Advanced Polymeric Insulation Materials for Electrical Equipment
A special issue of Polymers (ISSN 2073-4360). This special issue belongs to the section "Polymer Analysis and Characterization".
Deadline for manuscript submissions: closed (15 May 2023) | Viewed by 14986
Special Issue Editors
Interests: cold-cure resins; composites; dielectric responses; epoxides; high voltage; inorganic particles; insulation materials; material characterization; polymer modifications; nanocomposites; synthesis
Interests: EIS aging; composites; cables; high-voltage EIS; EIS lifetime prediction; long-term stability; reliability; aging modeling; biodegradable EIS; polarizations
Special Issue Information
Dear Colleagues,
Polymers have been an object of interest in material research and development since the beginning of the last century. During this time, the requirements of a global society have been reflected in this area hand in hand with the growing possibilities of technical progress. Due to the significant expansion in the use of newly developed polymer-based insulation materials, it is necessary to understand and accurately describe the internal phenomena and their most important external manifestations, as only based on thorough laboratory characterization is it possible to estimate the properties for their future commercial applications. This fact is valid even at this time, when our attention has been focused on the increasing reliability of electrical or electronic devices, the possibility of their higher load capacity, and, last but not least, their improved environmental friendliness.
This Special Issue focuses on advanced polymeric materials for electrical and electronic equipment, which in some way contribute to the abovementioned requirements. For example, submitted contributions can be focused on filled polymeric materials (particulate, tubular, or fibrous structures) with advanced material properties, self-healing polymeric materials, materials with fire-retardant properties, or the application of solvent-free resins in different areas. Articles dealing with the nanostructured polymers are preferred, but if the topic is interesting enough, articles focused on micro- and macrocomposites may also be submitted.
There will be space for the description of material synthesis and structural modifications, but also for the description of behavior from the point of view of experimental research, e.g., material properties (electrical, mechanical, thermal, etc.) or material degradation (temperature, voltage, UV radiation, etc.). Articles dealing with both phenomenological and structural approaches are welcomed.
Considering your prominent contributions to this field, we would like to cordially invite you to submit an article to this Special Issue, which will publish full research papers, communications, and review articles.
Dr. Jaroslav Hornak
Prof. Dr. Pavel Trnka
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Polymers is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2700 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- Charge accumulation
- Dielectric responses
- Environmentally friendly polymers
- Fire retardancy
- Long-term exposure
- Nanostructures
- Polymer composites
- Polymer degradation
- Self-healing polymer insulation
- Structural modifications
- Solvent-free resins
- Thermal conductivity
- UV stabilization
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