Shen, C.; Hai, Z.; Zhao, C.; Zhang, J.; Evans, J.L.; Bozack, M.J.; Suhling, J.C.
Packaging Reliability Effect of ENIG and ENEPIG Surface Finishes in Board Level Thermal Test under Long-Term Aging and Cycling. Materials 2017, 10, 451.
https://doi.org/10.3390/ma10050451
AMA Style
Shen C, Hai Z, Zhao C, Zhang J, Evans JL, Bozack MJ, Suhling JC.
Packaging Reliability Effect of ENIG and ENEPIG Surface Finishes in Board Level Thermal Test under Long-Term Aging and Cycling. Materials. 2017; 10(5):451.
https://doi.org/10.3390/ma10050451
Chicago/Turabian Style
Shen, Chaobo, Zhou Hai, Cong Zhao, Jiawei Zhang, John L. Evans, Michael J. Bozack, and Jeffrey C. Suhling.
2017. "Packaging Reliability Effect of ENIG and ENEPIG Surface Finishes in Board Level Thermal Test under Long-Term Aging and Cycling" Materials 10, no. 5: 451.
https://doi.org/10.3390/ma10050451
APA Style
Shen, C., Hai, Z., Zhao, C., Zhang, J., Evans, J. L., Bozack, M. J., & Suhling, J. C.
(2017). Packaging Reliability Effect of ENIG and ENEPIG Surface Finishes in Board Level Thermal Test under Long-Term Aging and Cycling. Materials, 10(5), 451.
https://doi.org/10.3390/ma10050451