Thermal Characterization and Applications of Polymer Composites
A special issue of Polymers (ISSN 2073-4360). This special issue belongs to the section "Polymer Composites and Nanocomposites".
Deadline for manuscript submissions: closed (31 December 2024) | Viewed by 13836
Special Issue Editors
Interests: photopolymerization; photocurable coatings, kinetics of polymerization; SLA/DLP stereolithography; nanocomposites; hybrid polymeric materials; biomaterials; solid-state electrolyte; fillers; thermal properties
Interests: innovative machines and devices for the agri-food and forestry sector; DEM and FEM simulation studies; artificial intelligence; neural networks; machine learning; computer image analysis; SLA/DLP; mechanical and thermal properties; application of coatings in devices and machines; photopolymerization; photocurable coatings
Special Issues, Collections and Topics in MDPI journals
Interests: metal and non-metal nanostructures; nanostructures stabilized by biopolymers; properties and application of nanostructures; polymer fillers
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Thermal analysis provides a powerful tool for researchers to determine both unknown and reproducible properties of polymer composite materials. Thermal analysis is a branch of science for studying the thermophysical and kinetic properties of materials with temperature. Moreover, the relevant thermal properties of materials are related to energy transport and thermal transitions. Heat-conducting polymer composites are of particular interest. To improve the thermal conductivity of polymer composites, conducting fillers with relatively high thermal conductivity such as metal powders and carbon-based material such as graphite or inorganic particles may be used.
The purpose of this Special Issue is to collect high-quality articles in the fields of thermal properties of polymer (nano)composites. Potential topics include but are not limited to the application of thermoanalytical methods in the study of polymer composites with a special focus on thermogravimetry, differential scanning calorimetry, and thermomechanical analysis or thermal conductivity analysis.
It is our pleasure to invite you to submit a manuscript to this Special Issue. Full papers, communications, and reviews are all welcome.
We look forward to receiving your contributions.
Dr. Mariola Robakowska
Dr. Gierz Lukasz
Dr. Anna Modrzejewska-Sikorska
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Polymers is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2700 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- thermal conductivity analysis
- thermal properties
- thermogravimetry
- differential thermal analysis
- polymer composite
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