engineering, Arizona State University, Tempe, AZ 85283, USA
Interests: biomimetic additive manufacturing (3D printing); bioinspired material and structure design; physical field assisted vat photopolymerization; multimaterial and multiscale manufacturing of metals, ceramics, and composites
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Guest Editor
Department of Industrial and Systems Engineering, Kate Gleason College of Engineering, Rochester Institute of Technology, Rochester, NY, USA
Interests: metal additive manufacturing; sustainable circular manufacturing; data informed smart manufacturing; biomanufacturing

Special Issue Information

Dear Colleagues,

3D printing of functional components and devices is an innovative field that merges advanced manufacturing technologies with the principles and designs of future devices for various applications. This field represents a cutting-edge intersection of manufacturing, mechanics, biology, chemistry, physics, and material science, enabling researchers and engineers to create innovative solutions addressing a wide range of challenges, from medical treatments to fundamental engineering problems.

This Special Issue aims to collate research on recent developments and emerging trends in 3D printing of functional components and devices, focusing on advancements in material design, novel 3D printing technologies, and various applications. Topics covered will include, but are not limited to, the following:

  • 3D printed functional components with scanning and reconstruction of multiscale structures;
  • Mechanically reinforced structures and metal structures;
  • Wearable sensors and interfacial surfaces;
  • Microfluidics and optical devices;
  • Biomedical devices and robotics;
  • Energy generation, conversion, and storage.

Dr. Yang Yang
Dr. Xiangjia Li
Dr. Zipeng Guo
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Machines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • 3D printing
  • multifunctional material
  • robotics
  • microfluids
  • biomedical implants
  • wearable sensors
  • energy devices

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Published Papers

This special issue is now open for submission.
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