Power Semiconductor Devices and Applications, 3rd Edition

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D1: Semiconductor Devices".

Deadline for manuscript submissions: 28 February 2025 | Viewed by 1351

Special Issue Editor


E-Mail Website
Guest Editor
Chongqing Engineering Laboratory of High Performance Integrated Circuits, School of Microelectronics and Communication Engineering, Chongqing University, Chongqing 400044, China
Interests: design, reliability, and application of power semiconductor devices; ICs
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Power semiconductor devices have contributed to the rise of information technology, since they can be widely used in central processing units, graphic accelerators, digital sound processing, etc. There is a significant demand for power devices that are capable of handling operating voltages from grids or another high-voltage supply. Many power semiconductor devices have been proposed in recent decades, with the majority of technological developments being focused on silicon materials. Wide-gap semiconductors are currently represented by SiCs, while GaN and other compound semiconductor materials have received increasing attention for electric power applications due to their excellent electrical performance. Although power semiconductor devices based on silicon and other semiconductor materials have seen significant advances, there are still many problems to be solved in the field of power electronics.

This Special Issue highlights the advances in the design, processing, reliability, and application of power semiconductor devices based on silicon or other semiconductor materials.

Dr. Shengdong Hu
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • high- and low-voltage silicon-based devices
  • GaN and compound semiconductor devices
  • SiC- and other-material-based devices
  • power IC technology

Benefits of Publishing in a Special Issue

  • Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
  • Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
  • Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
  • External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
  • e-Book format: Special Issues with more than 10 articles can be published as dedicated e-books, ensuring wide and rapid dissemination.

Further information on MDPI's Special Issue polices can be found here.

Related Special Issues

Published Papers (1 paper)

Order results
Result details
Select all
Export citation of selected articles as:

Research

10 pages, 3465 KiB  
Article
A Study on the Dynamic Switching Characteristics of p-GaN HEMT Power Devices
by Chen Fan, Haitao Zhang, Huipeng Liu, Xiaofei Pan, Su Yan, Hongliang Chen, Wei Guo, Lin Cai and Shuhua Wei
Micromachines 2024, 15(8), 993; https://doi.org/10.3390/mi15080993 - 31 Jul 2024
Viewed by 1115
Abstract
This study employs an innovative dynamic switching test system to investigate the dynamic switching characteristics of three p-GaN HEMT devices. The dynamic switching characteristics are different from the previous research on the dynamic resistance characteristics of GaN devices, and the stability of GaN [...] Read more.
This study employs an innovative dynamic switching test system to investigate the dynamic switching characteristics of three p-GaN HEMT devices. The dynamic switching characteristics are different from the previous research on the dynamic resistance characteristics of GaN devices, and the stability of GaN devices can be analyzed from the perspective of switching characteristics. Based on the theory of dynamic changes in threshold opening voltage and capacitance caused by electrical stress, the mechanism of dynamic switching characteristics of GaN HEMT devices is studied and analyzed in detail. The test results have shown that electrical stress induces trap ionization within the device, resulting in fluctuations in electric potential and ultimately leading to alterations in two critical factors of the dynamic switching characteristics of GaN HEMT devices, the parasitic capacitance and the threshold voltage. The dynamic changes in capacitance before and after electrical stress vary among devices, resulting in different dynamic switching characteristics. The test system is capable of extracting the switching waveform for visual comparison and quantitatively calculating the changes in switching parameters before and after electrical stressing. This test provides a prediction for the drift of switch parameters, offering pre-guidance for the robustness of the optimized application scheme. Full article
(This article belongs to the Special Issue Power Semiconductor Devices and Applications, 3rd Edition)
Show Figures

Figure 1

Back to TopTop