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Journal: Materials, 2023
Volume: 16
Number: 1452

Article: Comparison of CoW/SiO2 and CoB/SiO2 Interconnects from the Perspective of Electrical and Reliability Characteristics
Authors: by Yi-Lung Cheng, Kai-Hsieh Wang, Chih-Yen Lee, Giin-Shan Chen and Jau-Shiung Fang
Link: https://www.mdpi.com/1996-1944/16/4/1452

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