Fabrication and Machining Technologies for Sensors
A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Physical Sensors".
Deadline for manuscript submissions: closed (19 February 2021) | Viewed by 11001
Special Issue Editor
Interests: precision laser micromachining of materials; ultrashort pulse; diode-pumped and solid-state lasers and their applications to micro-devices and products; laser micro-processing of materials; photonic band gap materials; porous semiconductors; machine and process dynamics; micro-device/sensor fabrication and laser joining of materials.
Special Issue Information
Dear Colleagues,
It is my pleasure to invite you to submit your technological contributions and manuscripts to this Special Issue, titled “Fabrication and Machining Technologies for Sensors”.
The progress in micro/nano technologies and their applications in the development of sensors is breathtaking in various manufacturing sectors. In particular, the continuous progress in machining of diverse materials, availability of newer fabrication technology tools, and diversity in the design and engineering, data acquisition, packaging, and control systems enable advancements in the state-of-the-art knowledge and sensor technologies.
This Special Issue aims to focus on the emerging advances in novel machining techniques, processes, and fabrication technologies for the development of sensors along with relevant electronics, packaging, and control systems. In addition, applications of sensors for evolving manufacturing fields are also welcome.
Topics include, but are not limited to:
- sensor development processes, fabrication, and design architecture;
- laser-based fabrication technologies, joining of materials, microwelding, microforming, and textured/structured and engineered surfaces;
- machining of materials: microfabrication, laser micromachining, micromilling, diamond cutting, nanomachining, 3D printing, laser trimming, laser ablation;
- new techniques and technologies for sensors for/in optics and photonics;
- fabrication requirements for sensors for biomedical devices;
- applications of ultrafast lasers for material processing and sensor packaging technologies;
- sensing techniques and measurements and data acquisition and processing;
- Manufacturing methods and tools: optical, electro-chemical, thin films, electronic;
- thin and thick film machining, diamond-like hard materials and coatings for sensor fabrication;
- multi-functional sensors, sensorial surfaces, connectivity;
- low-cost sensor developments: material considerations, productivity, fabrication.
Dr. Suwas Nikumb
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- micromachining
- laser materials processing
- thin films
- laser ablation
- machining of materials
- sensor fabrication
- joining of materials
- microdevices
- ultrafast laser applications to sensors
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