Order Article Reprints

Seong I, Lee J, Kim S, Lee Y, Cho C, Lee J, Jeong W, You Y, You S. Characterization of an Etch Profile at a Wafer Edge in Capacitively Coupled Plasma. Nanomaterials. 2022; 12(22):3963. https://doi.org/10.3390/nano12223963

Seong, Inho, Jinho Lee, Sijun Kim, Youngseok Lee, Chulhee Cho, Jangjae Lee, Wonnyoung Jeong, Yebin You, and Shinjae You. 2022. "Characterization of an Etch Profile at a Wafer Edge in Capacitively Coupled Plasma" Nanomaterials 12, no. 22: 3963. https://doi.org/10.3390/nano12223963

Seong, I., Lee, J., Kim, S., Lee, Y., Cho, C., Lee, J., Jeong, W., You, Y., & You, S. (2022). Characterization of an Etch Profile at a Wafer Edge in Capacitively Coupled Plasma. Nanomaterials, 12(22), 3963. https://doi.org/10.3390/nano12223963