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Microscale Heat and Mass Transfer: Materials, Process, and Applications

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Materials Physics".

Deadline for manuscript submissions: closed (20 February 2023) | Viewed by 2369

Special Issue Editor


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Guest Editor
School of Mechanical Engineering and Automation, Harbin Institute of Technology, Shenzhen, China
Interests: fabrication of functional structures and devices; microscale manufacturing and forming; micromilling; laser processing; microscale heat and mass transfer; microchannel heat sinks; heat pipes; cooling
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Special Issue Information

Dear Colleagues,

Rapid increases in heat fluxes within small areas in microelectronic, defense, energy, solar and medical components have prompted an urgent need for microscale heat and mass transfer. These areas have attracted widespread research interest in the last three to four decades. Nevertheless, underlying problems in the selection, design and fabrication of materials pose severe challenges for practical applications of microscale heat and mass transfer in high heat flux dissipations. To address the above mentioned issue, numerous efforts have been made in terms of the design and fabrication of microscale heat and mass transfer devices, and significant enhancement in microscale heat and mass transfer has been achieved. This Special Issue aims to provide a collection of the latest research and findings in the selection, design and fabrication of materials for use in microscale heat and mass transfer.

Dr. Daxiang Deng
Guest Editor

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Keywords

  • microscale heat and mass transfer
  • fabrication
  • enhancement

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Published Papers (1 paper)

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Research

14 pages, 5699 KiB  
Article
Constructing Superhydrophobic Surface on Copper Substrate with Dealloying-Forming and Solution-Immersion Method
by Hui Li, Yannan Sun, Zhe Wang and Shiyi Wang
Materials 2022, 15(14), 4816; https://doi.org/10.3390/ma15144816 - 10 Jul 2022
Cited by 7 | Viewed by 1827
Abstract
In this study, a superhydrophobic surface was constructed on a copper substrate through dealloying-forming and solution-immersion methods. The dealloying process for nanostructures on a copper surface involved the electrodeposition of zinc atoms, and the thermal alloying and chemical dealloying of zinc atoms. Then, [...] Read more.
In this study, a superhydrophobic surface was constructed on a copper substrate through dealloying-forming and solution-immersion methods. The dealloying process for nanostructures on a copper surface involved the electrodeposition of zinc atoms, and the thermal alloying and chemical dealloying of zinc atoms. Then, a dealloyed copper surface was subsequently modified with low-surface-energy copper stearate to produce a superhydrophobic surface. Scanning electron microscopy, X-ray diffractometry, and Fourier transform infrared spectrometry were employed to characterize the morphological features and composition components of the surface in the fabrication process. The static contact angles of the copper surfaces were compared and evaluated based on various fabrication parameters, including electric current density, corrosive solution concentration, and nanostructures. The results indicated that a leaf-like copper stearate could be constructed through immersing a dealloyed copper plate into a 0.005 mol/L ethanol solution of stearic acid for 5 min. Nanostructures provided more attachment areas on the copper surface to facilitate the formation of copper stearate. The resulting as-prepared surface presented excellent superhydrophobic properties with a contact angle of over 156.5°, and showed the potential properties of non-sticking, self-cleaning, anti-corrosion, and stability. This study provides an efficient approach to fabricate superhydrophobic surfaces for engineering copper metals. Full article
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