Modeling and Simulations of Smart Materials
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Smart Materials".
Deadline for manuscript submissions: closed (10 September 2022) | Viewed by 4634
Special Issue Editors
Interests: composite materials; FEM; additive manufacturing; metallic structures
Special Issues, Collections and Topics in MDPI journals
Interests: advanced composites; mechanical and thermo-mechanical performance; nanocomposites; manufacturing processes; residual stresses; cure kinetics; thermal stability; impact; fracture tooughness
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Research on materials able to autonomously change their properties in response to an external simulation is considered a promising field. Therefore, this Special Issue on Modeling and Simulations of Smart Materials aims to discuss state-of-the-art research on smart materials focusing, in particular, on their modeling and simulations, collecting contributions from universities, laboratories, research institutes, and industries.
This Special Issue welcomes contributions from all researchers working on smart materials, covering different topics ranging from their definition to the study, from an experimental and numerical point of view, of their behavior. Contributions on smart materials applications (smart actuators/structures) are also welcome.
The Special Issue will cover but not be limited to the following topics:
- Smart materials;
- Properties and characterization of smart materials;
- Materials selection of smart materials;
- Shape memory alloys (SMA);
- Magnetic shape memory alloys;
- Piezoelectric materials;
- Self-healing materials;
- Modelling and simulation of smart materials;
- Design for manufacture of smart materials;
- Smart actuators;
- Smart structures.
It is my pleasure to invite you to submit a manuscript for this Special Issue. Full papers, communications, and reviews are welcome.
Dr. Andrea Sellitto
Dr. Mauro Zarrelli
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- Smart materials
- Shape memory alloys (SMA)
- Magnetic shape memory alloys
- Piezoelectric materials
- Self-healing materials
- Modelling and simulation
- Design
- Smart actuators
- Smart structures
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