Zhang, B.; Chen, C.; He, J.; Hou, J.; Chai, L.; Lv, Y.
Spark Plasma Diffusion Bonding of TiAl/Ti2AlNb with Ti as Interlayer. Materials 2020, 13, 3300.
https://doi.org/10.3390/ma13153300
AMA Style
Zhang B, Chen C, He J, Hou J, Chai L, Lv Y.
Spark Plasma Diffusion Bonding of TiAl/Ti2AlNb with Ti as Interlayer. Materials. 2020; 13(15):3300.
https://doi.org/10.3390/ma13153300
Chicago/Turabian Style
Zhang, Boxian, Chunhuan Chen, Jianchao He, Jinbao Hou, Lu Chai, and Yanlong Lv.
2020. "Spark Plasma Diffusion Bonding of TiAl/Ti2AlNb with Ti as Interlayer" Materials 13, no. 15: 3300.
https://doi.org/10.3390/ma13153300
APA Style
Zhang, B., Chen, C., He, J., Hou, J., Chai, L., & Lv, Y.
(2020). Spark Plasma Diffusion Bonding of TiAl/Ti2AlNb with Ti as Interlayer. Materials, 13(15), 3300.
https://doi.org/10.3390/ma13153300