Cheng, Y.-L.; Wang, K.-H.; Lee, C.-Y.; Chen, G.-S.; Fang, J.-S.
Comparison of CoW/SiO2 and CoB/SiO2 Interconnects from the Perspective of Electrical and Reliability Characteristics. Materials 2023, 16, 1452.
https://doi.org/10.3390/ma16041452
AMA Style
Cheng Y-L, Wang K-H, Lee C-Y, Chen G-S, Fang J-S.
Comparison of CoW/SiO2 and CoB/SiO2 Interconnects from the Perspective of Electrical and Reliability Characteristics. Materials. 2023; 16(4):1452.
https://doi.org/10.3390/ma16041452
Chicago/Turabian Style
Cheng, Yi-Lung, Kai-Hsieh Wang, Chih-Yen Lee, Giin-Shan Chen, and Jau-Shiung Fang.
2023. "Comparison of CoW/SiO2 and CoB/SiO2 Interconnects from the Perspective of Electrical and Reliability Characteristics" Materials 16, no. 4: 1452.
https://doi.org/10.3390/ma16041452
APA Style
Cheng, Y. -L., Wang, K. -H., Lee, C. -Y., Chen, G. -S., & Fang, J. -S.
(2023). Comparison of CoW/SiO2 and CoB/SiO2 Interconnects from the Perspective of Electrical and Reliability Characteristics. Materials, 16(4), 1452.
https://doi.org/10.3390/ma16041452