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Recent Advances in Ultrafast Laser Precise Manufacturing

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Manufacturing Processes and Systems".

Deadline for manuscript submissions: 20 September 2025 | Viewed by 464

Special Issue Editor


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Guest Editor
School of Mechatronic Engineering and Automation, Shanghai University, Shanghai 200444, China
Interests: ultrafast laser processing; laser welding; laser cleaning; laser cladding; laser cutting; laser intelligent manufacturing

Special Issue Information

Dear Colleagues,

Ultrafast laser technology, such as femtosecond lasers and picosecond lasers, has quickly become a flexible tool for processing brittle and hard materials and complex microcomponents, which are widely used in and developed for medical, aerospace, semiconductor applications and so on. However, the interaction mechanisms between an ultrafast laser and brittle and hard materials are still unclear. Meanwhile, the ultrafast laser processing of these materials is still a challenge. Additionally, highly efficient and high-precision manufacturing using ultrafast lasers must be developed. This Special Issue is focused on the common challenges and current status of the ultrafast laser precise manufacturing of brittle and hard materials, such as nickel-based superalloys, thermal barrier ceramics, diamond, silicon dioxide, and silicon carbide composites. An in situ pump detection system can be used to analyze the evolution of laser-induced plasma and the absorption process of ultrafast laser energy. Based on time-dependent density functional theory, molecular dynamics theory, and continuum theory, theoretical models of ultrafast laser machining could be established to carry out dynamic simulations of ultrafast laser processing. Artificial intelligence technologies, such as neural networks, machine learning, deep learning, and reinforcement learning, have assisted ultrafast laser processing in improving manufacturing efficiency and quality.

Dr. Jiecai Feng
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • brittle and hard materials
  • ultrafast laser processing
  • model
  • artificial intelligence
  • precise manufacturing

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Published Papers (1 paper)

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Research

19 pages, 8563 KiB  
Article
Picosecond Laser Direct Writing of Micro-Nano Structures on Flexible Thin Film for X-Band Transmittance Function
by Jiecai Feng, Jin Zhou, Cuilian Xu, Bingdong Yang, Ze Tian, Hongfei Liu, Yilian Zhang, Zhenghao Sun, Xiaohai Peng and Yingzhong Tian
Materials 2025, 18(2), 403; https://doi.org/10.3390/ma18020403 - 16 Jan 2025
Viewed by 382
Abstract
Recently, ultrafast laser direct writing has become an effective method for preparing flexible films with micro-nano structures. However, effective control of laser parameters to obtain acceptable micro-nano structures and the effect of micro-nano structure sizes on function of the film remain challenges. Additionally, [...] Read more.
Recently, ultrafast laser direct writing has become an effective method for preparing flexible films with micro-nano structures. However, effective control of laser parameters to obtain acceptable micro-nano structures and the effect of micro-nano structure sizes on function of the film remain challenges. Additionally, flexible films with high X-band transmittance are urgently required in aerospace and other fields. In this work, we evaluate the feasibility of applying picosecond laser direct writing for fabricating micro-nano structures on the surface of flexible thin film and the relationship between the size of square columnar micro-nano structures and the transmittance of the flexible thin film. The results show that an array of square columnar micro-nano structures was achieved by picosecond laser direct writing on the surface of flexible thin film (Au-SiO2-PI) with a thickness of 50 µm. Additionally, excellent micro-nano structures morphology of the square columnar arrays without burning through or destroying were obtained by laser direct writing with a pulse power and frequency of 2 W and 100 KHz, respectively. The results also show that the X-band transmittance was effected by the characteristic of the square columnar array on the surface of the flexible thin film. The X-band transmittance was significantly increased by decreasing the length of the square column on the surface of the flexible thin film. The X-band transmittance was slightly increased by decreasing the width of the groove of the square column on the surface of the flexible thin film. Full article
(This article belongs to the Special Issue Recent Advances in Ultrafast Laser Precise Manufacturing)
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Planned Papers

The below list represents only planned manuscripts. Some of these manuscripts have not been received by the Editorial Office yet. Papers submitted to MDPI journals are subject to peer-review.

Dear Colleagues,

Ultrafast laser technology, such as femtosecond lasers and picosecond lasers, has quickly become a flexible tool for processing brittle and hard materials and complex microcomponents, which are widely used in and developed for medical, aerospace, semiconductor applications and so on. However, the interaction mechanisms between an ultrafast laser and brittle and hard materials are still unclear. Meanwhile, the ultrafast laser processing of these materials is still a challenge. Additionally, highly efficient and high-precision manufacturing using ultrafast lasers must be developed. This Special Issue is focused on the common challenges and current status of the ultrafast laser precise manufacturing of brittle and hard materials, such as nickel-based superalloys, thermal barrier ceramics, diamond, silicon dioxide, and silicon carbide composites. An in situ pump detection system can be used to analyze the evolution of laser-induced plasma and the absorption process of ultrafast laser energy. Based on time-dependent density functional theory, molecular dynamics theory, and continuum theory, theoretical models of ultrafast laser machining could be established to carry out dynamic simulations of ultrafast laser processing. Artificial intelligence technologies, such as neural networks, machine learning, deep learning, and reinforcement learning, have assisted ultrafast laser processing in improving manufacturing efficiency and quality.

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